SS-1189-002.pdf - 第9页

7 SS-1189 6. Correction Method for PCB Location PEC Recognition 7. Conditions of PCB before Placement (Regulation of Component Height) Upper Level : Max. 12.7 m m Lower Level : Max. 30 mm 8. Applicable Components (1) App…

SS-1189

3. Specifications

3.1 Mechanical Specifications

3.1.1 Mechanical Construction

Fig. 6

3.1.2 Mechanical Specifications

1. Model Name GXH-3

2. Throughput 95,000 CPH

Note : The PCB transition time under optimum conditions is excluded.

3. PCB Transfer

Time

Approx. 2.5 seconds (PCB Length: 155 mm or less) (under optimum condition)

4. PCB Flow

Direction and

Transfer Reference

PCB Flow Direction : From Left to Right ("From Right to Left" is optional.)

Transfer Reference : Front Side of Machine or Rear Side of Machine

5. Applicable PCB

Size: 50 × 50 to 460 × 460 mm (Four Corners : R1 to R1.5 mm)

Thickness : 0.5 to 5.0 mm

Warpage : 0.2 mm or less per 50 mm Max. ± 1 mm

Mass : Max. 1.5 kg (completed PCB)

Material : Glass Epoxy

Ceramic (Option)

Note : Depending on the material, shape, warpage, mass, etc., of the PCB, it is

required to make a placement test to confirm that the components can be

placed normally.

0305-002 Tg0846-WO-SP

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P.E.C Camera

PCB Transfer

Conveyor

Component

Recognition Camera

Feeder

X-axis

Y-axis

Head

Pick-Up Position

SS-1189

6. Correction Method

for PCB Location

PEC Recognition

7. Conditions of PCB

before Placement

(Regulation of

Component Height)

Upper Level : Max. 12.7 mm

Lower Level : Max. 30 mm

8. Applicable

Components

(1) Applicable Components

Size : 0.6 × 0.3 to 44 × 44 mm or less

Thickness

: Max. 12.7 mm

Lead Pitch : 0.4 mm pitch or more

Lead Width : Min. 0.15 mm

Lead Length : Min. 0.20 mm

Note : Some components cannot be used due to the mechanical characteristics,

shapes, etc.

(Example of Unsuitable Components)

When there is a protruding portion on the upper surface of a component, the

lower surface of the vacuum nozzle may be worn out, causing an error during

the teaching operation through component recognition lighting.

Be sure to check the shape of the components to be used.

Applicable Components for Reference

• Cylindrical Components

Resistors, Capacitors, Diodes,

and other similar-shaped components,

• Square Components

Resistors, Film Capacitors, Coils,

Chip Ceramic Filters, and other similar-shaped components

• Deform Components

Semi-Fixed Variable Resistors, Trimmer Capacitors

and other similar-shaped components

• Ics

Mini-Flat ICs, Plastic Chip Carrier with Leads,

and other similar-shaped components

• Leaded Components

Mini-Mold Transistors, Mini-Power Transistors, Filters, LEDs, Diodes,

Coils, Tantalum Capacitors, Aluminum Electrolytic Capacitors,

and other similar-shaped components

• Connectors

Connectors for FFC / FPC, PCB-to-PCB Connectors,

Wire-to-PCB Connectors, PLCC Sockets,

and other similar-shaped components

• BGA/CSP Components (Option)

BGA, CSP, LGA, and other similar-shaped components

Size : Max. 44 × 44 mm

Ball Diameter : Min. φ 0.3 mm

Ball Pitch : 0.5 mm pitch or more

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SS-1189

(2) Packaged Posture Standards

Taped Components

JIS or its equivalent

• Paper Tapes (Width : 8 mm)

• Embossed Tapes (Width : 8 to 72 mm)

• Reel Outer Diameter : φ 382 mm or less.

Note : Some taping sizes are limited.

Some taped components cannot be used due to the mechanical

characteristics.

Stick Components

• Carrier Stick : Width 8 to 60 mm × Thickness 3 to 16 mm

× Length 400 to 600 mm (CS-G100 used)

Tray Components

• Tray : 100 × 100 to 323 × 136 mm (FP-G100 and FP-G300 used)

100 × 100 to 330 × 230 mm (FP-G200 used)

9. Placement Heads Equipped with 4 heads/4 beams

Vacuum Nozzle: Max. 12 nozzles on each head

Ref. : Maximum Number of Component Picks:

Component Size 5 × 4 mm or less 12

to 10 × 10 mm or less 6

to 12 × 12 mm or less 4

to 20 × 20 mm or less 2

to 44 × 44 mm or less 1

Note : There are two types of nozzles-one for high-speed component placement

and the other for middle-size odd-shaped component placement.

Although the nozzles for high-speed and middle-size odd-shaped

components can be used together, the nozzles for middle-size

odd-shaped components must be attached, leaving one out of every two

pitches empty due to the location of the diffusion plates.

Nozzle for High-Speed Component Placement :

The diameter is φ6 mm or less. This nozzle is used for 0603

components (Size : 0603 to 20

× 20 mm).

Nozzle for Middle-Size odd-shaped Component Placement :

The diameter is φ12 mm or less. The nozzle end is processed

according to the applicable components.

The nozzle can be used for the component size of up to 44 × 44

mm.

10. Number of

Stocked Nozzles

Max. 12 nozzles can be stored for each head.

Notes : (a) When some nozzle stockers are mounted additionally (optional

specifications), up to 48 nozzles can be stored for each head.

(b) When the vacuum nozzles for the middle-size odd-shaped

components are used, the nozzle stockers (a housing in which eight

nozzles can be stored) is required for the nozzles.

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