SS-1189-002.pdf - 第8页

6 SS-1189 3. Specifications 3.1 Mechanical Specifications 3.1.1 Mechanical Construction Fig. 6 3.1.2 Mechanical Specifications 1. Model Name GXH-3 2. Throughput 95,000 CPH Note : The PCB transition tim e under optimum co…

SS-1189

• Pick-Up and Placement Up/Down-Axis (L-Axis) Control Function

• Pick-Up Position (X/Y) Correction Control Function

• Pocket outline recognition

• Two-stage placement Z-Axis speed reduction

• Nozzle existence check before pick-up

Options

• P.C.B height feed back function

• Soft mount nozzle

• Unit PCB B.B.R. Function

• Placement Coordinates Teaching Function

• Component Library Teaching Function

• Application for BGA/CSP

• Splicing

• Advance Notice and Instruction of Splicing

• Multiple Languages (Mandarin Chinese, Korean)

• Network Terminal

Programming Software

Pattern Program Optimization Software

Pattern Program Conversion Software (Our Products and Machines of

Other Brands)

CAD Conversion Software

Multi-Pattern Program Line Balance Software

Production Manager Software

• ACV System

Application Multi-tray (FP-G100,FP-G200)

P.C.B Traceability

• Off-line component library create system

• Application for large-sized board (Max. 610×460 mm)

• 2D bar code NC program change function

• High-resolution component recognition camera

• Flux dipping unit (Auto reload type / Manual reload type)

• Coplanarity check function

• Application for 0402

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SS-1189

3. Specifications

3.1 Mechanical Specifications

3.1.1 Mechanical Construction

Fig. 6

3.1.2 Mechanical Specifications

1. Model Name GXH-3

2. Throughput 95,000 CPH

Note : The PCB transition time under optimum conditions is excluded.

3. PCB Transfer

Time

Approx. 2.5 seconds (PCB Length: 155 mm or less) (under optimum condition)

4. PCB Flow

Direction and

Transfer Reference

PCB Flow Direction : From Left to Right ("From Right to Left" is optional.)

Transfer Reference : Front Side of Machine or Rear Side of Machine

5. Applicable PCB

Size: 50 × 50 to 460 × 460 mm (Four Corners : R1 to R1.5 mm)

Thickness : 0.5 to 5.0 mm

Warpage : 0.2 mm or less per 50 mm Max. ± 1 mm

Mass : Max. 1.5 kg (completed PCB)

Material : Glass Epoxy

Ceramic (Option)

Note : Depending on the material, shape, warpage, mass, etc., of the PCB, it is

required to make a placement test to confirm that the components can be

placed normally.

0305-002 Tg0846-WO-SP

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P.E.C Camera

PCB Transfer

Conveyor

Component

Recognition Camera

Feeder

X-axis

Y-axis

Head

Pick-Up Position

SS-1189

6. Correction Method

for PCB Location

PEC Recognition

7. Conditions of PCB

before Placement

(Regulation of

Component Height)

Upper Level : Max. 12.7 mm

Lower Level : Max. 30 mm

8. Applicable

Components

(1) Applicable Components

Size : 0.6 × 0.3 to 44 × 44 mm or less

Thickness

: Max. 12.7 mm

Lead Pitch : 0.4 mm pitch or more

Lead Width : Min. 0.15 mm

Lead Length : Min. 0.20 mm

Note : Some components cannot be used due to the mechanical characteristics,

shapes, etc.

(Example of Unsuitable Components)

When there is a protruding portion on the upper surface of a component, the

lower surface of the vacuum nozzle may be worn out, causing an error during

the teaching operation through component recognition lighting.

Be sure to check the shape of the components to be used.

Applicable Components for Reference

• Cylindrical Components

Resistors, Capacitors, Diodes,

and other similar-shaped components,

• Square Components

Resistors, Film Capacitors, Coils,

Chip Ceramic Filters, and other similar-shaped components

• Deform Components

Semi-Fixed Variable Resistors, Trimmer Capacitors

and other similar-shaped components

• Ics

Mini-Flat ICs, Plastic Chip Carrier with Leads,

and other similar-shaped components

• Leaded Components

Mini-Mold Transistors, Mini-Power Transistors, Filters, LEDs, Diodes,

Coils, Tantalum Capacitors, Aluminum Electrolytic Capacitors,

and other similar-shaped components

• Connectors

Connectors for FFC / FPC, PCB-to-PCB Connectors,

Wire-to-PCB Connectors, PLCC Sockets,

and other similar-shaped components

• BGA/CSP Components (Option)

BGA, CSP, LGA, and other similar-shaped components

Size : Max. 44 × 44 mm

Ball Diameter : Min. φ 0.3 mm

Ball Pitch : 0.5 mm pitch or more

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