SIPLACE D3 规格说明书英文版.pdf - 第11页

11 Placement Heads Standard Functions / Options 12-nozzle Collect & Place head 6-nozzle Collect & Place head S tandard- functions Camera, vacuum sensor , force measurement, PCB warpage, check, individual recordin…

Placement Heads

Overview

Head Modularity

The SIPLACE D3 is charac-

terized by maximum flexibil-

ity in the production process.

This flexibility is partly due to

the head modularity of the

placement machine as it

allows different placement

head variants to be config-

ured to suit the production

requirements.

Collect&Place principle

The SIPLACE 12 and 6-noz-

zle Collect&Place heads

work on the Collect&Place

principle. This means that,

within each cycle, 12 or 6

components are picked up

and "collected" by the place-

ment head, are optically cen-

tered on the way to the board

and are rotated into the

required placement angle.

They are then placed gently

and accurately on the PCB.

This principle is particularly

suitable for the high-speed

placement of standard com-

ponents.

Collect&Place principle

Pick&Place principle

The high-precision SIPLACE

TwinHead, which consists of

two Pick&Place placement

modules of the same design

coupled together, works on

the Pick&Place principle.

Two components are picked

up by the placement head,

optically centered on the way

to the placement position

and rotated into the neces-

sary placement angle. This

principle has proved particu-

larly suitable for fast and

accurate placement of spe-

cial components in the fine

pitch and super-fine pitch

range, and for complex and

heavy components that

require grippers, for

example.

Checking and self-learning

functions

The SIPLACE placement

heads' reliability can be fur-

ther increased with various

checking and self-learning

functions.

• Component sensor

It checks for the presence

of a component at the noz-

zle before and after the

pick-up and placement

process.

• Digital camera on the

placement head

Checks the position of

each component at the

nozzle. Any deviations

from the required pick-up

position are corrected

before placement takes

place.

• Force sensor

Monitors the specified

component set-down forc-

es. With the sensor stop

method, differences in

height during pick-up and

any unevenness of the

PCB surface are compen-

sated during placement.

• Vacuum sensor

Checks whether the com-

ponent was picked up or

set down correctly.

Placement Heads

Standard Functions / Options

12-nozzle Collect&Place head 6-nozzle Collect&Place head

Standard-

functions

Camera, vacuum sensor, force

measurement, PCB warpage,

check, individual recording for

each component

Standard

functions

High-resolution camera,

vacuum sensor, force measure-

ment, PCB warpage, check,

individual recording for each

component

Options High-resolution camera, compo-

nent sensor, short nozzle, short

sleeve, nozzle changers, special

nozzles

Options Short nozzle, short sleeve,

nozzle changers, special

nozzles

TwinHead

Standard

functions

Fine-pitch camera, vacuum sen-

sor, force sensor, nozzle

changer, PCB warpage check,

individual recording for each

component

Options Flip-chip camera, special noz-

zles, grippers, coplanarity mod-

ule

Placement Heads

Collect&Place Heads

12-nozzle

Collect&Place head

CO camera type 28

12-nozzle

Collect&Place head

CO camera type 29

6-nozzle

Collect&Place head

CO camera type 29

Component range

a) Please note that the range of components that can be placed is also affected by the pad geometry, cus-

tomer-specific standards, component packaging tolerances and component tolerances

0402 to PLCC44, BGA,

µBGA, flip-chip, TSOP,

QFP, SO to SO32,

DRAM

0201

to flip-chip, bare

die, PLCC44, BGA,

µBGA, TSOP, QFP, SO

to SO32, DRAM

b) With 0201 package

0201 to 27 x 27 mm²

Component spec.

max. height

min. lead pitch

min. lead width

min. ball pitch

min. ball diameter

min. dimensions

max. dimensions

max. weight

6 mm

0.5 mm

0.2 mm

0.35 mm

0.2 mm

1.0 x 0.5 mm²

18.7 x 18.7 mm²

2 g

6 mm

0.3 mm

0.15 mm

0.25 mm

0.14 mm

0.6 x 0.3 mm²

18.7 x 18.7 mm²

2 g

8.5 mm

0.3 mm

0.15 mm

0.25 mm

0.35 mm

0.14 mm

0.2 mm

0.6 x 0.3 mm²

27 x 27 mm²

5 g

c) For components < 18 x 18 mm²

d) For components  18 x 18 mm²

Programmable set-down

force

2.4 N - 5.0 N 2.4 N - 5.0 N 2.4 N - 5.0 N

Nozzle types 9xx 9xx 8xx, 9xx

X/Y accuracy

e) The accuracy value was measured using the vendor-neutral IPC standard

± 45 µm/3

± 60 µm/4

± 41 µm/3

± 55 µm/4

± 45 µm/3

± 60 µm/4

Angular accuracy ± 0.5° / 3

± 0.7° / 4

± 0.5° / 3

± 0.7° / 4

± 0.2° / 3

± 0.3° / 4

Component range 98% 98.5% 99.5%

Component camera type 28 29 29

Illumination levels 5 5 5

Possible illumination

level settings

256