SIPLACE D3 规格说明书英文版.pdf - 第30页
30 Digital Vision System The digital SIPLACE vision system guarantees extremely fa st and relia ble component recognitio n, while being very simple to use. The sy stem identifies each individu al component from its shape…
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Component Feeding
Waffle Pack Changer (WPC)
Technical Data
Electrical ratings
Dimensions (LxW) 1560 x 360 mm²
Height
830 mm ± 15 mm PCB transport height
900 mm ± 15 mm PCB transport height
930 mm ± 15 mm PCB transport height
950 mm ± 15 mm PCB transport height
1360 mm ± 15 mm
1430 mm ± 15 mm
1460 mm ± 15 mm
1480 mm ± 15 mm
Weight approx. 240 kg
Load per unit area 4.19 kN/m²
Dimensions of the waffle-pack tray carrier (L x W x H) 360 x 260 x 6 mm³
Weight of the waffle-pack tray carrier 0.8 kg
Dimensions of the waffle-pack tray including components 341 x 235 x 15 mm³
max. 341 x 235 x 23 mm³
Weight of the waffle-pack tray carrier including the waffle-pack tray and
components max. 1.2 kg
Storage capacity max. 28 waffle-pack tray
carriers
Total weight of the 28 waffle-pack tray carriers 27.6 kg
Weight of the magazine storage unit, waffle-pack tray carriers, waffle-
pack trays and components max. 50 kg
Changeover time for waffle-pack tray carrier
over 1 level
over 10 levels
over 27 levels
1.9 s
2.3 s
2.9 s
Supply voltage 3 x 208 VAC ± 5%; 50/60 Hz (U.S.A.)
3 x 230 VAC ± 5%; 50/60 Hz
3 x 380 VAC ± 5%; 50/60 Hz
3 x 400 VAC ± 5%; 50/60 Hz (European version)
3 x 415 VAC ± 5%; 50/60 Hz
Nominal apparent power 800 VA
Rated current 0.7 A at 3 x 400 VAC
Fuses 3 x 10 or 3 x 16 A
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Digital Vision System
The digital SIPLACE vision
system guarantees
extremely fast and reliable
component recognition,
while being very simple to
use. The system identifies
each individual component
from its shape and color.
Even complex component
shapes, such as flip-chip or
CCGA are detected
extremely reliably.
The system is not only used
in the placement head cam-
eras; it can also be found in
the PCB camera. As well as
ensuring that components
are detected accurately, it
also ensures reliable recog-
nition of the ink spots and
PCB fiducials.
The benefits at a glance:
• Extremely fast and reliable
component detection
• Shortest cycle times
• Robust measurement with
reference to the shape
and color
• Straightforward program-
ming
• Offline programming of
component shapes
• Rapid introduction of new
products (NPI)
• Open architecture allows
you to quickly adapt to
new requirements
• Optimum placement
results through individual
measurement of each
component
Digital vision cameras
12-nozzle Collect&Place head camera
12 nozzle Collect&Place head camera (High Resolution)
6-nozzle Collect&Place head camera
TwinHead standard and high-resolution camera
2 PCB cameras
Examples of digital vision system analysis times
0201 9 ms
PLC44 17 ms
BGA 225 balls 18 ms
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Digital Vision System
Checking the Component Quality
SIPLACE Vision algorithms
help with the detection of
• flipped components
• upright components
• poor component quality
The digital SIPLACE Vision
System automatically saves
the last 500 images of com-
ponents that were identified
as "bad". SIPLACE users
can then easily demonstrate
poor component quality.
The benefits at a glance:
• Maximum placement qual-
ity
• High first pass yield
• Reduced operating costs
Flipped components Upright components
Poor component quality
Vision Teach menu at the station