SIPLACE D3 规格说明书英文版.pdf - 第6页

6 Machine Description Extremely fast pla cement of even large and complex components High-tech with an optimum price/performance ratio: this was the SIPLACE team's aim for the SIPLACE D3 - the fast and flexible trip…

Overview of the Technical Data

Placement rate

IPC value

Benchmark value

Theoretical value

a) See page 7 for a definition of the output values

37,600 comp./h

40,400 comp./h

61,000 comp./h

Component range 0201 - 200 x 125 mm²

Placement accuracy

angular accuracy

b) The accuracy value was measured using the vendor-neutral IPC standard

± 22 µm, ± 0.05° / (3),

± 30 µm, ± 0.07° / (4)

Feeder module types Tape feeder modules, waffle-pack trays, stick maga-

zine feeders, bulk cases, dip modules, application-

specific OEM feeder modules

Feeding capacity 180 tracks with 3 x 8 mm S

PCB format max. 610 x 508 mm²

PCB thickness 0.3 - 4.5 mm (others available on request)

PCB weight max. 3 kg

Camera 6 illumination levels

SIPLACE D3 machine colors

Machine protection: Anthracite

(SIPLACE color code SN 614)

Hoods: Light Basic

(SIPLACE color code SN 700)

Machine protection: Light Basic

(SIPLACE color code SN 700)

Hoods: Anthracite

(SIPLACE color code SN 614)

Machine Description

Extremely fast placement

of even large and complex

components

High-tech with an optimum

price/performance ratio: this

was the SIPLACE team's aim

for the SIPLACE D3 - the fast

and flexible triple-gantry

machine from the new

SIPLACE D-series genera-

tion. It offers absolute flexibil-

ity combined with high

speed.

Now you can benefit from the

innovative added value that

the SIPLACE D3 creates

with its combination of inno-

vative and proven technol-

ogy.

The highlights of the

SIPLACE D3 at a glance:

Flexible head combina-

tions to meet every need

The SIPLACE TwinHead

can be used on the SIPLACE

D3 in addition to the fast 6

and 12-nozzle

Collect&Place heads. It

transforms the machine into

a flexible all-rounder. It can

place even complex compo-

nents and large connectors

with THT technology both

quickly and accurately.

During placement, the place-

ment heads fetch the compo-

nents from the at-rest

component supply, and set

them down on the PCB,

which is also stationary. This

proven SIPLACE principle

guarantees reliable pick-up

of even the smallest compo-

nents, prevents the compo-

nents slipping on the PCB

and minimizes traversing

paths.

Optimized transport condi-

tions with the flexible dual

conveyor

The user also has access to

different variants of the PCB

conveyor: the SIPLACE sin-

gle conveyor and the flexi-

ble SIPLACE dual

conveyor. The latter offers

all the benefits of the conven-

tional dual conveyor, such as

reducing non-productive

downtimes, combined with

the option of using the single

conveyor.

Incredibly fast new prod-

uct introduction (NPI) with

external set-up preparation

and vision teaching

The SIPLACE D3 really

comes into its own in flexible

production environments.

For example, NPI can be

implemented as fast as pos-

sible with the SIPLACE Vir-

tual Product Build. This NPI

solution allows you to pro-

gram offline, set up and

check offline and to make

adjustments offline with the

SIPLACE Pro software.

Machine Performance

This increases machine utili-

zation and reduces waste.

And with respect to the cur-

rent production run, the

SIPLACE vision teaching

station also makes it ex-

tremely simple and fast to

generate component shape

descriptions, even for com-

plex components. The set-up

process starts once you have

optimized the product and

defined all the components in

the programming system.

This is also done externally

and then checked by means

of the barcode and data

transfer. This makes the

product change child's play:

the program and all the data

are sent to the line and the

new production run can start.

It just can't get any faster!

Lowest dpm with set-up

verification, sophisticated

sensors and AOI

The highest machine quality

allows the SIPLACE D3 to

produce the highest product

quality. This is guaranteed by

a number of additional fea-

tures.

Sensors check the presence

and position of the compo-

nents before and after every

pick-up and placement oper-

ation at the placement head.

The digital SIPLACE Vision

System detects the compo-

nents faster and more reli-

ably than the old analog

technology. Finally, with

SIPLACE OS, the SIPLACE

team is offering an AOI

(Automatic Optical Inspec-

tion) device that checks the

products and signals errors

to the placement machine.

This network of tests consid-

erably lowers dpm rates and

increases the first pass yield.

Types of

placement head

12-nozzle Collect&Place head (C&P12)

6-nozzle Collect&Place head (C&P6)

SIPLACE TwinHead (TH)

Please note IPC value [comp./h]

According to the vendor-neutral conditions of the IPC 9850 standard published

by the Association of Connecting Electronics Industries.

SIPLACE Benchmark value [comp./h]

The SIPLACE benchmark value is measured during the machine acceptance

tests. It corresponds to the conditions set out in the SIPLACE scope of service

and supply.

Theoretical maximum output value [comp./h]

The theoretical maximum output value is calculated from the most favorable

conditions for each machine type and setting, and corresponds to the theoreti-

cal conditions normally used in the industry.

Number of gantries 3

Placement area 1 Placement area 2 IPC value Benchmark value Theoretical value

C&P12 / C&P12 C&P12 37,600 40,400 61,000

C&P12 / C&P12 C&P6 33,200 36,200 52,500

C&P12 / C&P12 TH 28,800 31,400 47,000

C&P12/C&P6 C&P6 28,500 30,100 43,500

C&P12/C&P6 TH 24,100 25,300 38,500

C&P12 / TH TH 21,300 23,800 33,500

C&P6 / C&P6 C&P6 25,100 28,100 34,500

C&P6 / C&P6 TH 20,700 23,300 29,500

C&P6 / TH TH 16,900 19,400 24,500

TH / TH TH 11,600 12,500 19,500