SIPLACE D3 规格说明书英文版.pdf - 第9页

9 Modular Machine Concept Sample Configuration NCH1 NCH2 NCH1 C&P / T H HF MTC/HF C&P/TH NCH2 NCH1 NCH2 NCH1 PA1 PA2 MTC/WPC/HF HF C&P/TH BZ Buffer zone C&P Collect & Place head HF SIPLACE HF componen…

Modular Machine Concept

Step 1: Placement system with 3 gantries

Step 2: Selection of the placement heads

12-nozzle C&P head

6-nozzle C&P head

TwinHead

Step 3: Selection of the conveyor

Single conveyor

Flexible dual conveyor

Step 4: Selection of the component

changeover table, MTC, WPC

SIPLACE HF component changeover table

MTC

WPC

Step 5: Selection of the feeder modules

S Tape Feeder Modules

Modular Machine Concept

Sample Configuration

NCH1

NCH2

NCH1

C&P/TH

MTC/HF

C&P/TH

NCH2

NCH1

NCH2

NCH1

PA1

PA2

MTC/WPC/HF

C&P/TH

BZ Buffer zone

C&P Collect&Place head

HF SIPLACE HF component changeover table

MTC Matrix Tray Changer

NCH1 Nozzle changer, row 1

NCH2 Nozzle changer, row 2

OP Operator panel

PA1 Placement area 1

PA2 Placement area 2

TH TwinHead

WPC Waffle-pack changer

OP OP

Placement Heads

Overview

Head Modularity

The SIPLACE D3 is charac-

terized by maximum flexibil-

ity in the production process.

This flexibility is partly due to

the head modularity of the

placement machine as it

allows different placement

head variants to be config-

ured to suit the production

requirements.

Collect&Place principle

The SIPLACE 12 and 6-noz-

zle Collect&Place heads

work on the Collect&Place

principle. This means that,

within each cycle, 12 or 6

components are picked up

and "collected" by the place-

ment head, are optically cen-

tered on the way to the board

and are rotated into the

required placement angle.

They are then placed gently

and accurately on the PCB.

This principle is particularly

suitable for the high-speed

placement of standard com-

ponents.

Collect&Place principle

Pick&Place principle

The high-precision SIPLACE

TwinHead, which consists of

two Pick&Place placement

modules of the same design

coupled together, works on

the Pick&Place principle.

Two components are picked

up by the placement head,

optically centered on the way

to the placement position

and rotated into the neces-

sary placement angle. This

principle has proved particu-

larly suitable for fast and

accurate placement of spe-

cial components in the fine

pitch and super-fine pitch

range, and for complex and

heavy components that

require grippers, for

example.

Checking and self-learning

functions

The SIPLACE placement

heads' reliability can be fur-

ther increased with various

checking and self-learning

functions.

• Component sensor

It checks for the presence

of a component at the noz-

zle before and after the

pick-up and placement

process.

• Digital camera on the

placement head

Checks the position of

each component at the

nozzle. Any deviations

from the required pick-up

position are corrected

before placement takes

place.

• Force sensor

Monitors the specified

component set-down forc-

es. With the sensor stop

method, differences in

height during pick-up and

any unevenness of the

PCB surface are compen-

sated during placement.

• Vacuum sensor

Checks whether the com-

ponent was picked up or

set down correctly.