00198763-01_VD_SIPLACE_Pro_17.0_R19-2_EN_DE.pdf - 第13页
SIPLACE Pro 17.0 (R19-2) / Version Description 11/2019 Edition 13 – Carrier X (XTH) (X2, X 3, X4 on location 2 and 4 onl y) – Carrier SX (SX1/S X2 with Twin Head and CPP head only) – MTC2 (X2, X3, X 4 on location 2 and 4…
SIPLACE Pro 17.0 (R19-2) / Version Description 11/2019 Edition
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NOTICE
The following station software versions are not supported by SIPLACE Pro anymore:
– 506
– 601, 602, 603, 604
– 701, 702, 703, 704
If a station with one of the removed versions exists in SIPLACE Pro, the version will be
set to the following supported version of the corresponding platform:
– 505 Full
– 605
– 707
3.2 Supported DEK Printer Software Versions and Printer Types
DEK Printer Version
Printer Types
DEK Printer Software Version V09
(Printer Programming 1.x)
DEK Printers running V09 software
*)
Table 3-2: Supported DEK printer software versions and printer types
*)
The version number listed above is accurate at the time of compiling this document.
Please note that it is subject to change without prior notice. For further details please contact your
sales representative.
3.3 Supported Feeder Types
The following feeders are supported by SIPLACE Pro:
Feeder Modules from ASM Assembly Systems
– 4 mm – 104 mm X-feeder
– 8 mm - 88 mm E (E-series only)
– 2x8 mm X-feeder
– 16 mm XN-feeder
– Surftape AX (8 mm, 12 mm, 16 mm)
– LED feeder TE
LED feeder HS
– SIPLACE JTF-S (X-series S and SX1/SX2 V2 only)
– SIPLACE JTF-M (X-series S, X4i S micron and SX1/SX2 V2 only)
– SIPLACE JTF-ML 14X and JTF-ML 18X (TX-series only)
– SIPLACE JTF-ML2 7/7 and JTF-ML2 9/9 (TX-series only)
– JTF-MW E (E-series only)
– SIPLACE BulkFeeder X
– Arbitrary Carrier X
– Conveyor Carrier X
SIPLACE Pro 17.0 (R19-2) / Version Description 11/2019 Edition
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– Carrier X (XTH) (X2, X3, X4 on location 2 and 4 only)
– Carrier SX (SX1/SX2 with Twin Head and CPP head only)
– MTC2 (X2, X3, X4 on location 2 and 4, X2 S, X3 S, X4 S on location 2)
– WPC5 / WPC6 (SX1/SX2, X-series S on location 2)
– SIPLACE Wafer Systems (CA-series only)
– Stick feeder with X-adapter
Processing Feeders from ASM Assembly Systems
– MeasuringFeeder X
– SIPLACE Glue Feeder
– Reject conveyor with X-adapter
– Linear Dipping Module X
– Linear Dipping Unit 2 X
– Linear Dipping Unit 2 E (E-series only)
– Label feeder with X-adapter
– Splice sensor X-feeder
Modules from 3
rd
party suppliers
– FFI feeders:
Data IO RoadRunners
– IPTE Multi Stick Feeder:
IPTE MSF 60 AX
IPTE MSF XL80 AX
– SEMO CRF80 tape feeder
SIPLACE Pro 17.0 (R19-2) / Version Description 11/2019 Edition
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4 Features of SIPLACE Pro 17.0
If not differently described, the features of the previous SIPLACE Pro versions are contained in
SIPLACE Pro 17.0. The main new features of SIPLACE Pro 17.0 are listed below.
NOTICE
Detailed information on the individual functions can be found in the Online Help for
SIPLACE Pro.
4.1 Board Editor / Grid Board Editor – Enhancements
For the Board Editor and Grid Board Editor, several enhancements have been made. The
enhancements are listed below.
Using Custom Delay Time for Vacuum Tooling
It is possible to configure the delay time between PCB entering the machine and vacuum sensor
detecting the PCB, overwriting the default value set for the machine.
This feature can be activated using the Use custom waiting time for 'Vacuum OK' checkbox in
the Process Requirements tab in the Object Properties of the Board Editor or in the Vacuum
tooling tab of the Grid Board Editor.
New Field for Resulting Z-Height in Board Editor and Grid Board Editor
In the Board Editor and the Grid Board Editor, the Resulting Z-Height field has been added. When
entering the board height and panel height, the resulting z-height is calculated and displayed in this
field in the Board Editor and the Grid Board Editor respectively.
In the Board Editor, the Resulting Z-Height field is in the Panel Properties tab. In the Grid Board
Editor, it is in the panel list.
Changing Origin of the Coordinate System for Grid Panel and Package in Grid Board Editor
In the Grid Board Editor, the origin for the coordinate system of the grid panel and package type is
no longer fixed to a center position but can also be set to a position in the bottom left. It is possible
to switch between both origin positions.
The origin can be changed via the Origin of Coordinate System list in the Grid Panel Type tab
and Packages tab of the Grid Board Editor.
Programming Wafer Edge and Notch Alignment
It is possible to configure the wafer edge and notch alignment. For this, the Wafer Carrier fiducial
type has been introduced. If this new fiducial type is selected, the wafer diameter and notch angle
can be entered manually.
Additionally, the context menu of the fiducial in the graphics has been extended by the entry
Center Fiducial. With this new option, the fiducial can be centered on its structure.
Restrictions
– If the Wafer Carrier fiducial type is selected, only the evaluation modes Standard X, Y and
X, Y, Angle are available.