00198763-01_VD_SIPLACE_Pro_17.0_R19-2_EN_DE.pdf - 第14页

SIPLACE Pro 17.0 (R19-2) / Version Description 11/2019 Edition 14 4 Features of SIPLACE Pro 17.0 If not differently described, the f eatures of the previous SI PLACE Pro versions are contai ned in SIPLACE Pro 17.0. The m…

SIPLACE Pro 17.0 (R19-2) / Version Description 11/2019 Edition

– Carrier X (XTH) (X2, X3, X4 on location 2 and 4 only)

– Carrier SX (SX1/SX2 with Twin Head and CPP head only)

– MTC2 (X2, X3, X4 on location 2 and 4, X2 S, X3 S, X4 S on location 2)

– WPC5 / WPC6 (SX1/SX2, X-series S on location 2)

– SIPLACE Wafer Systems (CA-series only)

– Stick feeder with X-adapter

Processing Feeders from ASM Assembly Systems

– MeasuringFeeder X

– SIPLACE Glue Feeder

– Reject conveyor with X-adapter

– Linear Dipping Module X

– Linear Dipping Unit 2 X

– Linear Dipping Unit 2 E (E-series only)

– Label feeder with X-adapter

– Splice sensor X-feeder

Modules from 3

party suppliers

– FFI feeders:

Data IO RoadRunners

– IPTE Multi Stick Feeder:

IPTE MSF 60 AX

IPTE MSF XL80 AX

– SEMO CRF80 tape feeder

SIPLACE Pro 17.0 (R19-2) / Version Description 11/2019 Edition

4 Features of SIPLACE Pro 17.0

If not differently described, the features of the previous SIPLACE Pro versions are contained in

SIPLACE Pro 17.0. The main new features of SIPLACE Pro 17.0 are listed below.

NOTICE

Detailed information on the individual functions can be found in the Online Help for

SIPLACE Pro.

4.1 Board Editor / Grid Board Editor – Enhancements

For the Board Editor and Grid Board Editor, several enhancements have been made. The

enhancements are listed below.

Using Custom Delay Time for Vacuum Tooling

It is possible to configure the delay time between PCB entering the machine and vacuum sensor

detecting the PCB, overwriting the default value set for the machine.

This feature can be activated using the Use custom waiting time for 'Vacuum OK' checkbox in

the Process Requirements tab in the Object Properties of the Board Editor or in the Vacuum

tooling tab of the Grid Board Editor.

New Field for Resulting Z-Height in Board Editor and Grid Board Editor

In the Board Editor and the Grid Board Editor, the Resulting Z-Height field has been added. When

entering the board height and panel height, the resulting z-height is calculated and displayed in this

field in the Board Editor and the Grid Board Editor respectively.

In the Board Editor, the Resulting Z-Height field is in the Panel Properties tab. In the Grid Board

Editor, it is in the panel list.

Changing Origin of the Coordinate System for Grid Panel and Package in Grid Board Editor

In the Grid Board Editor, the origin for the coordinate system of the grid panel and package type is

no longer fixed to a center position but can also be set to a position in the bottom left. It is possible

to switch between both origin positions.

The origin can be changed via the Origin of Coordinate System list in the Grid Panel Type tab

and Packages tab of the Grid Board Editor.

Programming Wafer Edge and Notch Alignment

It is possible to configure the wafer edge and notch alignment. For this, the Wafer Carrier fiducial

type has been introduced. If this new fiducial type is selected, the wafer diameter and notch angle

can be entered manually.

Additionally, the context menu of the fiducial in the graphics has been extended by the entry

Center Fiducial. With this new option, the fiducial can be centered on its structure.

Restrictions

– If the Wafer Carrier fiducial type is selected, only the evaluation modes Standard X, Y and

X, Y, Angle are available.

SIPLACE Pro 17.0 (R19-2) / Version Description 11/2019 Edition

Restricting Clearance of Pickup Threshold Errors

In the Reject Thresholds group of the Component Editor, a checkbox has been added that allows

only users with activity level “Advanced Production” to clear occurring pickup threshold errors.

4.2 New License “Single Component Traceability from Wafer –

Machine Connection”

If the single component traceability from wafer functionality (SCT) has been activated via the

Traceability system checkbox in the SIPLACE Pro Station Editor, the new license “Single

Component Traceability from Wafer – Machine Connection” is required.

Restrictions

– If SMT traceability is used at the same time, two licenses are required: the “SIPLACE ASM

Traceability – Machine Connection” license and the new “Single Component Traceability from

Wafer – Machine Connection” license.

4.3 Smart Pin Support for TX V2 – Enhancements

The Smart Pin Support for the TX V2 has been enhanced by the functions described below.

Using Partly Accessible Nozzle Magazines

If the TX V2 is configured with Smart Pin Support, the outermost nozzle magazines cannot be

reached by the PCB camera to read the fiducials. Instead of blocking the whole nozzle magazine

by default, it is now possible to use all those nozzles that are within reach of the PCB camera.

NOTICE

Even though SIPLACE Pro version 16.1 (station software version 712) does support

Smart Pin Support for the TX V2, with this older version nozzle magazines out of reach

are fully blocked.

Restrictions

– This functionality is only available for the magazines 4xxx(20) / 6xxx(20), item no.

[03218226-xx] for the C&P20 P2 head and 20xx(20), item no. [03226630-xx] for the CPP

head. It is not available for the magazines 28xx(9) and 20xx(12).

– This functionality is not available for TwinHead magazines.

Combination of Smart Pin Support with TwinHead on TX V2

The combination of Smart Pin Support with a TwinHead on the TX V2 is supported.

4.4 New Fiducial Type “Edge”

In the Fiducial Type Editor of SIPLACE Pro Desk, the fiducial type “Edge” has been introduced.

With this new fiducial type, it is possible to define the length of an X-coordinate, which is useful for

LED alignments.