SIPLACE DX1DX2-Spec-设备性能参数-EN-DMS.pdf - 第12页
12 Machine Performance Placement head types SIPLACE S peedS tar (C&P20) SIPLACE 12 segment Collect&Place (C&P12) SIPLACE T winS tar (TH) Placement performa nce The placement pe rformance is i nfluenced by the…
11
Machine Concept
Example of SIPLACE DX2 with WPC5/WPC6
PLEASE NOTE: For all possible head config-
urations please refer to section Machine Per-
formance from page 12.
DXTable 60 DX table with 60 tracks
DXTable 30 DX table with 60 tracks
WPC Waffle Pack Changer,
type 5 or type 6
CP12 12 segment Col-
lect&Place head
Other head configura-
tions possible.
TH Twin Head.
NC Nozzle changer in acc.
with head configuration
IC Stationary camera
FC Flip chip camera
G1 Gantry 1
G2 Gantry 2
PA Placement area
12
Machine Performance
Placement head types SIPLACE SpeedStar (C&P20)
SIPLACE 12 segment Collect&Place (C&P12)
SIPLACE TwinStar (TH)
Placement performance
The placement performance is influenced by the different head combinations and head positions, plus the con-
veyor configurations. Individual options and customized applications also influence the placement performance.
On request, SIPLACE can calculate the actual performance of your product on your machine configuration.
IPC value [comp./h]
In line with the vendor-neutral conditions of the IPC 9850 standard published by the Association of Connecting
Electronics Industries.
SIPLACE Benchmark value [comp./h]
The SIPLACE benchmark value is measured during the machine acceptance tests. It corresponds to the condi-
tions specified in the SIPLACE scope of service and supply.
Theoretical maximum output value [comp./h]
The theoretical maximum output value is calculated from the most favorable conditions for each machine type
and setting, and corresponds to the theoretical conditions normally used in the industry.
Placement machine
SIPLACE DX2
Placement area IPC value Benchmark value Theoretical value
C&P20 / C&P20 48,000 60,000 67,750
C&P20/C&P12 31,000 43,000 53,000
C&P12/C&P12 25,500 31,000 41,000
TH/C&P12 16,500 18,500 25,000
Placement machine
SIPLACE DX1
Placement area IPC value Benchmark value Theoretical value
C&P20 24,000 30,000 33,875
C&P12 14,000 16,000 21,000
TH 5,100 5,500 6,500
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SIPLACE Placement Heads
Overview
Collect&Place principle
The SIPLACE SpeedStar
and the SIPLACE 12 seg-
ment C&P operate according
to the Collect&Place princi-
ple i.e. one cycle includes
pickup or "collection" of 20 or
12 components, their optical
centering on the board and
their rotation into the
required placement angle
and position. They are then
placed gently and accurately
onto the PCB. This principle
is particularly suitable for
high-speed placement of
standard components.
Pick&Place principle
The high precision SIPLACE
TwinStar, which consists of
two Pick& Place modules of
identical design, coupled to
one another, functions
according to the Pick&Place
principle. Two components
are picked up by the place-
ment head, optically cen-
tered on the way to the
placement position and
rotated into the necessary
placement angle.
This principle is ideally suit-
able for fast and precise
placement of special compo-
nents in the fine pitch or
super fine pitch field, plus
complex and heavy compo-
nents which may need grip-
pers.
Control and self-learning
functions
The reliability of the
SIPLACE placement heads
can be enhanced even fur-
ther with various checking
and self-learning functions.
• Component sensor
Checks the presence of
the components on the
nozzle before the pickup
and placement process
• Digital camera
Checks the position of
each component on the
nozzle. This check is per-
formed in a single step,
with no extra time involved
but with optimum scan-
ning of each individual
component.
• Force measurement
Monitors the prescribed
component set-down
force.
The sensor stop proce-
dure enables compensa-
tion of height differences
during pickup and PCB
warpage during place-
ment.
• Vacuum sensor
Checks whether the com-
ponent was correctly
picked up or placed.