SIPLACE DX1DX2-Spec-设备性能参数-EN-DMS.pdf - 第31页

31 Component Feeding Waffle Pack Changer (WPC5/WPC6) Technical Data Electrical ratings WPC5/WPC6 dimensions Length x width Height For 900 mm PCB convey or height For 930 mm PCB convey or height For 950 mm PCB convey or h…

100%1 / 76
30
Component Feeding
Waffle Pack Changer (WPC5/WPC6)
If you need to prepare com-
ponents in multiple waffle
pack trays for the placement
process, we recommend the
use of a Waffle Pack
Changer (WPC5 or WPC6)
for automatic magazine
(tray) changing.
The WPC setup is coordi-
nated with the placement
sequence to ensure optimum
use of distances and time.
The magazine storage unit
with waffle pack trays moves
in a vertical direction, until
the required magazine is in
the access range of the feed
axis.
The horizontal feed axis
transports the waffle pack
tray from the tower into the
access range of the place-
ment head. The first maga-
zine is made available as
soon as a PCB moves onto
the PCB conveyor, and valid
panel and setup data is avail-
able. All magazine changes
are performed within the
placement cycle time. Jedec
magazines can be refilled
without machine stoppages.
Faulty components are sim-
ply placed back in the origi-
nal magazine.
The Waffle Pack Changer
can be used together with
the (C&P20).
WPC6
However, the WPC6 also
has a nonstop module. This
enables the user to refill waf-
fle pack trays during ongoing
operations. The nonstop
module facilitates opening of
the loading flap during opera-
tion, for insertion of waffle
pack trays. Additional func-
tions in SC version 704 and
higher allow component fill-
ing levels to be updated or
individual levels to be manu-
ally refilled.
31
Component Feeding
Waffle Pack Changer (WPC5/WPC6)
Technical Data
Electrical ratings
WPC5/WPC6 dimensions
Length x width
Height
For 900 mm PCB conveyor height
For 930 mm PCB conveyor height
For 950 mm PCB conveyor height
1520 mm x 360 mm
1430 mm
1460 mm
1480 mm
WPC5 weight
Basic configuration (with cassettes and waffle pack tray
carriers)
Fully configured (with WPTC and cassette with compo-
nents)
approx. 270 kg
approx. 320 kg
WPC6 weight
Basic configuration (with cassettes and waffle pack tray
carriers)
Fully configured (with WPTC and cassette with compo-
nents)
approx. 280 kg
approx. 330 kg
WPC5/WPC6 surface load 25 N/cm²
Weight of the waffle pack tray carrier 0.8 kg
Dimensions of the waffle pack tray carrier
(length x width x height) 360 mm x 260 mm x 6 mm
Dimensions of the waffle pack tray
length x width x height 347 mm x 235 mm x 15 mm
Height of waffle-pack tray, including component
WPC5
a
/WPC6
Mode - standard:
Mode - high components:
a) In WPC5 from serial number 1484, component height of up to 35 mm (maximum) possible.
to max. 29 mm
to max. 32 mm
Distance from level to level 17 mm (± 2 mm)
Storage capacity 28 Waffle pack tray carrier
Changeover time for waffle pack tray carrier
over 1 level
over 10 levels
over 27 levels
1.9 s
2.3 s
2.8 s
Supply voltage 3 x 200 V~ ± 10 %; 50/60 Hz (Japan)
3 x 208 V~ ± 10 %; 50/60 Hz (U.S.A)
3 x 230 V~ ± 10 %; 50/60 Hz
3 x 380 V~ ± 10 %; 50/60 Hz
3 x 400 V~ ± 10 %; 50/60 Hz (Europe)
3 x 415 V~ ± 10 %; 50/60 Hz
Nominal apparent power 1.5 kVA
Nominal active power 1.0 kW
Fuses 3 x 10 or 3 x 16 A
32
Digital SIPLACE Vision System
The digital Vision system
ensures fast and reliable
component recognition, cou-
pled with user-friendly han-
dling. The system identifies
each individual component
by its geometry and color.
Even complex component
shapes, such as flip chip or
CCGA are detected with high
reliability.
This component recognition
check is performed in a sin-
gle step, with no extra time
involved but with optimum
scanning of each individual
component.
This digital Vision system is
not only used in the compo-
nent cameras but also in the
PCB camera. In addition to
the precise recognition of
components, this also guar-
antees reliable detection of
inkspots and PCB fiducials.
The benefits at a glance:
• Extremely fast and reliable
component recognition
• Shortest cycle times
• Robust measurement
based on the geometry
and color
• Straightforward program-
ming
• Offline programming of
component shapes
• Rapid introduction of new
products (NPI)
• Open architecture allows
you to quickly adapt to
new requirements
• Optimum placement
results based on individ-
ual measurement of each
component
The SIPLACE Vision sys-
tem offers inspection rou-
tines and functions to
enhance the quality of com-
ponent recognition.
The benefits at a glance:
• Maximum placement
quality
• High first pass yield
• Reduction of operating
costs
Digital vision cameras
SIPLACE SpeedStar camera, type 23
SIPLACE 12 segment C&P camera, type 28
SIPLACE 12 segment C&P camera, type 30
SIPLACE TwinStar standard camera, type 36
SIPLACE TwinStar, type 33
SIPLACE TwinStar high resolution camera, type 25
SIPLACE PCB camera, type 34
Examples of digital vision system analysis times
Evaluation times only play a role in the P&P process.
01005 9 ms
PLC44 17 ms
BGA 225 balls 18 ms