IPC-4552.pdf - 第25页
IPC-4552 Proposal June 2001 Examination of the gold surface after the 1.85 million cycles at the time of writing this did not show any abnormalities with the gold still p resent. An interesting item from this test was th…
IPC-4552 Proposal June 2001
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APPENDIX 1 Fig 14: Contact resistance data for Vendor C for
Interlocking Square contacts
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APPENDIX 2 Fig 14: Contact resistance data for Vendor C for
Interlocking Square contacts
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IPC-4552 Proposal June 2001
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vendor C vendor E
vendor
Means and Std Deviations
Level Number Mean Std Dev Std Err Mean
vendor C 60 3.85283 0.894992 0.11554
vendor E 60 2.00300 0.712604 0.09200
Fig 15: comparison of gold thickness by vendor for the Interlocking Square Contact test
Fig 16: Interlocking Square Contact Test Coupon
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Fig 16: Interlocking Square Contact Test Coupon
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IPC-4552 Proposal June 2001
Examination of the gold surface after the 1.85 million cycles at the time of writing this did not show any
abnormalities with the gold still present.
An interesting item from this test was that the two suppliers, Vendors C & E supplied two different gold thickness,
see fig 15. While there was almost a 2 microinch delta between the two samples tested, there is perhaps a marginal
performance difference after 1.85 million cycles.
Appendix:
In addition the committee elected to include in the appendix:
Definitions:
The terms electroless and immersion were defined.
General process:
A generic description of the process sequence with emphasis on function of each step.
XRF Recommendations:
A set of recommendations are included for the measurements of thin gold.
Conclusion:
The data presented here indicates that the committee has substantiated its thickness specifications with data, the
lower limit for gold thickness was set at 2µin, and data was presented to show that gold thickness in excess of 5µin
will not buy the industry any benefits. It only serves to increase the cost and may be a source of potential problems.
Data was presented to show that 18 hours at 85
o
C/85% RH is comparable to 575 days of shelf life.
Data was presented to show the capability of ENIG as an ideal contacting surface with in excess of 1.85 million
contacts with no increase in resistivity.
Acknowledgements:
The chairman and the co-chair would like to acknowledge the following participants, who played a key role in
designing the testing and actively participated in the discussions and the conclusions.
OEM/CM
Bruce Houghton, Celestica
Mike Barbetta, Cisco
David Hillman, Rockwell
Michael Pfeifer, Motorola
Polina Snugovsky, Celestica
Steve Dumford, Nokia
FABRICATION
Gerard O’Brien (Co-Chairman), Photocircuits
Jack Josefowicz, Tyco
Elaine Colocathis, Alternate Final Finishes
Val Buhay, Merix
SUPPLIERS
George Milad (Chairman), Shipley
Kulpid Johal, Atotech
Don Cullen, MacDermid
John Torrence, MacDermid
Don Gudeczauskas, Uyemura
Jim Martin, Shipley
Martin Bayes, Shipley
Mike Walsh, Fidelity
Stan Sappington, AG Industries
Jim Kurtz, AG Industries
Gilian Winters, Veeco
Marion Graybeal, MG Consulting
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