EIA-481-D中文版----美国电子工业协会.pdf - 第29页
EIA-481-D Page 23 Addendum 附录 Complementary Taping Standards: 补充的卷装标准 EIA-726 8mm punched & Embossed carrier taping of surface mount compon ents for automatic handling of devices smaller than 2.0 mm *1.2 mm 自 动装配小于 2…
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Acknowledgements 鸣谢
The following team members contributed to the realization of the latest document revision:
下列小组成员为最新文件修订的实现做出了贡献：
James Adams-3M
Mike Balbuena-Jabil Circuit, Inc.
Ted Eckerson-Jabil Circuit, Inc.
Albert Escusa-Texas Instruments.
Michael T. Farrell-3M.
Gonzalo Herrera-Jabil Circuit, Inc.
Miguel A. Ojeda Sr.-Jabil Circuit, Inc.
Doug Romm-Texas Instruments.
Steve Kummerl-Texas Instruments.
Henry Sipes-Samtec, Inc.
The following team members are part of the Automated Component Handling Committee:
以下小组成员为自动装配电子工业协会的部分成员：
Bill Aldeen-Nu-Way Electronics
Teri Arguelles-Jabil Circuit, Inc.
Joe Biernacki-Stackpole
Ray Bloom-Advantek
Scott Carter-Tek Pak, Inc.
Ted Coler-Vishay
Michael Farrel-3M
Bill Hall-Tayloreel
Gonzalo Herrera-Jabil Circuit, Inc.
Doug Laven-V-Tek, Inc.
Henry Sipes- Samtec, Inc.
Gabriela Szopa-Jabil Circuit, Inc.
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Addendum 附录
Complementary Taping Standards: 补充的卷装标准
EIA-726 8mm punched & Embossed carrier taping of surface mount components for automatic
handling of devices smaller than 2.0 mm *1.2 mm
自动装配小于 2.0 毫米 *1.2 毫米表面贴装元件的 8 毫米穿孔载体&压纹载体
EIA-747 Adhesive backed punched plastic carrier taping of singulated bare die and other surface
mount components for automatic handling of devices generally less than 1.0 mm thick.
用于厚度小于 1.0 毫米的常用自动装配设备的无屏蔽单模及其他表面贴装元件的粘性塑料传送带
EIA-763 Bare die and chip scale packages taped in 8 mm & 12 mm carrier tape for automatic handling
自动装配空模和芯片的 8 毫米 & 12 毫米载体卷装
Other Reference Documents: 其它参考文献
ESD TR20.20 ESD Association Standard -- ESD Handbook
ESD 协会标准-ESD 手册
ESD ADV1.0 ESD Association Glossary - Glossary of Terms
ESD 协会术语表-ESD 手册-词汇表
SEMI E78 Semiconductor Equipment and Materials International Standard - Electrostatic
Compatibility - Guide to Assess and Control Electrostatic Discharge (ESD) and
Electrostatic Attraction (ESA) for Equipment
半导体设备与材料国际标准-静电兼容性-设备静电放电与静电吸附评估和控制指南
Recommendation: 建议
For waste minimization purposes it is recommended that the industry modify its methods and equipment so
that the minimum leader dimension can be eventually reduced from 400 mm to 320 mm and that the
minimum trailer dimension be reduced from 160 mm to 80 mm.
为了达到减少浪费的目的，建议工厂修改方法和设备以便最小的导带尺寸可最终从 400 毫米降低到 320 毫米，最小拖引带尺寸从 160
毫米降低到 80 毫米。
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