EIA-481-D中文版----美国电子工业协会.pdf - 第30页

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Addendum 附录

Complementary Taping Standards: 补充的卷装标准

EIA-726 8mm punched & Embossed carrier taping of surface mount components for automatic

handling of devices smaller than 2.0 mm *1.2 mm

自动装配小于 2.0 毫米 *1.2 毫米表面贴装元件的 8 毫米穿孔载体&压纹载体

EIA-747 Adhesive backed punched plastic carrier taping of singulated bare die and other surface

mount components for automatic handling of devices generally less than 1.0 mm thick.

用于厚度小于 1.0 毫米的常用自动装配设备的无屏蔽单模及其他表面贴装元件的粘性塑料传送带

EIA-763 Bare die and chip scale packages taped in 8 mm & 12 mm carrier tape for automatic handling

自动装配空模和芯片的 8 毫米 & 12 毫米载体卷装

Other Reference Documents: 其它参考文献

ESD TR20.20 ESD Association Standard -- ESD Handbook

ESD 协会标准-ESD 手册

ESD ADV1.0 ESD Association Glossary - Glossary of Terms

ESD 协会术语表-ESD 手册-词汇表

SEMI E78 Semiconductor Equipment and Materials International Standard - Electrostatic

Compatibility - Guide to Assess and Control Electrostatic Discharge (ESD) and

Electrostatic Attraction (ESA) for Equipment

半导体设备与材料国际标准-静电兼容性-设备静电放电与静电吸附评估和控制指南

Recommendation: 建议

For waste minimization purposes it is recommended that the industry modify its methods and equipment so

that the minimum leader dimension can be eventually reduced from 400 mm to 320 mm and that the

minimum trailer dimension be reduced from 160 mm to 80 mm.

为了达到减少浪费的目的，建议工厂修改方法和设备以便最小的导带尺寸可最终从 400 毫米降低到 320 毫米，最小拖引带尺寸从 160

毫米降低到 80 毫米。

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EIA Document Improvement Proposal EIA 文件的改进建议

If in the review or use of this document, a potential change is made evident for safety, health or technical reasons, please fill

in the appropriate information below and mail or FAX to:

如果在审阅或使用本文件，发现由于安全，健康或技术原因，明显需要进行改进的。请填写以下相应信息，然后发邮件或传真至：

Electronic Components Association 电子工业协会

Standards and Technology Department 标准及技术部门

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Arlington, VA 22201

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