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Chapter 2 Creating and Editing a Program 2-39 Bad Mark Steps in Placement Program There are three types of bad mark steps. z Master bad mark The master bad mark is used to determine whethe r the bad mark processes (exc…
Chapter 2 Creating and Editing a Program
2-38
z Example
An example using the bad mark functions are shown below.
Bad mark A is used to determine if the bad mark processes will be performed or not.
Bad mark B is used to determine if the components C2 will be placed or not.
Bad mark X is used to determine if the placement steps for each block will be performed or not.
[Placement Program]
B Group No.
① Bad mark A
255 (PCB bad mark)
② Bad mark B
1 (Local bad mark)
③ Start of block placement
④ Bad mark X
0 (Block bad mark)
⑤ Placement of R1 (Multiple Pickup) 0
⑥ Placement of R2 (Multiple Pickup) 0
⑦ Placement of C1 (Multiple Pickup) 0
⑧ Placement of C2 (Multiple Pickup) 1 (determined by the local bad mark)
⑨ Placement of IC1 (Single Pickup) 0
⑩ End of block placement
⑪ Repeat offset 1 (Block 2)
⑫ Repeat offset 2 (Block 3)
R１
C1
R２
C2
IC1
Block 2
Bad Mark X
Bad Mark A
R１
C1
R２
C2
IC1
Block 1
Bad Mark X
R１
C1
R２
C2
IC1
Block 3
Bad Mark X
Bad Mark B
Chapter 2 Creating and Editing a Program
2-39
Bad Mark Steps in Placement Program
There are three types of bad mark steps.
z Master bad mark
The master bad mark is used to determine whether the bad mark processes (except the master bad
mark process itself) will be performed or not. Only when a master bad mark is recognized, the
following bad mark processes are performed. To specify a master bad mark, enter “255” in the [B
Group No.] cell.
There is another type of master bad mark. You can exclude the group bad mark processes from
being affected by the result of master bad mark process. To specify this type of master bad mark,
enter “254” in the [B Group No.] cell.
The result of a master bad mark process is effective until the next master bad mark appears.
The master bad mark cannot be assigned within a repeat block.
The master bad mark (the type excluding the group bad mark) can only be assigned in the first
step of the placement program.
z Standard bad mark
The standard bad mark is used to determine whether the component placements for a certain
range will be performed or not. When a standard bad mark is recognized, all the placement steps
will be skipped until one of the following steps appears.
① [Start of Block Placement] step
② [End of Block Placement] step
③ Next standard bad mark step
If no such steps appear, all the placement steps until the end of the program will be skipped.
When there is a standard bad mark immediately before the [Start of Block Placement] step, all the
following offset blocks will be skipped.
To specify a standard bad mark, enter “0” in the [B Group No.] cell.
z Group bad mark
The group bad mark is used to determine whether a certain component will be placed or not. A
bad mark group No. will be assigned for each placement step. When a group bad mark is
recognized, the placement step having the same B Group No. is skipped. 1 to 249 can be assigned
to [B Group No.].
Chapter 2 Creating and Editing a Program
2-40
z Examples
[Placement Program]
B Group No.
① Bad mark 1
255 (Master bad mark)
② Bad mark 2
1 (Group bad mark)
③ Start of block placement
④ Bad mark 3
0 (Standard bad mark)
⑤ Placement of R1 (Multiple Pickup) 0
⑥ Placement of R2 (Multiple Pickup) 0
⑦ Placement of C1 (Multiple Pickup) 0
⑧ Placement of C2 (Multiple Pickup) 1 (bad mark group is specified)
⑨ Placement of IC1 (Single Pickup) 0
⑩ End of block placement
⑪ Repeat offset 1 (Block 2)
⑫ Repeat offset 2 (Block 3)
⑬ Bad mark 4
255 (Master bad mark)
⑭ Bad mark 5
0 (Standard bad mark)
⑮ Start of block placement
⑯ Bad mark 6
0 (Standard bad mark)
⑰ Placement of R1 (Multiple Pickup) 0
⑱ Placement of R2 (Multiple Pickup) 0
⑲ End of block placement
⑳ Repeat offset 1 (Block 2)
A. The effective range for the master bad mark ① is until immediately before master bad mark ⑬.
The master bad mark ① determines whether the bad mark process ②/④ will be performed or
not.
B. When the placement ⑧ is to be determined by the group bad mark ② regardless of the result of
the master bad mark ① process, “254” shall be entered in the [B Group No.] cell.
C. The group bad mark ② determines whether the placement ⑧ will be performed or not.
D. The standard bad mark ④ determines whether the placement of the following each block will
be performed or not.
E. The effective range for the master bad mark ⑬ is until the end of the placement program.
The master bad mark ⑬ determines whether the bad mark process ⑭/⑯ will be performed or
not.
F. The standard bad mark ⑭ determines whether the placement of all the blocks after the step ⑮
will be performed or not.
G. The standard bad mark ⑯ determines whether the placement of the following block will be
performed or not.
Example Program for Multi-block PCB
An example of a multi-block PCB aiming to reduce cycle rate is shown below.
[Conditions]
1. The master bad mark A is used to determine whether the following bad mark processes will be
performed or not.
2. IC1 and IC2 shall be picked up continuously (multiple pickup process) to reduce cycle rate.