96722_AX-201 AX-301 AX501 Spec bookl.pdf - 第25页
5.2 Components and packaging specifications Technical specifications 23 of 34 AX-501/AX-301 AX-201 Component type R, C, MELF (1.5 x 1.0mm, R, C, MELF, SOT, SOD, 2.0 x 1.25mm), SOT, SOD, SO, PLCC, QFP, BGA's, SO, PLC…
5.0 Technical
specifications
5.1 Placement
specifications
Technical specifications
22 of 34
AX-501/AX-301 AX-201
Component alignment principle Laser alignment & CCD Vision CCD vision
Component sensing Presence Presence
Absence Absence
0ffset 0ffset
Dimensions Dimensions
Shape Shape
Max. number of components 1500 per robot 10000 per board
Speed X direction <0.5 m/s <2.2 m/s
Speed Y direction <1.4 m/s <2.5 m/s
Speed Rz direction <10 rev/sec <10 rev/sec for PH-DV
<7.2 rev/sec for PH-HA
Speed Z direction <0.5 m/s <0.5 m/s for PH-DV
<0.7 m/s for PH-HA
Acceleration X direction <5 m/s2 <44 m/s2
Acceleration Y direction <16 m/s2 <38.5 m/s2
Acceleration Rz direction <300 rev/s2 <300 rev/s2 for PH-DV
<96 rev/s2 for PH-HA
Acceleration Z direction <40 m/s2 <40 m/s2 for PH-DV
<20 m/s2 for PH-HA
Encoder measurement resolution X 0.5µm 1.0 µm
Encoder measurement resolution Y 1.5µm 1.0 µm
Encoder measurement resolution Rz 0.31 mrad 0.126 mrad for PH-DV
0.31 mrad for PH-HA
Encoder measurement resolution Z 5µm 5 µm for PH-DV
13.3 µm for PH-HA
Component Vision Field of view 67.8 x 50.5mm 67.8 x 50.5mm for LFOV
26.5 x 25.3mm for SFOV
Component Vision CCD 1280 x 960 pixels 1280 x 960 pixels
Array resolution
Placement force 1.5-8N programmable in 2-8N programmable
steps of 0.1N in steps of 0.1N for
PH-DV, 0.9-40N
programmable in steps
of 0.1N for PH-HA
Lower forces upon
request
5.2 Components
and packaging
specifications
Technical specifications
23 of 34
AX-501/AX-301 AX-201
Component type R, C, MELF (1.5 x 1.0mm, R, C, MELF, SOT, SOD,
2.0 x 1.25mm), SOT, SOD, SO, PLCC, QFP, BGA's,
SO, PLCC, QFP, BGA's, µBGA 's, SSOP, flip chip,
µBGA 's, SSOP, Odd SMD bare die, odd and
and round components through hole
Bulk: components
Bulk R: 1.0 x 0.5mm up to
2.0 x 1.25mm
Bulk C: 0.6 x 0.3mm up to
2.0 x 1.25mm
Dimensions 0.4 x 0.2mm (01005) to 45x45mm 0.4 x 0.2mm (01005) to
45x45mm or 66 x 23mm.
For odds up to 165 x 45 mm
Height PH-LV (Max) 12mm for PH-DV (or 12 over
10.5mm for LxB <17.5 x 17.5mm 12mm)
6.3mm for LXB > 17.5 x 17.5mm 40mm for PH-HA
and < 24 x 24mm (or 25mm over 25mm)
4.3mm for LxB > 24 x 24mm and
< 45 x 45mm
Min: 0.13mm
PH-SV (Max)
10.5mm for LxB > 3 x 3mm and
< 45 x 45mm
Higher with restrictions
Lead pitch > 0.4mm (0.016") > 0.3mm for LFOV
> 0.16mm for SFOV
Lead width > 0.2mm (0.008") > 0.15mm for LFOV
> 0.08mm for SFOV
Bump pitch 0.3mm (0.012") for components > 0.3mm for LFOV
up to 12 x 12mm > 0.16mm for SFOV
0.5mm (0.020") for components
> 12 x 12mm
Bump size 0.15mm (0.006") for components > 0.15mm for LFOV
up to 12 x 12mm > 0.08mm for SFOV
0.3mm (0.012") for components
> 12 x 12mm
Number of bumps Min: 2, max: 3500 Min: 2, max: 3500
Component pick Multiples of 90 degrees Multiples of 90 degrees
orientation
Weight < 12g <12g for PH-DV
<15g for PH-HA
<50g for PH-HA using gripper
Tape sizes 8-56mm wide (IEC286-3) 8-56mm wide (IEC286-3)
Larger sizes upon request
Reel diameters Up to 330mm (13") for ITF & TTF Up to 330mm (13") for ITF &
(optional 15" and 22" for ITF) TTF (optional 15" and 22"
for ITF)
5.3 Board
specifications
Technical specifications
24 of 34
Board specifications
Board material Phenolic/paper (FR2)
Glass-Epoxy (FR4)
Composite materials
IPC 9850 Glass verification panel
Optional:
Ceramics
Carriers
Flex foil
Board artwork material / surface finish Hot Air Solder Leveled (HASL)
Bare copper with Organic Surface
Protectant (OSP)
Electroless Ni / Immersion AU
Board range min (L x W) 50 x 50mm (L = Board transport direction)
50 x 25mm optional
Board range max (L x W) AX-501 : 515 x 390mm; 515 x 457mm optional
(L = Board transport direction) AX-301 : 475 x 390mm; 475 x 457mm optional
AX-201 : 515 x 457mm
Y/X ratio < 2.5
Board thickness 0.3 - 6mm
Optional other transport systems are
available for other board materials
Pre-mounted components Max. 20mm bottomside, max. 10.5mm topside
Warpage (Flatness) Topside: Max. 0.6% of diagonal to max +2mm
Bottomside: Max. -2mm
Edge clearance 3mm from front and rear edge of board
Board weight < 2 kg
Transport direction Standard left to right
Optional right to left