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PN 141-400 www.formfactor.com Cryogenic and Vacuum • 12 Revision 57, February, 2023 Probe Station A ccessories T es t In te rf a c e F ee d th r ou ghs 137 19 6 — T r i ax High- V ac u um Fe edth r oug h, DN100 ISO- K Fe…
PN 141-400 www.formfactor.com Cryogenic and Vacuum • 11
Revision 57, February, 2023 Probe Station Accessories
PLV50 Wafer Carriers
140971 — Universal Carrier, PLV50
Features
• For fixing and handling of wafer, wafer
fragments, and single chips
• Mounting outside vacuum chamber
recommended
• Patented mechanical clamping
system: mechanical clamping from top by leaf springs (top-side
substrate/wafer contact only at the edge)
• Clamping on three substrate sides with simple adjustment to the
device size by slidable third side piece
• Contact plate made of gold-coated copper for good thermal contact
between wafer and chuck
Specifications
• Maximum substrate dimensions:
– 50.8 mm (2 in) (full wafer)
– 100 mm (4 in) (quartered wafer)
– 50.8 x 50.8 mm (2 x 2 in)
• Temperature range: -60° to +200°C (-76° to +392°F)
Compatibility
• PLV50
155-905 — Universal Carrier, PLV50, 300°
Features
• For fixing and handling of wafer, wafer
fragments, and single chips
• Mounting outside vacuum chamber
recommended
• Patented mechanical clamping
system: mechanical clamping from top by leaf springs (top-side
substrate/wafer contact only at the edge)
• Clamping on three substrate sides with simple adjustment to the
device size by slidable third side piece
• Contact plate made of gold-coated copper for good thermal contact
between wafer and chuck
Specifications
• Maximum substrate dimensions:
– 50.8 mm (2 in) (full wafer)
– 100 mm (4 in) (quartered wafer)
– 50.8 x 50.8 mm (2 x 2 in)
• Temperature range: -60° to +200°C (-76° to +392°F)
Compatibility
• PLV50
141246 — Universal Carrier, HF-Ready, PLV50
Features
• For fixing and handling of wafer,
wafer fragments, single c hips, and
up to four (4) HF calibration
substrates
• Mounting outside vacuum
chamber recommended
• Patented mechanical clamping system: mechanical clamping from
top by leaf springs (top-side substrate/wafer contact o nly at the
edge)
• Clamping on three substrate sides with simple adjustment to the
device size b y slidable third side piece
• Contact plate made of gold-coated copper for g ood thermal contact
between wafer and chuck
Specifications
• Maximum substrate dimensions:
– 50.8 mm (2 in) (full wafer)
– 100 mm (4 in) ( quartered wafer)
– 50.8 x 50.8 mm (2 x 2 in)
• Temperature range: -60° to +200°C (-76° to +392°F)
Compatibility
• PLV50
147917 — Wafer Carrier, 100 mm, PLV50
Features
• For mou nting, fixing and han dling of
SEMI s tandard 100 mm wafers with
Vacuum probe stations
• For use with temperature controlled
chuck systems up to 200°C
• Mounting outside vacuum chamber
recommended
• Patented mechanical wafer clamping: mechanical clamping from
top by a ring s haped leaf spring (top-side wafer contact only at the
edge)
• Contact plate made of nickel/gold coated OFHC copper for be st
heat contact between wafer and chuck
Specifications
• Temperature range: -60° to +200°C (-76° to +392°F)
Compatibility
• PLV50
PN 141-400 www.formfactor.com Cryogenic and Vacuum • 12
Revision 57, February, 2023 Probe Station Accessories
Test Interface Feedthroughs
137196 — Triax High-Vacuum Feedthrough, DN100 ISO-
K
Features
• 4 pcs. hermetically sealed bulk
feedthrough type W.W. Fischer WDE103
on 10 0 mm flange
• 4 pcs. low-noise triax cable 2 m (6.5 ft)
Compatibility
• PMC200, PMV200, PLV50
137495 — High-Vacuum 4x-HF Feedthrough, DN50KF
40GHz 2.92
Features
• Four pcs. hermetically sealed
electrical bulkhead feedthroughs
on a DN50-KF flange for DC to
40 GHZ 2.92 connector
Compatibility
137998 — Two SUB-D (50 PIN) Electrical Feedthrough
on DN100 HV Flange
Features
• High vacuum electrical feedthrough
of 100 pins, grouped to two 50-pin
Sub-D female - female connectors
integrated into DN100 flange
• Includes wire harnesses of 2x 40 high
vacuum proof cables for connection
to probe card
Compatibility
• PMC200, PMV200, PLV50
• PMC200, PMV200, PLV50
141182 — SMA 50 Ohm Feedthrough, DN50 KF
Features
• Flange plate made from plastics
for individually electrically
isolated feedthroughs
• Female - female
Compatibility
• PMC200, PMV200, PLV50
141257 — Vacuum Rotary Feedthrough for VCP110
Features
• Manipulation of on e
VCP110 from outside
vacuum chamber
• Consists of mechanical
feedthrough drive and adaptation to VCP110
Compatibility
• PMC200, PMV200, PLV50
PN 141-400 www.formfactor.com Replaceable Probe Tips, DC Cables, and Adapters • 13
Revision 57, February, 2023 Probe Station Accessories
Replace able Probe Tips, DC Cables, and Adapters
Replaceable Probe Tips
138-020 — Edge Sense Single Blade Ceramic Needle
Features
• Edg e Sense
• Single b lade ceramic ne edle
Specifications
• For DCP-HTR probe body
Kit Contents
• Box of 5
Compatibility
• CM300xi, Elite 300, Summit, M150, S300, Alessi
DCP Replacement Tips
Features
• High performance probe t ips
for modeling a nd
characterization work
• Easily replaceable
• Durable
Specifications
• Tip material for DCP-1xxR
DC coaxial probes: tungsten
• Tip diameters shown below
Kit Contents
• 10 tips per set
Compatibility
• CM300xi, PA/PM, MicroAlign, Elite
300, Summit, M150, S300, Alessi
Ordering Information
DCP-HTR Replacement Tips
Features
• Standard ceramic probe blade
• 7 degree angle
• For use with Att oGuard
Specifications
• For DCP-HTR probe body: 19 µm
(0.75 mils) diameter
• 10 µm (0.39 mils) diameter
Kit Contents
• Box of 10
Compatibility
• CM300xi, PA/PM, MicroAlign, Elite 300, Summit, M150, S300,
Alessi
Ordering Information
PTC-12-25 — Specialty Probe Tip, Tungsten Carbide
Features
• Tungsten carbide tip
Specifications
• 1.2 µm (0.05 mi ls)
• Straight
Kit Contents
• 25 tips per set
Compatibility
• CM300xi, PA/PM, MicroAlign, Elite 300, Summit, M150, S300,
Alessi
Part
Number
Size
Compatibili
ty
107-157 1.5 µm (0.06 mils) DCP-115R
107-158 5.0 µm (0.2 mils) DCP-150R
107-159 0.5 µm (0.02 mils) DCP-105R
Part
Number
Tip Radius
154-001 19 µm (0.75 mils)
154-003 10 µm (0.39 mils)