ASM_catalogue_ASM_Stencils_from_the_global_No_1_EN_210419.pdf - 第10页
DEK Electroform 3D stencils DEK Electroform 3D stencils ensure highest print quality and throughput for jobs that require printing with different height levels and into indentations. DEK Electroform 3D stencils are singl…
3D printing
Applications:
■ Semiconductor packaging
- Wafer and substrate bumping
- Ball placement
- Leadframe printing
- Low-Temperature Co-fired Ceramics (LTCC)
- Die attach
■ LED Printing
- LED leadframe printing
- Flux printing for flip-chip mounting
- Phosphor layer printing on wafer die or over flip chip die
- Piece parts
■ 3D printing on wafers, substrates
■ Surface-mount assembly
- Standard SMT printing
- VAHT stencils – variable height on different apertures
- 3D stencils – print apertures on different levels; cover
components and print around the covered area
■ Piece Parts
- Electrical test probes
- Electro-mechanical parts
- Multiple other parts such as foils and sieves
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DEK Electroform 3D stencils
DEK Electroform 3D stencils ensure highest print quality and throughput for jobs
that require printing with different height levels and into indentations.
DEK Electroform 3D stencils are single thickness stencils
produced to accommodate mass imaging of surfaces that are
not at or include features or structures that would prohibit
conventional one-pass printing.
Well-suited for printing inside cavities or cover printing on pre-
populated substrates, 3D stencils allow higher throughput and
lower costs through the elimination of secondary printing or
dispensing steps.
Benets:
■ Enables single pass printing for challenging, non-flat or pre-
populated substrates
■ Lowers cost by eliminating traditional secondary printing or
dispensing steps used to accommodate positive or negative
Z axis values
■ Improves production throughput
■ Can be manufactured to conform to any shape or topography
■ Better uniformity and deposit shape control than with
dispensing processes
Specications:
■ Special, (usually) supplied slotted squeegee required
■ Proven for a variety of different applications
- LED cavity printing
- SMT multi-level printing
- SMT ceramic substrate cavity printing
- Semiconductor printing to accommodate wafer embossment
- Semiconductor die top printing
■ Stencil frame size: DEK VectorGuard
TM
Classic or
DEK VectorGuard
TM
High Tension 23” x 23” recommended
■ Stencil foil thickness: 50 µm - 250 µm (2 mil-10 mil)
■ Pocket size: 2.0 mm square (min)
■ Pocket depth: 2.0 mm (max, depending on pocket size)
■ Pocket to pocket gap allowance: 2.5 mm (min)
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Process Support Products
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ASM: Stencils from the global No. 1
Electroform stencils can be produced with modications to
accommodate specic applications. One such adaptation is a
technique called Variable Aperture Height Technology (VAHT),
whereby a gasket overgrowth is created around apertures to
create more aperture height to allow for increased paste volumes
to be deposited.
VAHT is ideal for PCBs that incorporate both small and large
components that require varying amounts of solder material.
Aperture gasket height can be 1 to 2 mils higher than the base
stencil thickness.
DEK Electroform Variable Aperture
Height Technology (VAHT)
DEK VAHT technology offers a unique alternative to multi-level stencils for non-
homogeneous assemblies that call for larger, area-specific paste volumes to
accommodate bigger components.
Benets:
■ Ideal for heterogeneous assemblies, allowing printing of
various solder paste volumes with a single stencil
■ Improved throughput
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