ASM_catalogue_ASM_Stencils_from_the_global_No_1_EN_210419.pdf - 第15页
15 NanoClear ® stencil coating Features and benets: ■ Increases efficiency - Reduces the frequency of cleaning - Allows time for more production or SPI ■ Reduces cost - Less cleaning uses less USC fabric and solvent - L…
DEK NanoUltra stencil coating
Benets:
■ Coating applied to the bottom surface of the
stencil and to the aperture walls for optimized print
performance
■ Significantly reduces understencil cleaning
frequency requirements, lowering costs and
improving throughput
■ Delivers superior print definition for area ratios
below 0.6
■ Increases transfer efficiency by 10% to 40%
depending on area ratio
■ Reduces solder paste bridging
■ Encourages more uniform solder paste deposits
■ Colored coating provides visual confirmation of
coverage, as opposed to clear wipe-on nano
coatings
■ Micron-thick coating lasts longer compared to
wipe-on nano solutions
■ Non-ionic, not conductive, and chemically inert
■ ECHA REACH, RoHS and RoHS 2 compliance
■ Recommended stencil materials: Fine Grain and
stainless steel
TECHNICAL SPECIFICATIONS
Properties Values
Appearance Gold or red
Thickness of coating 2 to 4 micron
Specific gravity @ 25C 1.5 g/cm
3
Static contact angle, water 103 - 105°
Static contact angle, n-hexadecane 62 - 64°
Abrasion resistance, ASTM D2486, isopropyl alcohol > 2000 cycles
Abrasion resistance, ASTM D2486, IPA based flux > 2000 cycles
Pencil hardness > 9 H
Resistivity > 10 x 10
12
ohm-M
Ionic residues (ROSE) 0 μg of NaCl / liter
Ionic species on board (as received) None detected
Ionic species on board (after reflow) None detected
Applied upon completion of the stencil manufacturing process, DEK NanoUltra
fluxophobic stencil coatings deliver stencil underside and aperture coating
for maximum material transfer efficiency and optimized understencil cleaning
performance.
DEK NanoUltra STENCIL COATING
Part number Description
SAP DEK
03137311 800109 Europe
03137312 800110 Americas
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NanoClear® stencil coating
Features and benets:
■ Increases efficiency
- Reduces the frequency of cleaning
- Allows time for more production or SPI
■ Reduces cost
- Less cleaning uses less USC fabric and solvent
- Less expensive than alternative wipe-on coatings
- Easy to apply to new or existing stencils
- Chemically inert when dry to ensure no possible
interaction with paste
- Forms a permanent bond and can be reapplied
as it only adheres to uncovered areas
- REACH compliant
- Compatible with stainless steel or nickel stencils
- One pouch will coat one stencil (measuring up to
29“ x 29”)
NanoClear
®
STENCIL COATING
Part number Description
SAP DEK
03128620 431800 Box of 10 wipes
Self-applied fluxophobic stencil coating technology delivers high performance
stencils in a cost-effective wipe. Designed to overcome the challenges of smaller
aperture sizes, the NanoClear® coating offers a unique solution to improve cleaning
effectiveness and reduce cleaning frequency.
Functional
tail group
repels ux
Phosphonate
head group
bonds to stencil
5 nm max.
NEW: ASM SmartStencil
ASM SmartStencil is our complete solution for managing the service
life of stencils. It is smart, RFID-based, and transparent. Never again
will the use of outdated stencils hurt the quality and efficiency of your
printing processes.
Declines in tension and surface quality, which are normal as
stencils age, reduce the quality, yield and process stability
of the solder paste printing process. ASM SmartStencil is an
RFID-based solution that provides for the rst time a simple,
convenient, and seamless solution for monitoring the service life
of stencils.
Its core components are ASM-supplied RFID tags which are
applied by the stencil manufacturer – or by the user – to each
stencil to identify it and store basic data about it. DEK printers
equipped with the ASM SmartStencil option record each printing
cycle on the RFID tag even if the stencil is used on dierent lines.
The basic data and print cycles stored on the RFID tags can be
read by DEK printers with the ASM SmartStencil option and by
ASM handheld devices. The ability to store warning thresholds
and maximum values for the number of print cycles makes
seamless process control possible. For example, when the
threshold level is reached, the system can use this information
to order a new stencil. The necessary data can also be stored on
the RFID tag. When the maximum value is reached, the printer
stops the printing process.
Functions and benets
■ Process stability through seamless service life management
■ ASM SmartStencil RFID tags available for stencils from all
manufacturers
■ Customers can apply RFID tags themselves
■ Service life data can be stored on and recalled directly from the
stencil RFID
■ Ability to store a stencil profile (technical data, manufacturer,
reordering data, storage locations, etc.)
■ DEK printer with the ASM SmartStencil option write to the tags
with each print cycle
■ Manual entries possible with the ASM RFID handheld device
■ Customer-definable warning and maximum thresholds
■ Warning threshold optimize ordering processes and in-house
logistics
■ Reaching the maximum threshold stops the printing process; it
can only be overwritten by authorized personnel
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