ASM_catalogue_ASM_Stencils_from_the_global_No_1_EN_210419.pdf - 第14页

DEK NanoUltra stencil coating Benets: ■ Coating applied to the bottom surface of the stencil and to the aperture walls for optimized print performance ■ Significantly reduces understencil cleaning frequency requirements…

DEK PumpPrint™ /

Adhesive stencils

DEK PumpPrint

technology enables a wide range of adhesive patterns to

be successfully deposited using a screen printing platform.

DEK PumpPrint

/ Adhesive stencils enable deposition of

adhesives in a single stroke, as opposed to the slower, serial

process of dot dispensing systems. With adhesive printing,

throughput is dramatically increased and cycle time is constant.

Also eective for certain solder applications, DEK PumpPrint

stencils can be utilized for solder deposition around through-hole

component leads or into the base of deep packages.

DEK PumpPrint

/ Adhesive stencils are constructed of an

acrylic material and available in standard thicknesses of 1.0

mm to 3.0 mm, or up to 8 mm for special applications. Printing

through accurately machined apertures, deposit heights from

75 µm to 1 mm can be achieved. Specially designed DEK

PumpPrint

stencils are also available for use with the DEK

VectorGuard

Classic stencil frame system.

Features and benets:

■ Significantly improved throughput, efficiency, and flexibility

compared to traditional adhesive dispensing

■ Nozzle changeovers eliminated

■ Allows re-deployment of existing resources

■ Underside routing clears components, cut and clinched

through-hole leads, paste and solder mask

■ Stencils are lightweight and solvent-resistant

■ Available for the DEK VectorGuard

Classic stencil frame

system

DEK NanoUltra stencil coating

Benets:

■ Coating applied to the bottom surface of the

stencil and to the aperture walls for optimized print

performance

■ Significantly reduces understencil cleaning

frequency requirements, lowering costs and

improving throughput

■ Delivers superior print definition for area ratios

below 0.6

■ Increases transfer efficiency by 10% to 40%

depending on area ratio

■ Reduces solder paste bridging

■ Encourages more uniform solder paste deposits

■ Colored coating provides visual confirmation of

coverage, as opposed to clear wipe-on nano

coatings

■ Micron-thick coating lasts longer compared to

wipe-on nano solutions

■ Non-ionic, not conductive, and chemically inert

■ ECHA REACH, RoHS and RoHS 2 compliance

■ Recommended stencil materials: Fine Grain and

stainless steel

TECHNICAL SPECIFICATIONS

Properties Values

Appearance Gold or red

Thickness of coating 2 to 4 micron

Specific gravity @ 25C 1.5 g/cm

Static contact angle, water 103 - 105°

Static contact angle, n-hexadecane 62 - 64°

Abrasion resistance, ASTM D2486, isopropyl alcohol > 2000 cycles

Abrasion resistance, ASTM D2486, IPA based flux > 2000 cycles

Pencil hardness > 9 H

Resistivity > 10 x 10

ohm-M

Ionic residues (ROSE) 0 μg of NaCl / liter

Ionic species on board (as received) None detected

Ionic species on board (after reflow) None detected

Applied upon completion of the stencil manufacturing process, DEK NanoUltra

fluxophobic stencil coatings deliver stencil underside and aperture coating

for maximum material transfer efficiency and optimized understencil cleaning

performance.

DEK NanoUltra STENCIL COATING

Part number Description

SAP DEK

03137311 800109 Europe

03137312 800110 Americas

Process Support Products

ASM: Stencils from the global No. 1

NanoClear® stencil coating

Features and benets:

■ Increases efficiency

- Reduces the frequency of cleaning

- Allows time for more production or SPI

■ Reduces cost

- Less cleaning uses less USC fabric and solvent

- Less expensive than alternative wipe-on coatings

- Easy to apply to new or existing stencils

- Chemically inert when dry to ensure no possible

interaction with paste

- Forms a permanent bond and can be reapplied

as it only adheres to uncovered areas

- REACH compliant

- Compatible with stainless steel or nickel stencils

- One pouch will coat one stencil (measuring up to

29“ x 29”)

NanoClear

STENCIL COATING

Part number Description

SAP DEK

03128620 431800 Box of 10 wipes

Self-applied fluxophobic stencil coating technology delivers high performance

stencils in a cost-effective wipe. Designed to overcome the challenges of smaller

aperture sizes, the NanoClear® coating offers a unique solution to improve cleaning

effectiveness and reduce cleaning frequency.

Functional

tail group

repels ux

Phosphonate

head group

bonds to stencil

5 nm max.