【IPC-7095C】_BGA设计与组装工艺的实施_（IPC标准）.pdf - 第164页
Theo I. Eijm, Albert Holliday , Frank E. Bader and Steven Gahr . A T & T Bell Laboratories, Princeton, J. “Designed Experiment to Determine Attachment Reliability Drivers for PBGA Packages.” ‘ ‘Thermal and Power Cyc…
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Theo I. Eijm, Albert Holliday, Frank E. Bader and Steven
Gahr. AT&T Bell Laboratories, Princeton, J. “Designed
Experiment to Determine Attachment Reliability Drivers
for PBGA Packages.”
‘‘Thermal and Power Cycling Limits of Plastic Ball Grid
Array (PBGA) Assemblies,” Robert Darveaux and
Andrew Mawer, Motorola.
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附录A
减少空洞发⽣的⼯艺控制特性描述
就焊球中空洞及空洞百分比而言，更需关注空洞的位置。没有证据或经验数据表明焊球中的空洞会导致失效。焊球
与封装基板界面以及焊球与PCB界面的空洞更易导致焊点产生裂纹。这是因为纹裂（如发生）通常会发生在界面，
并且空洞会提供（适时地）路径而加速开裂。
空洞对最终产品影响的决定，可最
佳地以如图A-1所示的流程图表述。纠正措施指标见表A-1到A-3。
IPC-7095c-a-1-cn
图A-1 典型空洞评估流程图
Yes
No
No
Yes
PCA
组装
No
BGA
检验
BGA
通过检验标准
No
Yes
BGA 出货
Yes
检验
PCA
是否存在焊球空洞尺寸大
于所允许空洞最大值？
抽检元器件批
焊球空洞超出允许百分比？
无需工艺措施
依据产品级别采取恰
当的纠正措施
更换
BGA
并抽检组件批
空洞焊球超出允许百分比
PCA出货
无需工艺措施
依据产品级别采取恰
当的纠正措施
注意：空洞检测的抽样率由产品的要求决定
2013年1月 IPC-7095C-C
151