X-Serie S_705.pdf - 第19页

19 Placement heads Standard functions / options SIPLACE SpeedStar (C&P20 P) SIPLACE MultiStar (CPP ) S t andard- functions High-resolution camera, vacuum sensor , force measurement, component sensor , integrated turn…

Placement heads

Overview

Head modularity

The SIPLACE placement

machines are distinguished

by maximum flexibility in the

production process. This

flexibility is in part due to the

head modularity of the place-

ment machines, which allows

different placement head

variants to be configured to

suit the production require-

ments.

Collect&Place principle

The SIPLACE SpeedStar

operates according to the

Collect&Place principle i.e.

one cycle includes pickup or

"collection" of 20 compo-

nents, their optical centering

on the board and their rota-

tion into the required place-

ment angle and position.

They are then placed gently

and accurately onto the PCB.

This principle is particularly

suitable for high-speed

placement of standard

components.

Pick&Place principle

The high precision SIPLACE

TwinStar, which consists of

two Pick& Place modules of

identical design, coupled to

one another, functions

according to the Pick&Place

principle. Two components

are picked up by the place-

ment head, optically cen-

tered on the way to the

placement position and

rotated into the necessary

placement angle. This princi-

ple is ideally suitable for fast

and precise placement of

special components in the

fine pitch or super fine pitch

field, plus complex and

heavy components which

may need grippers.

Mixed mode

The new SIPLACE MultiStar

uses both the Collect&Place

and the Pick&Place princi-

ple.

Mixed Mode allows com-

bined use of these two

modes, which were previ-

ously separated from one

another, in one placement

cycle.

Control and self-learning

functions

The reliability of the

SIPLACE placement heads

can be enhanced even fur-

ther with various checking

and self-learning functions.

• Component sensor

Checks the presence of

the components on the

nozzle before the pickup

and placement process

• Digital camera

Checks the position of

each component on the

nozzle. This check is per-

formed in a single step,

with no extra time involved

but with optimum scan-

ning of each individual

component.

• Force sensor

Monitors the prescribed

component set-down

force. The sensor stop

procedure enables com-

pensation of height differ-

ences during pickup and

PCB warpage during

placement.

• Vacuum sensor

Checks whether the com-

ponent was correctly

picked up or placed.

Placement heads

Standard functions / options

SIPLACE SpeedStar (C&P20 P) SIPLACE MultiStar (CPP)

Standard-

functions

High-resolution camera, vacuum

sensor, force measurement,

component sensor, integrated

turning station per segment,

PCB warpage check, individual

image of each component

Standard-

functions

High-resolution camera, vac-

uum sensor, force measure-

ment, component sensor,

integrated turning station per

segment, PCB warpage check,

individual image of each com-

ponent

Options Nozzle changer, special nozzles Options Nozzle changer, special noz-

zles, stationary fine-pitch cam-

era

SIPLACE TwinStar (TH)

Standard-

functions

Stationary fine pitch camera,

vacuum sensor, force measure-

ment, nozzle changer, PCB

warpage check, individual image

of each component

Options Stationary flip chip camera, spe-

cial nozzles, grippers

Placement heads

SIPLACE SpeedStar (C&P20 P)

With component camera

type 23

With component camera type

Component range

a) Please note that the placeable component range is also affected by the pad geometry, the customer-spe-

cific standards, the component packaging tolerances and the component tolerances.

01005 to 2220, Melf, SOT,

SOD

03015 mmto 2220, Melf, SOT,

SOD, Bare-Die, Flip-Chip

Component spec.

Max. height

Min. lead pitch

Min. lead width

Min. ball pitch

Min. ball diameter

Min. dimensions

Max. dimensions

Max. weight

4 mm

0.25 mm

0.1 mm

0.4 mm

0.2 mm

0.4 mm x 0.2 mm

6 mm x 6 mm

1 g

4 mm

0.08 mm

0.03 mm

0.10 mm

0.05 mm

0.12 mm x 0.12 mm

6 mm x 6 mm

1 g

Programmable set-down

force

1.3 - 4.5 N 1.3 - 4.5 N

Nozzle types 40xx 40xx

X/Y accuracy

b) The SIPLACE benchmark value is measured during the machine acceptance tests. It corresponds to the

conditions set out in the SIPLACE scope of service and supply.

± 36 µm/3

± 48 µm/4

± 36 µm/3

± 48 µm/4

Angular accuracy ± 0.5° / 3

± 0.7° / 4

± 0.5° / 3

± 0.7° / 4

Illumination level 5 5

Possible illumination

level settings

256