X-Serie S_705.pdf - 第48页
48 Vision sensor technology PCB position recognition Bad board recognition Ink spot criteria Methods • Synthetic fiducial recogn ition method • Mean gray scale value • Histogram method • Template matching Shapes and size…

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Vision sensor technology
PCB position recognition
Description
The optimum fiducial shapes
vary according to the condi-
tion of the surface. When
using bare copper surfaces
with low oxidation, it is advis-
able to take the single cross,
as the high amount of infor-
mation provided helps
achieve the greatest
accuracy. Rectangle, square
and circle are less "informa-
tive" but save space and can
even be used when oxidation
is at an advanced stage. Cir-
cle or square are advisable
for tin-plated structures as
the ratio of the fiducial
dimensions to the presolder
thickness is particularly
favorable.
Fiducial criteria
Locate 2 fiducials
Locate 3 fiducials
X-/Y-position, rotation angle, mean PCB distortion
additional: shearing, distortion separately in X and Y direc-
tion
Fiducial shapes Synthetic fiducials: circle, cross, square, rectangle, dia-
mond, circular, square and rectangular contours, double
cross, pattern: any
Fiducial surface
Copper
Tin
Without oxidation and solder resist
Warpage of fiducial 1/10 of structure width, both with good
contrast to environment
Dimensions of patterns
min. size
max. size
0.5 mm
3 mm
Fiducial environment Clearance around reference fiducial not necessary if there
is no similar fiducial structure in the search area
Dimensions of synthetic fiducials
Min. X/Y size for circle and rectangle 0.25 mm
Min. X/Y size for annulus and rectangle 0.3 mm
Min. X/Y size for cross 0.3 mm
Min. X/Y size for double cross 0.5 mm
Min. X/Y size for diamond 0.35 mm
Min. frame width for annulus and rectangle 0.1 mm
Min. bar width / bar distance for cross, double-cross 0.1 mm
Max. X/Y size for all fiducial shapes 3 mm
Max. bar width for cross/double-cross 1.5 mm
Minimum tolerances generally 2% of nominal dimension
Max. tolerances generally 20% of nominal dimension

48
Vision sensor technology
PCB position recognition
Bad board recognition
Ink spot criteria
Methods • Synthetic fiducial recognition method
• Mean gray scale value
• Histogram method
• Template matching
Shapes and sizes of fiducials/structures for
synthetic fiducials
other methods
For dimensions of synthetic fiducials, see page
47
min. 0.3 mm
max. 5 mm
Masking material Good coverage
Recognition time Depends on the method: 20 ms - 200ms
Description
In the cluster technology
each subpanel is assigned
an inkspot. If this is present
during the measurement via
the PCB vision module, the
corresponding subpanel is
populated. This function
helps prevent unnecessary
costs caused by placement
of defective panels.
Technical data for PCB position detection
PCB fiducials
Local fiducials
Library of bad panel recognition
Up to 3 (subpanels and multiple panels)
Up to 6 for the long board option (optional PCB fiducials
are output by the optimization.)
Up to 2 per PCB (may be of different type)
Up to 255 fiducial types per subpanel
Image analysis Edge detection method (singular feature) based on gray
scale values
Illumination type Front lighting
Fiducial recognition time 0.1 s
Field of vision 5.78 mm x 5.78 mm
Virtual inkspot handler (option)
The virtual inkspot handler allows you to scan in inkspots from an external system. These ink-
spots can then be allocated to the relevant board.

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03015/01005 Placement
In its standard version, the
SIPLACE X-Series is
designed for placement of
03015 (0.3 mm x 0.15 mm)
and 01005 components (0.4
mm x 0.2 mm).
The SIPLACE component
library already contains the
contours and dimensions of
03015 or 01005 compo-
nents. Specially developed
component nozzles of type
1005 are also available for
the SIPLACE X-Series.
These are adjusted to the
shape and size of the 03015
or 01005 components and
have - as with all other
SIPLACE nozzles - a highly
wear-proof ceramic tip and
flexible nozzle seat. This
guarantees maximum preci-
sion and process reliability.
Optimized pickup is guaran-
teed by the ideal feeding
conditions in the SIPLACE X
feeder module. The smaller
the elements to be picked up,
the more accurate the pickup
needs to be.
Pickup is performed contact-
free to compensate minor
inaccuracies e.g. from com-
ponent or pocket tolerances
and to prevent mechanical
damage to the components.
The design of the SIPLACE
X feeder modules takes this
problem into account: new
motors and the reduced use
of fine mechanics help. Small
components can be placed
without performance loss
with minimum pitch and irre-
spective of the larger compo-
nents which are next to the
03015 or 01005 component.
This equates to
true 03015 or 01005 capa-
bility. As a rule with 03015 or
01005 placement, a finely
tuned overall process is the
basic requirement if you want
to achieve excellent results.
All the process parameters
must be optimized. The
SIPLACE team will be
pleased to advise you on
how to do this.
03015/01005 measurement
results and ambient condi-
tions
As the dpm values and
pickup rates for 03015 or
01005 placement depend
greatly on the respective
measuring conditions, it is
not advisable to specify
these without considering the
corresponding ambient con-
ditions.
The following table shows typical values for 01005 placement,
which can be achieved with a SIPLACE X4i S, provided the
relevant underlying conditions are fulfilled:
Machine type SIPLACE X4i S
Placement head SpeedStar with component camera
type 23
MultiStar with component camera
type 30
Nozzle type 4008 (SpeedStar)
2005 (MultiStar)
Feeder module type 4mm SIPLACE X feeder module
or
8mm SIPLACE X feeder module
or
2x8mm SIPLACE X feeder module
Station software From 707.1
SIPLACE Pro From 11.2
Pickup rate 99,97%
Dpm rate 5
Pad width 200 µm
Pitch 100 µm
Components (L x W x H) 400 µm x 200 µm x 200 µm (±20 µm)
Number of pixels for a
01005 component
275
Solder paste type 5
Te m
p
late thickness 60
µ
m