presentazione_laboratorio.pdf - 第11页
Packaging Sector Ultrasonic Gold Ball Bonder (K&S 4124). Disco DAD 2H-6T
Inspection Sector
• Olympus MX50 microscope
• Leitz MPV-SP Interferometer for thickness control.
• 4 point Napson RT8-8 for resistivity control.
• Plasmos SD 2300 Ellipsometer for refraction index control
Packaging Sector
Ultrasonic Gold Ball Bonder
(K&S 4124).
Disco DAD 2H-6T
testing
Automatic wafer-level tester
cassette-to-cassette, double-side testing, automatic sorting &
inking, HP 4062UX + EG2001CX - custom modified for double-
side wafer testing
Manual Probe Station
Karl Suess PM8
Electro-optical test system