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testing Automatic wafer-level tester cassette-to-cassette, double-side testing, automatic sorting & inking, HP 4062UX + EG2001CX - custom modified for double- side wafer testing Manual Probe Station Karl Suess PM8 El…

Packaging Sector

Ultrasonic Gold Ball Bonder

(K&S 4124).

Disco DAD 2H-6T

testing

Automatic wafer-level tester

cassette-to-cassette, double-side testing, automatic sorting &

inking, HP 4062UX + EG2001CX - custom modified for double-

side wafer testing

Manual Probe Station

Karl Suess PM8

Electro-optical test system

New Equipments

Now in clean room

• PECVD STS for nitride and oxide deposition

• Tegal 6510 dry etch system for metal and poly&nitride

Plan for the next tree years

• Stepper

• wafer bonder

• dry etch system for metal

• deep RIE

• Boron deposition from solid source