presentazione_laboratorio.pdf - 第4页

Clean Room Fabrication: the Lab. covers an area of 500 sqm (250 of wh ich are in class 10) • Furnaces 11 horizontal furnaces (d iffusion,LPCVD depositions, Si3N4, Polysilicon, TEOS, BPSG and LTO) • Implanter “Varian E 22…

Low temperature Wafer Bonding

MEMS Technological fabrication modules

Silicon anisotropic etching with TMAH solution

Composite suspended membranes

Lithography with thick film of photoresist

Gold Electrodeposition

Clean Room

Fabrication: the Lab. covers an area of 500 sqm (250 of

which are in class 10)

• Furnaces 11 horizontal furnaces (diffusion,LPCVD depositions, Si3N4,

Polysilicon, TEOS, BPSG and LTO)

• Implanter “Varian E 220 medium current”

• Lithographic Sector : Mask Aligner A “Karl Suss MA 150 BSA” and Resist

processing systems “SVG 8600” and “EVG 150”.

• Etching Sector: Wet etching and Dry etching (Aluminium, Silicon

dioxide Silicon nitride, Polysilicon etching)

• Metalization: Varian 3180 sputtering and Ulvac EBX-16C evaporator

• Dicing Disco DAD 2H-6T

Testing

• HP 4062UX + EG2001CX - custom modified for double-side wafer

• Karl Suess PM8 - custom modified for double-side wafer testing

Lithographic Sector

Mask Aligner A “Karl Suss MA 150 BSA”

Resist processing systems “SVG 8600” and “EVG 150”.