presentazione_laboratorio.pdf - 第13页
New Equipments Now in clean room • PECVD STS for nitride and oxide deposition • Tegal 6510 dry etch system for metal and poly&nitride Plan for the next tree years • Stepper • wafer bonder • dry etch system for metal …
Packaging Sector
Ultrasonic Gold Ball Bonder
(K&S 4124).
Disco DAD 2H-6T
testing
Automatic wafer-level tester
cassette-to-cassette, double-side testing, automatic sorting &
inking, HP 4062UX + EG2001CX - custom modified for double-
side wafer testing
Manual Probe Station
Karl Suess PM8
Electro-optical test system
New Equipments
Now in clean room
• PECVD STS for nitride and oxide deposition
• Tegal 6510 dry etch system for metal and poly&nitride
Plan for the next tree years
• Stepper
• wafer bonder
• dry etch system for metal
• deep RIE
• Boron deposition from solid source