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Low temperature Wafer Bonding MEMS Technological fabrication modules Silicon anisotropic etching with TMAH solution Composite suspended membranes Lithography with thick film of photoresist Gold Electrodeposition

MIS Microsystems

Head of Department: Mario Zen

The department designs and realises silicon

microsystems, especially:

• silicon particle detectors;

• sensors for bio-medical and environmental

applications;

• micro-electro-mechanic systems (MEMS) for

industrial and consumer applications;

• electro-optic microsystems for vision and non-

destructive measurements.

Low temperature Wafer Bonding

MEMS Technological fabrication modules

Silicon anisotropic etching with TMAH solution

Composite suspended membranes

Lithography with thick film of photoresist

Gold Electrodeposition

Clean Room

Fabrication: the Lab. covers an area of 500 sqm (250 of

which are in class 10)

• Furnaces 11 horizontal furnaces (diffusion,LPCVD depositions, Si3N4,

Polysilicon, TEOS, BPSG and LTO)

• Implanter “Varian E 220 medium current”

• Lithographic Sector : Mask Aligner A “Karl Suss MA 150 BSA” and Resist

processing systems “SVG 8600” and “EVG 150”.

• Etching Sector: Wet etching and Dry etching (Aluminium, Silicon

dioxide Silicon nitride, Polysilicon etching)

• Metalization: Varian 3180 sputtering and Ulvac EBX-16C evaporator

• Dicing Disco DAD 2H-6T

Testing

• HP 4062UX + EG2001CX - custom modified for double-side wafer

• Karl Suess PM8 - custom modified for double-side wafer testing