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Introduction General 24 Touchless Placement (R17-1) Berührungsloses Bestücken (R17-1) 1.1 1 . 1 G e n e r a l General 1.1.1 1 . 1 . 1 S y m b o ls / N o t e s Symbols / Notes Different symbols and notes have been used to…

Introduction

Touchless Placement (R17-1) Berührungsloses Bestücken (R17-1) 23

1 Introduction

Introduction

This manual describes the concept of components used for touchless placement and how to work with

them. We recommend that you read through it once you are familiar with the main features in SIPLACE

Pro and the station software. You will find all important information about the relations and the individual

procedures with touchless component placement here.

The contents of this manual address the following user groups:

▪ Operator

The operator has completed appropriate training and is authorized to carry out tasks on the machine

and line, such as the configuration and refilling of components, setup verification and production

preparation in the pre-setup area.

▪ The line engineer

The line engineer has completed special training and is authorized to carry out tasks, such as the

creation of setup configurations and definition of inspection parameters etc.

▪ The service engineer

Persons of this class have been trained to carry out servicing work, to set up machines and to change

the setup of machines.

CAUTION

Trained and qualified personnel

Only people with the appropriate training for the specific software part may carry out tasks on

the machine. All tasks must be carried out by trained and qualified personnel. All warning, cau-

tion and danger notes MUST be observed!

CAUTION

Contents of this software guide

We would like to draw your attention to the fact that the contents of this software guide are not

part of a previous or existing agreement, commitment or legal contract, neither is this intended

to modify one of the above. All obligations of ASM Assembly Systems GmbH & Co. KG may be

taken from the appropriate sales contract, which also contains a complete and valid warranty

agreement. These contractual statements are neither extended nor restricted by this software

guide.

Introduction

General

24 Touchless Placement (R17-1) Berührungsloses Bestücken (R17-1)

1.1

1.1 General

General

1.1.1

1.1.1 Symbols / Notes

Symbols / Notes

Different symbols and notes have been used to make it easier to read and understand this document.

1.1.2

1.1.2 ASM on the World Wide Web

ASM on the World Wide Web

► You can choose between the German and English versions.

The different sections contain information about our products, services and contact persons.

In addition, registered customers can also access the

SIPLACE User Group

. Here you can call up spe-

cial information about our placement systems, e.g.

▪ Technical documentation,

▪ Technical information,

▪ Spare parts lists etc.

Registration for the user group is very simple:

► Click on the Register link.

► Fill in the registration form and send it off to us.

Soon afterwards, you will receive your access authorization with USER ID and password.

1.1.3

1.1.3 Release History

Release History

Words in bold/italic print These refer to dialogs, dialog fields, menu items, and

commands.

Step ... Includes all actions to do with a particular dialog. A dia-

log may be composed of several actions ( ).

► Requires an action (e.g. mouse click, open file)

Indicates a warning. The information is essential for

successful working.

Explanatory information.

Edition Changes

06/2017 First edition

What is touchless placement of components?

Prerequisites

Touchless Placement (R17-1) Berührungsloses Bestücken (R17-1) 25

2 What is touchless placement of components?

What is touchless placement of components?

For the placement of highly sensitive components in the chip assembly process, placement without con-

tact can be carried out. For a "touchless" component placement, the placement process Touchless must

be assigned to the component shape. At least three height measurement points must be available on

the boards or grid boards onto which the components are to be placed. The Z height is measured from

the level of these height measurement points.

This process is designed for highly sensitive components and can only be used for boards with high lev-

els of planarity (e.g. with chuck or vacuum tooling).

2.1

2.1 Prerequisites

Prerequisites

▪ SIPLACE Pro version 14.1 or higher

▪ Station software version 710.1 or higher

▪ Planarity of the board for placement (< 20µm)

– Board transport with chuck / vacuum tooling is recommended

▪ Constant component thickness

▪ For C&P 20 A/M/P/M2 placement head