00198376-01_UM_TouchlessPlacement-R17-1_DE_EN.pdf - 第25页
What is touchless placement of components? Prerequisites Touchless Placement (R17-1) Ber ührungsloses Bestücken (R17-1 ) 25 2 2 W h a t is t o u c h le s s p la c e m e n t o f c o m p o n e n t s ? What is touchless pla…
Introduction
General
24 Touchless Placement (R17-1) Berührungsloses Bestücken (R17-1)
1.1
1.1 General
General
1.1.1
1.1.1 Symbols / Notes
Symbols / Notes
Different symbols and notes have been used to make it easier to read and understand this document.
1.1.2
1.1.2 ASM on the World Wide Web
ASM on the World Wide Web
Log in to our homepage at http://www.asm-smt.com.
► You can choose between the German and English versions.
The different sections contain information about our products, services and contact persons.
In addition, registered customers can also access the
SIPLACE User Group
. Here you can call up spe-
cial information about our placement systems, e.g.
▪ Technical documentation,
▪ Technical information,
▪ Spare parts lists etc.
Registration for the user group is very simple:
► Click on the Register link.
► Fill in the registration form and send it off to us.
Soon afterwards, you will receive your access authorization with USER ID and password.
1.1.3
1.1.3 Release History
Release History
Words in bold/italic print These refer to dialogs, dialog fields, menu items, and
commands.
Step ... Includes all actions to do with a particular dialog. A dia-
log may be composed of several actions ( ).
► Requires an action (e.g. mouse click, open file)
Indicates a warning. The information is essential for
successful working.
Explanatory information.
Edition Changes
06/2017 First edition
What is touchless placement of components?
Prerequisites
Touchless Placement (R17-1) Berührungsloses Bestücken (R17-1) 25
2
2 What is touchless placement of components?
What is touchless placement of components?
For the placement of highly sensitive components in the chip assembly process, placement without con-
tact can be carried out. For a "touchless" component placement, the placement process Touchless must
be assigned to the component shape. At least three height measurement points must be available on
the boards or grid boards onto which the components are to be placed. The Z height is measured from
the level of these height measurement points.
This process is designed for highly sensitive components and can only be used for boards with high lev-
els of planarity (e.g. with chuck or vacuum tooling).
2.1
2.1 Prerequisites
Prerequisites
▪ SIPLACE Pro version 14.1 or higher
▪ Station software version 710.1 or higher
▪ Planarity of the board for placement (< 20µm)
– Board transport with chuck / vacuum tooling is recommended
▪ Constant component thickness
▪ For C&P 20 A/M/P/M2 placement head
What is touchless placement of components?
Prerequisites
26 Touchless Placement (R17-1) Berührungsloses Bestücken (R17-1)