HDF Chinese.pdf - 第4页
HDF 2003 年1月1日 HD F 目 录 １ ． 概 要 ·························································································································· １ ２ ． 特 点 ·················…
HDF 2003 年1月1日
有关本规格说明书的注意事项
有关本规格说明书的注意事项有关本规格说明书的注意事项
有关本规格说明书的注意事项
请注意下列各项内容：
1.
不许随便复制或转载本资料的部分或者全部内容。
2.
由于机器和软件的改善，本规格可能会在没有通知的情况下进行更改
,
请周知。
3.
如对本资料有不明之处
,
请与本公司联系。
4.
使用本机器和软件时，请详细了解它们的规格和限制后进行使用。对于由于错误操作所导致的损害，
我们概不承担任何责任。
5.
本资料所记载的商品
(
或技术
)
如果相当于外汇
,
或国际贸易法所规定的限制货物
(
或限制技术
)
的话
,
当
出口
(
或提供技术
)
时
,
需按照本条例获得出口许可
(
或劳务交易许可
)
。
6.
本机也受美国政府再出口条例的限制。当出口时
,
因需要美国政府的出口许可
,
请事先获得出口许
可。
7. EC
机械指定以及
EMC
指定的适合模型以外的商品
,
不准许带入
EC
和贩卖。
8.
本规格说明书所记载的技术情报
,
是为了说明产品的主要动作和应用的资料
,
并不是在使用时
对本公司以及第三者的知识产权以及其他的权利的保证
,
或者实施权的承诺。并且
,
按客户的要求以及
情报本公司所开发出的产品专利等的工业所有权
,
著作权以及涉及到其他无形产权等
,
归本公司保留。
9. Micorosoft,Windows
是美国微软公司在美国以及其他国家的登录商标。
10.
因操作者的操作错误
(
数据输入错误
)
所引起的不良生产
,
成本浪费等
,
作为本系统的提供厂家本公司
,
一概不负任何责任
,
请周知。
11.
当设备转卖
,
或移动时
,
一定与本公司
,
或者贩卖公司
,
代理店联系。
12.
本规格说明书的记载日期为
2003
年
1
月
1
日。
!
安全须知
安全须知安全须知
安全须知
使用前
使用前使用前
使用前请务必详细阅读本规格说
请务必详细阅读本规格说请务必详细阅读本规格说
请务必详细阅读本规格说
明书
明书明书
明书,
,,
,再正确地使用。
再正确地使用。再正确地使用。
再正确地使用。
在本规格说明书上记载的商品是供产业使用的机械设备。
在本规格说明书上记载的商品是供产业使用的机械设备。在本规格说明书上记载的商品是供产业使用的机械设备。
在本规格说明书上记载的商品是供产业使用的机械设备。
请确认附录使用说明书上记载的使用条件。
请确认附录使用说明书上记载的使用条件。请确认附录使用说明书上记载的使用条件。
请确认附录使用说明书上记载的使用条件。
关于设备的安装
关于设备的安装关于设备的安装
关于设备的安装,
,,
,操作
操作操作
操作,
,,
,维修以及对使用材料的处理，必需遵守当地的法律规定。
维修以及对使用材料的处理，必需遵守当地的法律规定。维修以及对使用材料的处理，必需遵守当地的法律规定。
维修以及对使用材料的处理，必需遵守当地的法律规定。
操作和维修本机之前，不管本机处于运转还是停止状态
操作和维修本机之前，不管本机处于运转还是停止状态操作和维修本机之前，不管本机处于运转还是停止状态
操作和维修本机之前，不管本机处于运转还是停止状态,
,,
,需确认
需确认需确认
需确认附录使用说明书和
附录使用说明书和附录使用说明书和
附录使用说明书和
设备的警告标志
设备的警告标志设备的警告标志
设备的警告标志,
,,
,然后再正确地操作或维修设备。
然后再正确地操作或维修设备。然后再正确地操作或维修设备。
然后再正确地操作或维修设备。
一旦疏忽的话，会造成安全功能失效
一旦疏忽的话，会造成安全功能失效一旦疏忽的话，会造成安全功能失效
一旦疏忽的话，会造成安全功能失效,
,,
,酿成人身事故
酿成人身事故酿成人身事故
酿成人身事故,
,,
,触电或设备故障。
触电或设备故障。触电或设备故障。
触电或设备故障。
HDF 2003 年1月1日
HDF
目录
１．概要
··························································································································
１
２．特点
··························································································································
１
３．设 备 规 格
··························································································································
２
１）机 械 规 格
·················································································································
２
２）电 气 规 格
·················································································································
５
４．机 械 结 构
···························································································································
７
１）总体结构图
··················································································································
７
２）涂胶嘴的形状
·············································································································
８
３）被涂布的元器件和涂胶嘴
···································································································
９
５．印制电路板的设计标准
··············································································································
11
１）印制电路板的规格概要
·······································································································
11
２）识别记号的规格
··················································································································
12
６．涂胶嘴偏芯校正功能
··················································································································
13
７．标 准 规 格
··························································································································
14
１）程序设计功能
······················································································································
14
２）三色信号灯灯架亮灯规格
···································································································
15
３）次品记号的识别功能(摄象机方式)
····················································································
15
４）向上兼容能力
······················································································································
15
８．任选项规格
·································································································································
16
１．任选项规格(1)特定
···········································································································
16
１）能够使用的粘接剂(胶)
···································································································
16
２）配置特殊涂胶嘴
··············································································································
16
３）保护气氛的温度调节
·······································································································
18
４）增设程序
·························································································································
18
５）数据输出打印
··················································································································
18
６）NC数据编辑软件
··············································································································
18
２．任选项规格(2)通用
···········································································································
19
１）有关对准基板的任选项功能
····························································································
19
２）次品记号的识别功能(传感器方式)
················································································
22
３）混载生产不同品种的基板
·······························································································
22
４）Panasonic封装软件的向上兼容能力
·············································································
22
５）用户软件的向上兼容能力
·······························································································
22
６）报警蜂鸣器
······················································································································
22
７）SMEMA
·······························································································································
23
８）关于涂布银浆粘接剂(胶)·涂布焊膏
·············································································
23
９．尺寸规格图
·································································································································
24
HDF 2003 年1月1日
1
HDF是一种带识别功能的涂胶装置，它配备3种涂胶嘴，能够高速、高精度地涂布每块印制电路板基板。
高速·高精度涂布
•
由于采用螺旋式涂胶头，因此实现了超高速·高精度涂布(0.07秒/次)。
•
通过调整数据的设定来适应粘接剂(胶)的材料特性，能够控制涂胶头的行程和上下速度，
实现高精度稳定地涂布。
•
由于拥有基板识别功能，因此能够实现高精度地涂胶(位置反复精度±0.1mm以下)。
•
由于采用不受料筒内粘接剂(胶)残存量影响的排出方式，因此防止了流水作业的空打损失，
实现高精度涂布。
操作方便
•
粘接剂(胶)能够简单地装卸，更换方便。
•
HDF能够使用HDPG3、HDPⅡ、HDP(LL)、HDPⅡC、HDP-G1、HDPⅢ、HDPV、
MPA40/80N、MPAⅢ、MPA-G1、MPA-V、MPAVⅡ、MPAG3、MVⅡ、MVⅡC、MVⅡ-F、
MVⅡV、MSH、MSH-G1、MSHⅡ、MSHG3、MSHⅢ、MSR的NC程序，阵列程序元器件保
•
存。
•
NC程序分为两种方式∶根据各种设备NC程序的方式和作为一种分散处理提高NC程
序效率后执行的方式。两种方式均可任意选择。
适应范围广
•
配备3种涂胶嘴(VS、S、L)，因此能够任意地设定涂布量。
•
可进行群点涂布，因此从1608尺寸规格的微型芯片开始一直到大型元器件为止的都能够任意地涂
布。
•
涂布方向范围∶-90°～89°，能够按每1°倾斜度的间隔进行设定。
1.概要
2.特点