HDF Chinese.pdf - 第5页
HDF 2003 年1月1日 1 HDF 是一种带识别功能的涂胶装置，它配备 3 种涂胶嘴，能够高速、高精度地涂布每块印制电路板基板。 高速· 高精度涂布 • 由于采用螺旋式涂胶头 ，因此实现了超高速·高 精度涂布 (0.07 秒 / 次 ) 。 • 通过调整数据的设定来 适应粘接剂 ( 胶 ) 的材料特 性，能够控制涂胶 头的行程和上下速度， 实现高精度稳定地涂布 。 …
HDF 2003 年1月1日
HDF
目录
１．概要
··························································································································
１
２．特点
··························································································································
１
３．设 备 规 格
··························································································································
２
１）机 械 规 格
·················································································································
２
２）电 气 规 格
·················································································································
５
４．机 械 结 构
···························································································································
７
１）总体结构图
··················································································································
７
２）涂胶嘴的形状
·············································································································
８
３）被涂布的元器件和涂胶嘴
···································································································
９
５．印制电路板的设计标准
··············································································································
11
１）印制电路板的规格概要
·······································································································
11
２）识别记号的规格
··················································································································
12
６．涂胶嘴偏芯校正功能
··················································································································
13
７．标 准 规 格
··························································································································
14
１）程序设计功能
······················································································································
14
２）三色信号灯灯架亮灯规格
···································································································
15
３）次品记号的识别功能(摄象机方式)
····················································································
15
４）向上兼容能力
······················································································································
15
８．任选项规格
·································································································································
16
１．任选项规格(1)特定
···········································································································
16
１）能够使用的粘接剂(胶)
···································································································
16
２）配置特殊涂胶嘴
··············································································································
16
３）保护气氛的温度调节
·······································································································
18
４）增设程序
·························································································································
18
５）数据输出打印
··················································································································
18
６）NC数据编辑软件
··············································································································
18
２．任选项规格(2)通用
···········································································································
19
１）有关对准基板的任选项功能
····························································································
19
２）次品记号的识别功能(传感器方式)
················································································
22
３）混载生产不同品种的基板
·······························································································
22
４）Panasonic封装软件的向上兼容能力
·············································································
22
５）用户软件的向上兼容能力
·······························································································
22
６）报警蜂鸣器
······················································································································
22
７）SMEMA
·······························································································································
23
８）关于涂布银浆粘接剂(胶)·涂布焊膏
·············································································
23
９．尺寸规格图
·································································································································
24
HDF 2003 年1月1日
1
HDF是一种带识别功能的涂胶装置，它配备3种涂胶嘴，能够高速、高精度地涂布每块印制电路板基板。
高速·高精度涂布
•
由于采用螺旋式涂胶头，因此实现了超高速·高精度涂布(0.07秒/次)。
•
通过调整数据的设定来适应粘接剂(胶)的材料特性，能够控制涂胶头的行程和上下速度，
实现高精度稳定地涂布。
•
由于拥有基板识别功能，因此能够实现高精度地涂胶(位置反复精度±0.1mm以下)。
•
由于采用不受料筒内粘接剂(胶)残存量影响的排出方式，因此防止了流水作业的空打损失，
实现高精度涂布。
操作方便
•
粘接剂(胶)能够简单地装卸，更换方便。
•
HDF能够使用HDPG3、HDPⅡ、HDP(LL)、HDPⅡC、HDP-G1、HDPⅢ、HDPV、
MPA40/80N、MPAⅢ、MPA-G1、MPA-V、MPAVⅡ、MPAG3、MVⅡ、MVⅡC、MVⅡ-F、
MVⅡV、MSH、MSH-G1、MSHⅡ、MSHG3、MSHⅢ、MSR的NC程序，阵列程序元器件保
•
存。
•
NC程序分为两种方式∶根据各种设备NC程序的方式和作为一种分散处理提高NC程
序效率后执行的方式。两种方式均可任意选择。
适应范围广
•
配备3种涂胶嘴(VS、S、L)，因此能够任意地设定涂布量。
•
可进行群点涂布，因此从1608尺寸规格的微型芯片开始一直到大型元器件为止的都能够任意地涂
布。
•
涂布方向范围∶-90°～89°，能够按每1°倾斜度的间隔进行设定。
1.概要
2.特点
HDF 2003 年1月1日
2
1)机械规格
项目 NM-DC10(M) NM-DC15(XL)备考
尺寸
Ｍａｘ.330×250mm
Ｍｉｎ.50×50mm
Ｍａｘ.510×460mm
Ｍｉｎ.50×50mm
能够使用的基板
厚度 0.5～4.0mm 0.5～4.0mm
采用了基板夹持方式，因此
不需要加以调整
1
能够安装的范围
Ｍａｘ.330×242mm
Ｍｉｎ.50×42mm
Ｍａｘ.510×452mm
Ｍｉｎ.50×42mm
2 基板宽度对应措施
手动移动宽度
自动移动宽度
自动移动宽度(由主操作盘
进行的操作方式)和禁止在
轨道上涂布的功能是属于
配套任选项。
3 基板位置决定方式
由基板识别记号决定位置
没有基板识别记号时，需要对准标准孔(任选项)。
※使用没有基板识别记号也没有标准孔的基板或陶
瓷基板时，需要采取其他方法，欢迎垂询。
4 基板位置决定标准 设备前方一侧的标准或相反方向深处侧的标准
5 能够装载的涂胶嘴个数
最大3种
请根据被涂布的元器件来选择涂胶嘴的种类和个数。
(请参照第8、9、21、22页)
选择Y方向轨道宽度的自动
移动宽度和禁止在轨道上
涂布的功能时(配套任选
项)，必需在用空打程序设
定的粘接剂(胶)罐位置上
装设各种涂胶嘴。装设不正
确会引起干扰。
使用特殊涂胶嘴等时，请在
涂胶嘴数据中设定涂胶嘴
的尺寸规格，用空打程序进
行选择，然后再使用。
6 涂布方向 -90°～89°(1°间隔、空打固定为0°)
备考∶NC程序中在
0～359°的范围内
进行设定。
3.设 备 规 格