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8 Troubleshooting and Process Review 8.1 Identify Causes of Print Defects 56 Process Foundation DEK Micron-Series 12/2017 Incomplete Causes: ……………………………………………………… ……………………………………………………… ……………………………………………………… ……………………………………
8 Troubleshooting and Process Review
8.1 Identify Causes of Print Defects
Process Foundation DEK Micron-Series 12/2017 55
8 Troubleshooting and Process Review
8.1 Identify Causes of Print Defects
It is important that the people responsible for the design and maintenance of the process
understand which areas under their control can have a direct influence on the print quality, how to
identify a defect and to quickly rectify the problem.
Note: This section refers to solder paste related print defects. For other print materials, refer to
the appropriate application modules.
The Perfect Solder Print
Causes:
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Good Alignment
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Good Gasket Seal
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Good Board Support
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Good Stencil Design
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Good Print Material
Well Designed Process (speed, pressure, etc.)
Exercise
For each of the print defects shown below, identify the possible design and/ or process
maintenance causes:
Bridging
Causes:
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8 Troubleshooting and Process Review
8.1 Identify Causes of Print Defects
56 Process Foundation DEK Micron-Series 12/2017
Incomplete
Causes:
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Scooping
Causes:
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Missing Edge
Causes:
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8 Troubleshooting and Process Review
8.1 Identify Causes of Print Defects
Process Foundation DEK Micron-Series 12/2017 57
Excessive Paste
Causes:
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Misalignment
Causes:
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Best Working Practices
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Keep reference material near the printer showing good and bad prints
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Supply troubleshooting guides or flowcharts to aid process recovery
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Record print failures to aid troubleshooting and fault analysis
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Have clearly defined escalation procedures