D3操作手册.pdf - 第4页

4 Electrica l Connec tion, Inte rfaces and Compresse d Air Conne ction 41 Dimensions an d Set-up Conditions 42 Placement System ’s Center of Gravity 43 Maneuvering R adii 44 MTC Dimensions an d Set-Up Conditi ons 44 Spac…

SIPLACE D3

Contents

SIPLACE D3 3

Contents 3

Machine Description 5

Overview 5

Extensions 6

Technical Data 7

Placement Heads 9

Head Modularity 9

12-Nozzle Collect & Place Head for High-Speed Placement 10

6-Nozzle Collect&Place Head for High-Speed IC Placement 11

Collect&Place Heads 12

Technical Data for the C&P Heads 12

TwinHead for High-Precision IC Placement 13

Technical Data for the TwinHead 14

Nozzle Changers (Collect&Place Heads) 15

Nozzle Changer (TwinHead) 16

Technical Data for the Nozzle Changers 17

PCB Conveyor 18

Single Conveyor 18

Technical Data for the Single Conveyor 19

Flexible Dual Conveyor 20

Technical Data for the Dual Conveyor 21

SIPLACE PCB Barcode for Product-Controlled Production (Option) 22

Component Feeding 23

Component Changeover Table 23

Technical Data 24

S Tape Feeder Modules 25

Bulk Case and Vibratory Stick Feeder Modules for the CO Changeover Table 26

Dummy Feeder Modules 27

Waffle-Pack Tray Holder 28

Matrix Tray Changer 29

Technical Data 30

Vision Sensor Technology 32

PCB Position Recognition 32

Bad Board Recognition 34

Position Recognition for Feeder Modules 34

Sample Configuration 35

Technical Data 36

Siemens Signal Interface 36

Connector Assignment 36

Signal Curve 37

SMEMA Interface 38

Connector Assignment 38

Signal Curve 39

Electrical Ratings and Compressed Air Supply 40

Electrical Connection, Interfaces and Compressed Air Connection 41

Dimensions and Set-up Conditions 42

Placement System’s Center of Gravity 43

Maneuvering Radii 44

MTC Dimensions and Set-Up Conditions 44

Spacing Distances for Single Conveyor 45

Spacing Distances for Dual Conveyor 46

Spacing Distances for Placement Machine and MTC 47

Transport and Delivery Configuration 48

Option List 49

SIPLACE D3

Contents

Machine Description

Overview

Description

The SIPLACE D3 placement

system is particularly suit-

able for applications that

demand a high level of flexi-

bility, utmost precision, and

a high placement rate. Two

placement methods are

used:

•the Collect&Place

method for high-speed

placement of standard

components (see diagram

on page 6)

•the Pick&Place method

for fast placement of spe-

cial fine-pitch and super-

fine pitch components

The D3 placement system

has three gantries driven by

linear motors. The gantries

can be quickly and accurately

positioned in the X and Y

directions. There is a place-

ment head on each gantry.

The following placement

head configurations are pos-

sible:

Placement area 1

• two 12-nozzle Collect &

Place heads or

• two 6-nozzle Collect &

Place heads or

• one 6-nozzle and one 12-

nozzle Collect&Place head

Placement area 2

•TwinHead

The head modularity prin-

ciple allows the placement

heads to be reconfigured to

suit changing requirements.

The table "Technical Data" on

page 7 contains a list of the

possible placement head

configurations and the

resulting placement rate.

The moving head picks up

the components from their

stationary feeder, and places

them on the PCB, which is

also stationary. This proven

SIPLACE principle has many

advantages:

• Short down times for refill-

ing or splicing

• Even the smallest compo-

nents are picked up reli-

ably

• The components cannot

slip on the PCB

• Minimal traversing paths

High flexibility, cost-effec-

tiveness and set-up reliability

guarantee that the SIPLACE

D3 placement system will be

highly productive. The mini-

mal down times increase

utilization, thus further in-

creasing productivity.