D3操作手册.pdf - 第6页

6 Placement principle Collect & Plac e Machine Description Extensions Extensions The options availa ble to ex- tend the f unctionality of the placement m achine includ e the following: • Additional component changeov…

Machine Description

Overview

Description

The SIPLACE D3 placement

system is particularly suit-

able for applications that

demand a high level of flexi-

bility, utmost precision, and

a high placement rate. Two

placement methods are

used:

•the Collect&Place

method for high-speed

placement of standard

components (see diagram

on page 6)

•the Pick&Place method

for fast placement of spe-

cial fine-pitch and super-

fine pitch components

The D3 placement system

has three gantries driven by

linear motors. The gantries

can be quickly and accurately

positioned in the X and Y

directions. There is a place-

ment head on each gantry.

The following placement

head configurations are pos-

sible:

Placement area 1

• two 12-nozzle Collect &

Place heads or

• two 6-nozzle Collect &

Place heads or

• one 6-nozzle and one 12-

nozzle Collect&Place head

Placement area 2

•TwinHead

The head modularity prin-

ciple allows the placement

heads to be reconfigured to

suit changing requirements.

The table "Technical Data" on

page 7 contains a list of the

possible placement head

configurations and the

resulting placement rate.

The moving head picks up

the components from their

stationary feeder, and places

them on the PCB, which is

also stationary. This proven

SIPLACE principle has many

advantages:

• Short down times for refill-

ing or splicing

• Even the smallest compo-

nents are picked up reli-

ably

• The components cannot

slip on the PCB

• Minimal traversing paths

High flexibility, cost-effec-

tiveness and set-up reliability

guarantee that the SIPLACE

D3 placement system will be

highly productive. The mini-

mal down times increase

utilization, thus further in-

creasing productivity.

Placement principle

Collect & Place

Machine Description

Extensions

The options available to ex-

tend the functionality of the

placement machine include

the following:

• Additional component

changeover tables in-

crease machine utilization

since set-up times can be

reduced by carrying out

preliminary set-up off the

machine.

• Large and sensitive fine-

pitch components can be

supplied in trays by a

matrix tray changer.

• The dual conveyor also in-

creases machine utiliza-

tion by eliminating non-

productive PCB transport

times.

• Automatic nozzle chang-

ers speed up and optimize

the nozzle configuration

process.

• PCB barcode scanners

allow the production set-

up to be changed over

when triggered by a new

product.

• Component barcode scan-

ners optimize the set-up

and refill checks.

• The productivity lift imple-

ments the concept of par-

allel placement, and thus

improves the ratio be-

tween productive and

non-productive times.

Machine Description

Technical Data

Types of placement head 12-nozzle Collect & Place head (C&P12)

6-nozzle Collect & Place head (C&P6)

SIPLACE TwinHead (TH)

Number of gantries 3 (see Fig. page 9)

Placement head configu-

ration and placement

rate

(Benchmark test)

a) According to the Definition in the SIPLACE Scope of Service and Delivery

Placement area 1 Placement area 2 Placement rate

C&P12 / C&P12 TH 30,100 comp./h

C&P12 / C&P6 TH 24,000 comp./h

C&P6 / C&P12 TH 24,000 comp./h

C&P6 / C&P6 TH 22,000 comp./h

Placement positions 6.000 / gantry for the Collect & Place head

Range of components 0.4 x 0.2 mm² (01005)

, 0.6 x 0.3 mm² (0201)

to 85 x 85 mm² / 125 x 10 mm²

max. 200 x 125 mm² (with restrictions)

b) 01005 optional, from April 2007

c) with 0201 package

Component height C&P12: 6 mm (larger heights on request)

C&P6: 8.5 mm (larger heights on request)

TH: 25 mm

Placement accuracy /

angular accuracy

C&P12: ± 45 μm, ± 0.5° / (3σ), ± 60 μm, ± 0.7° / (4σ)

(standard camera)

C&P12: ± 41 μm, ± 0.5° / (3σ), ± 55 μm, ± 0.7° / (4σ)

(high-resolution camera)

C&P6: ± 45 μm, ± 0.2° / (3σ), ± 60 μm, ± 0.3° / (4σ)

TH: ± 26 μm, ± 0.05° / (3σ), ± 35 μm, ± 0.07° / (4σ)

(Fine-Pitch Camera)

± 22 μm, ± 0.05° / (3σ), ± 30 μm, ± 0.07° / (4σ)

(Flip-Chip Camera)

Component Feeding 4 component changeover tables with tape roll holders and

integral waste containers

15 slots, 30 mm wide per changeover table or matrix tray

changer, rather than a component changeover table

(location 2)

Feeder module types Tapes, bulk cases, stick magazines, application-specific OEM

feeder modules, surftape feeder modules (8, 12, 16 mm),

waffle-pack trays

Feeding capacity 60 tape feeder modules 3 x 8 mm S (180 tracks)

60 tape feeder modules 2 x 8 mm S (120 tracks)

60 tape feeder modules 12/16 mm S (60 tracks)

40 tape feeder modules 24/32 mm S (40 tracks)

28 tape feeder modules 44 mm S (28 tracks)

24 tape feeder modules 56 mm S (24 tracks)

20 tape feeder modules 72 mm S (20 tracks)

16 tape feeder modules 88 mm S (16 tracks)