D3操作手册.pdf - 第8页

8 Machine Description Technical Data PCB format (LxW) PLEASE NOTE: With PCB widths > 450 mm make sure that t he peripheral modules are also able to pr ocess these widths. Single con veyor 50 x 50 mm² t o 450 x 460 mm²…

Machine Description

Technical Data

Types of placement head 12-nozzle Collect & Place head (C&P12)

6-nozzle Collect & Place head (C&P6)

SIPLACE TwinHead (TH)

Number of gantries 3 (see Fig. page 9)

Placement head configu-

ration and placement

rate

(Benchmark test)

a) According to the Definition in the SIPLACE Scope of Service and Delivery

Placement area 1 Placement area 2 Placement rate

C&P12 / C&P12 TH 30,100 comp./h

C&P12 / C&P6 TH 24,000 comp./h

C&P6 / C&P12 TH 24,000 comp./h

C&P6 / C&P6 TH 22,000 comp./h

Placement positions 6.000 / gantry for the Collect & Place head

Range of components 0.4 x 0.2 mm² (01005)

, 0.6 x 0.3 mm² (0201)

to 85 x 85 mm² / 125 x 10 mm²

max. 200 x 125 mm² (with restrictions)

b) 01005 optional, from April 2007

c) with 0201 package

Component height C&P12: 6 mm (larger heights on request)

C&P6: 8.5 mm (larger heights on request)

TH: 25 mm

Placement accuracy /

angular accuracy

C&P12: ± 45 μm, ± 0.5° / (3σ), ± 60 μm, ± 0.7° / (4σ)

(standard camera)

C&P12: ± 41 μm, ± 0.5° / (3σ), ± 55 μm, ± 0.7° / (4σ)

(high-resolution camera)

C&P6: ± 45 μm, ± 0.2° / (3σ), ± 60 μm, ± 0.3° / (4σ)

TH: ± 26 μm, ± 0.05° / (3σ), ± 35 μm, ± 0.07° / (4σ)

(Fine-Pitch Camera)

± 22 μm, ± 0.05° / (3σ), ± 30 μm, ± 0.07° / (4σ)

(Flip-Chip Camera)

Component Feeding 4 component changeover tables with tape roll holders and

integral waste containers

15 slots, 30 mm wide per changeover table or matrix tray

changer, rather than a component changeover table

(location 2)

Feeder module types Tapes, bulk cases, stick magazines, application-specific OEM

feeder modules, surftape feeder modules (8, 12, 16 mm),

waffle-pack trays

Feeding capacity 60 tape feeder modules 3 x 8 mm S (180 tracks)

60 tape feeder modules 2 x 8 mm S (120 tracks)

60 tape feeder modules 12/16 mm S (60 tracks)

40 tape feeder modules 24/32 mm S (40 tracks)

28 tape feeder modules 44 mm S (28 tracks)

24 tape feeder modules 56 mm S (24 tracks)

20 tape feeder modules 72 mm S (20 tracks)

16 tape feeder modules 88 mm S (16 tracks)

Machine Description

Technical Data

PCB format

(LxW)

PLEASE NOTE:

With PCB widths > 450 mm make

sure that the peripheral modules

are also able to process these

widths.

Single conveyor

50 x 50 mm² to 450 x 460 mm²

50 x 80 mm² to 610 x 460 mm² (Long board option)

(Width up to 508 mm available on request)

Flexible dual Conveyor

50 x 50 mm² to 450 x 216 mm²

50 x 80 mm² to 610 x 216 mm² (Long board option)

(Width up to 250 mm available on request)

Flexible dual conveyor in Single conveyor mode

50 x 50 mm² to 450 x 380 mm²

50 x 80 mm² to 610 x 380 mm² (Long board option)

(Width up to 450 mm available on request)

PCB thickness 0.3 - 4.5 mm (thicker PCBs on request)

Electrical ratings and

compressed air supply

see page 40

Dimensions of the placement

systems

see figure page 43

Placement area 2

Placement area 1

C&P6

C&P12

C&P6

C&P12

Gantry 3

Gantry 1

Gantry 4

Placement Heads

Head Modularity

Description

One key advantage of the

SIPLACE machines is its head

modularity. The placement

heads on the D3 machines

are configurable:

Placement area 1

• two 12-nozzle Collect &

Place heads or

• two 6-nozzle Collect &

Place heads or

• one 6-nozzle and one 12-

nozzle Collect&Place head

Placement area 2

•TwinHead

When you order a SIPLACE D3

placement system, you can

select the ideal head configu-

ration for your needs. The

placement system will then

be configured and supplied

as per your order.

There is also a reconfigura-

tion kit if you wish to change

the placement head locally.

This package contains assem-

bly parts, cables, etc, in addi-

tion to the placement head.

Head modularity provides an

easy way to match the place-

ment system to your produc-

tion needs without having

to invest in additional ma-

chines.