D3操作手册.pdf - 第9页

9 Placement area 2 Placement area 1 C&P6 C&P12 C&P6 C&P12 TH Gantry 3 Gantry 1 Gantry 4 Placement Heads Head Modu larity Description One key ad vantage of the SIPLACE machines is its hea d modulari ty. Th…

Machine Description

Technical Data

PCB format

(LxW)

PLEASE NOTE:

With PCB widths > 450 mm make

sure that the peripheral modules

are also able to process these

widths.

Single conveyor

50 x 50 mm² to 450 x 460 mm²

50 x 80 mm² to 610 x 460 mm² (Long board option)

(Width up to 508 mm available on request)

Flexible dual Conveyor

50 x 50 mm² to 450 x 216 mm²

50 x 80 mm² to 610 x 216 mm² (Long board option)

(Width up to 250 mm available on request)

Flexible dual conveyor in Single conveyor mode

50 x 50 mm² to 450 x 380 mm²

50 x 80 mm² to 610 x 380 mm² (Long board option)

(Width up to 450 mm available on request)

PCB thickness 0.3 - 4.5 mm (thicker PCBs on request)

Electrical ratings and

compressed air supply

see page 40

Dimensions of the placement

systems

see figure page 43

Placement area 2

Placement area 1

C&P6

C&P12

C&P6

C&P12

Gantry 3

Gantry 1

Gantry 4

Placement Heads

Head Modularity

Description

One key advantage of the

SIPLACE machines is its head

modularity. The placement

heads on the D3 machines

are configurable:

Placement area 1

• two 12-nozzle Collect &

Place heads or

• two 6-nozzle Collect &

Place heads or

• one 6-nozzle and one 12-

nozzle Collect&Place head

Placement area 2

•TwinHead

When you order a SIPLACE D3

placement system, you can

select the ideal head configu-

ration for your needs. The

placement system will then

be configured and supplied

as per your order.

There is also a reconfigura-

tion kit if you wish to change

the placement head locally.

This package contains assem-

bly parts, cables, etc, in addi-

tion to the placement head.

Head modularity provides an

easy way to match the place-

ment system to your produc-

tion needs without having

to invest in additional ma-

chines.

Placement Heads

12-Nozzle Collect & Place Head for High-

Speed Placement

Description

The 12-nozzle Collect & Place

head works on the Collect &

Place principle. This means

that, within each cycle,

twelve components are

picked up by the placement

head, are optically centered

on the way to the board and

are rotated into the required

placement angle. Lastly, the

air kiss sets down the compo-

nent gently and accurately

on the board.

Checking and self-learning

functions

The reliability of the Collect &

Place head is increased by

various checking and self-

learning functions.

• For example, vacuum

checks at the nozzles indi-

cate whether the compo-

nent was picked up

correctly.

•A digital component cam-

era on the placement head

determines the precise po-

sition of each component

at the nozzle. Any devia-

tions from the required

pick-up position are cor-

rected before placement

takes place.

• The package form is also

checked and the compo-

nent is not placed if the

geometric data thus deter-

mined differs from the

programmed data.

The vertical axis for picking

up and placing the compo-

nent works in sensor stop

mode, in which differences

in height during pick-up and

any unevenness of the PCB

surface are compensated

during placement.

In addition to the vacuum

check, an optional compo-

nent sensor may be used to

check for the presence of a

component at the nozzle.

The use of a component sen-

sor is recommended, particu-

larly when placing small

components, such as 0201.

High-resolution camera op-

tion

The high-resolution compo-

nent camera allows the

12-nozzle Collect & Place

head to optically center and

place component sizes rang-

ing from 01005

, 0201 to

18.7 x 18.7 mm².

1) 01005 optional, from

April 2007

Component vision module

DP axis:

Rotate component

to placement angle

Pull off or

insert sleeve

Z axis

Pick up or

place component

DR axis:

Rotate star

Reject

component