IPC J-STD-003B.pdf - 第13页

Unless otherwise speciﬁed, the land associated with a plated-through hole shall be considered part of the plated- through hole if it is used for through-hole attachment. In this case, only tests for hole solderability ap…

Test C – Solder Float Test For plated-through holes, sur-

face conductors and attachment lands, solder source side

(see 4.2.3)

Test D – Wave Solder Test For plated-through holes,

surface conductors and attachment lands, solder source side

(see 4.2.4)

Test E – Surface Mount Simulation Test For surface

conductors and attachment lands (see 4.2.5)

Lead Free Solder Alloy

Test A1 – Edge Dip Test For surface conductors and

attachment lands only (see 4.2.6)

Test B1 – Rotary Dip Test For plated-through holes,

surface conductors and attachment lands, solder source side

(see 4.2.7)

Test C1 – Solder Float Test For plated-through holes,

surface conductors and attachment lands, solder source side

(see 4.2.8)

Test D1 – Wave Solder Test For plated-through holes,

surface conductors and attachment lands, solder source side

(see 4.2.9)

Test E1 – Surface Mount Simulation Test For surface

conductors and attachment lands (see 4.2.10)

1.5.2 Force Measurement Criteria Tests

Tin Lead Solder Alloy

Test F – Wetting Balance Test For plated-through holes,

surface conductors and attachment lands (see 4.3.1)

Lead Free Solder Alloy

Test F1 – Wetting Balance Test For plated-through

holes, surface conductors and attachment lands (see 4.3.2)

Tests F and F1 shall not be used for acceptance/rejection

without user and vendor agreement. Please forward all test

data generated using these test methods, including type of

board tested (such as Type 2 or 12 layer, Type 3), dimen-

sions of test specimen tested, and any pretreatment, to:

IPC

Attn. J-STD-003 Staff Liaison

3000 Lakeside Drive, Suite 309S

Bannockburn, IL 60015

1.5.3 Test(s) Methodologies Under Committee Review

The J-STD-003 committee has undertaken, characterized,

and reviewed the use of the Sequential Electrochemical

Reduction Analysis (SERA® methodology for solderability

testing. The committee’s current position is that the

SERA® test method should reside within the IPC-TM-650

manual until additional solderability test information is

generated. Please forward all test data for committee

review to:

IPC

Attn. J-STD-003 Staff Liaison

3000 lakeside Drive, Suite 309S

Bannockburn, IL 60015

1.6 Test Method Selection For appropriate test selection

refer to 1.5 and Tables 1-1 and 1-2. The test selection

should consider the ﬁnal soldering process so that the

results of the test will best represent that process.

1.7 Test Specimen Requirements The test specimen

shall be a representative test specimen, a portion of the

printed board being tested, or a whole board if within size

limits, such that an immersion depth deﬁned in the indi-

vidual method is possible. The test specimen shall be rep-

resentative of the lot being tested. When this test specimen

is to be used as a criterion for material acceptance, the

number of test specimens shall be deﬁned by agreement

between the user and vendor.

Test specimens that may be used for rigid board surface

solderability and plated-through hole solderability are

detailed in the paragraph sections under the individual test

methods. Similar test specimens may be used provided

they reﬂect the board circuitry, hole, and construction, and

have been processed in conjunction with the printed board

being evaluated.

Table 1-1 Test Method Selection

Test Method Applies to Surface Features Plated-Through Holes

Tests with Visual Assessment Criteria

A – Edge Dip Test

A1 – Edge Dip Test

X N/A

B – Rotary Dip Test

B1 – Rotary Dip Test

X (Solder Source Side Only) X

C – Solder Float Test

C1 – Solder Float Test

X (Solder Source Side Only) X

D – Wave Solder Test

D1 – Wave Solder Test

X (Solder Source Side Only) X

E – Surface Mount Simulation Test

E1 – Surface Mount Simulation Test

X N/A

Tests with Force Measurement Criteria

F – Wetting Balance Test

F1 – Wetting Balance Test

IPC J-STD-003B March 2007

Provided by IHS under license with IPC

Not for Resale

No reproduction or networking permitted without license from IHS

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Unless otherwise speciﬁed, the land associated with a

plated-through hole shall be considered part of the plated-

through hole if it is used for through-hole attachment. In

this case, only tests for hole solderability apply. If the land

is used for surface attachment of parts, then such lands

shall be tested for both hole and surface solderability.

1.8 Coating Durability The user shall specify to the ven-

dor, as part of the purchase or ordering agreement, the

required coating durability. The following are guidelines

for determining the needed level of coating durability (not

product performance classes). Conditioning and solderabil-

ity testing shall be performed per Table 1-2.

Category 1 – Minimum Coating Durability

Intended for boards which will be soldered within 30 days

from the time of manufacture and are likely to experience

minimum thermal exposures.

Category 2 – Average Coating Durability

Intended for boards likely to experience storage up to six

months from the time of manufacture and moderate ther-

mal or solder exposures.

Category 3 – Maximum Coating Durability

Intended for boards likely to experience long storage (over

six months) from the time of manufacture, severe thermal

or solder processing steps, etc. It should be recognized that

there may be a cost premium or delivery delay associated

with boards ordered to this durability level.

1.9 Limitation This standard shall not be construed as a

production soldering or tinning procedure for preparing or

soldering of printed boards or assemblies.

2 APPLICABLE DOCUMENTS

The following documents of the issue currently in effect

form a part of this standard to the extent speciﬁed herein.

2.1 Industry

2.1.1 IPC

IPC-T-50 Terms and Deﬁnitions

IPC-TM-650 Test Methods Manual

J-STD-005 Requirements for Soldering Pastes

J-STD-006 Requirements for Electronic Grade Solder

Alloys and Fluxed and Non-Fluxed Solid Solders for Elec-

tronic Soldering Applications

3 REQUIREMENTS

3.1 Terms and Definitions

The deﬁnition of terms shall

be in accordance with IPC-T-50. Terms that have been

repeated from IPC-T-50 for convenience are indicated by

an asterisk (*).

*Contact Angle, Soldering The angle of a solder ﬁllet

that is enclosed between a plane that is tangent to the

solder/ basis-metal surface and a plane that is tangent to the

solder/ air interface (see Figure 3-1).

3.2 Materials

3.2.1 Solder

For tin/lead testing, the solder composition

shall be Sn60/Pb40, Sn62/Pb36/2Ag or Sn63/Pb37 per

J-STD-006. The composition of the solder, including con-

tamination levels, shall be maintained during testing per

3.5.2

The composition of the tin/lead solder paste to be used in

Test E shall be Sn60/Pb40 or Sn63/Pb37 for Sn/Pb per

J-STD-005, mesh size of -325/+500, ﬂux type ROL1. The

solder paste shall meet the storage and shelf life require-

ments of the manufacturer’s speciﬁcation.

For lead-free testing, the solder composition shall be

Sn96.5Ag3.0Cu0.5 (SAC305) per J-STD-006. Other lead-

free solder alloys may be used upon agreement between

user and vendor.

1. www.ipc.org

Table 1-2 Conditioning and Test Requirements

Pretest Conditioning Flux

Durability of Coating Rating

Surface Holes Surface Holes Surface Holes

8 Hours Conditioning (3.4.2) See 3.2.2 X

None See 3.2.2 X X X X

None Type

a. See 1.8.

b. Default Coating Rating.

c. Flux product used in the printed assembly process.

SOLDER

SMALL CONTACT

ANGLE

LARGE CONTACT

ANGLE

IPC-003b-3-1

Figure 3-1 Contact Angle

March 2007 IPC J-STD-003B

Provided by IHS under license with IPC

Not for Resale

No reproduction or networking permitted without license from IHS

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The composition of the lead-free solder paste to be used in

Test S1 shall be Sn96.5Ag3.0Cu0.5 (SAC305) per J-STD-

005, mesh size of -325/+500, ﬂux type to be agreed upon

between user and vendor. The solder paste shall meet the

storage and shelf life requirements of the manufacturers’

speciﬁcation. Other lead-free solder pastes may be used

upon agreement between user and vendor

3.2.2 Flux The ﬂux for tin/lead solderability tests shall

be a standard activated rosin ﬂux #1 having a composition

of 25% ± 0.5% by weight of colophony and 0.15% ±

0.01% by weight diethylammonium hydrochloride (CAS

660-68-4), in 74.85% ± 0.5% by weight of isopropyl alco-

hol (see Table 3-1).

The ﬂux for lead-free solderability tests shall be standard

activated rosin ﬂux #2 having a composition of 25% ±

0.5% by weight of colophony and 0.39% ± 0.01% by

weight diethylammonium hydrochloride (CAS 660-68-4),

in 74.61% ± 0.5% by weight of isopropyl alcohol (see

Table 3-1).

3.2.2.1 Flux Maintenance Standard activated rosin

ﬂuxes #1 and #2 shall be covered when not in use and dis-

carded after eight hours or the ﬂux shall be maintained to

a speciﬁc gravity of 0.843 ± 0.005 at 25±2°C[77±3.6

°F] and discarded after one week of use.

3.2.3 Flux Removal Material used for cleaning printed

boards after solderability testing and prior to solderability

evaluations shall be capable of removing visible ﬂux resi-

dues.

3.3 Equipment The following criteria applies to all

methods and equipment (see APPENDIX C for a list of

equipment sources). Equipment that is speciﬁc to any of

the solderability test methods is described within the

method details.

3.3.1 Conditioning Equipment The conditioning equip-

ment shall be capable of maintaining the temperature and

humidity parameters speciﬁed in 3.4.2. The test specimens

shall be suspended so that no portion of the test specimen

is within 40 mm [1.57 in] of the test chamber walls. The

nonmetallic holders shall support the test specimens

between vertical to 45 ° angle during exposure. Care shall

be taken to not exceed the capacity of the conditioning

equipment. Excessive or improper loading will cause con-

densation of humidity on the surface of the test specimens.

3.3.2 Solder Pot/Bath A thermostatically controlled

static solder bath shall be used of adequate dimensions to

accommodate the test specimens. The solder bath shall

contain enough solder to maintain the temperature during

testing within the speciﬁed temperature limits (3.5.1) and

to prevent exceeding the contamination levels (3.5.2). The

wave solder pot temperature limits utilized for Test Method

D or Test Method D1 shall be deﬁned by agreement

between the user and vendor. Precautions should be taken

to avoid solder pot/bath damage due to metal erosion when

using Lead-free solder alloys.

3.3.3 Optical Inspection Equipment All test methods

requiring visual inspection shall be capable of 10X magni-

ﬁcation (see individual test methods), and may be equipped

with reticles, or equivalent, for measurement, when appli-

cable. An example of a reticle is shown in Figure 3-2.

Shadowless lighting shall be used for proper inspection.

3.3.4 Dipping Equipment Solder dipping devices shall

be mechanical/electromechanical and capable of control-

ling the immersion/emersion rates dwell time and immer-

sion depth as speciﬁed in 4.2 to 4.3.

3.3.5 Timing Equipment Timing equipment shall be

automated and accurate to the limits of the test method.

3.4 Preparation for Testing

3.4.1 Test Specimen Preparation and Conditioning for

Test

Care shall be exercised to prevent contamination

(by grease, perspiration, etc.) of the surface to be tested.

When agreed upon between user and vendor, the test speci-

men to be tested may undergo other types of pretreatments

such as degreasing, aqueous cleaning, copper and solder

brightening, or baking.

The prescribed pretreatments should reproduce actual pro-

cessing of the printed boards up to the time of assembly

soldering (see 6.3). If conditioning is performed, prebaking

is not recommended.

3.4.2 Durability Conditioning All test specimens identi-

ﬁed as requiring durability conditioning shall be subjected

to conditioning prior to solderability testing immediately

followed by a bake per 3.4.3. The durability test conditions

shall be 72 °C± 5 °C [162 °F ± 9 °F] and 85%± 3% Rela-

tive Humidity [RH]. The test specimens shall be exposed

for a test duration of eight hours ± 15 minutes.

3.4.3 Baking Immediately after conditioning and prior to

solderability testing, all boards shall be baked at 105 ± 5

°C [221 ± 9 °F] for 1 +1/-0 hours to remove surface mois-

ture and other volatiles. Test specimens shall be cooled to

room temperature prior to ﬂuxing and testing.

Table 3-1 Flux Composition

Constituent

Composition by

Weight Percent

Flux #1 Flux #2

Colophony 25 ± 0.5 25 ± 0.5

Diethylammonium hydrochloride 0.15 ± 0.01 0.39 ± 0.01

Isopropyl Alcohol (IPA) Balance Balance

Weight of Chlorine as % of solids 0.2 0.5

Note: APPENDIX C: Informative Annex contains a listing of industry test

ﬂux product sources.

IPC J-STD-003B March 2007

Provided by IHS under license with IPC

Not for Resale

No reproduction or networking permitted without license from IHS

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