IPC J-STD-003B.pdf - 第18页

27.5 mm [1.081 in] 2.0 mm [0.0787 in] 22.5 mm [0.8858 in] 7.5 mm [0.295 in] 2.5 mm [0.0984 in] 2.5 mm [0.0984 in] Land Size 1.5 mm [0.0591 in] 40 Plated Through-Holes 0.8 ± 0.0125 mm [0.031 ± 0.0004921 in] 3.0 mm [0.1 18…

4.2 Tests with Established Accept/Reject Criteria

4.2.1 Test A – Edge Dip Test Tin/Lead Solder

This test

is for edge dip testing of surface conductors and attachment

lands.

4.2.1.1 Apparatus

4.2.1.1.1 Solder Pot/Bath

A solder vessel that meets the

requirements of 3.3.2 shall be used. The solder shall meet

the requirements of 3.2.1. Solder bath temperatures and

solder contamination control shall be in accordance with

3.5.1 and 3.5.2.

4.2.1.1.2 Dipping Device A dipping device as shown in

Figure 4-1 shall be used. A similar device may be used

providing: the rate of immersion, dwell time, and rate of

withdrawal are within the test limits; perpendicularity of

board and solder surface are maintained; wobble, vibration,

and other extraneous movements are eliminated.

4.2.1.2 Test Specimen The test specimen shall be a rep-

resentative portion of the board, or a full board, whichever

is smaller, not to exceed 50 x 50 mm [1.97 x 1.97 in], or a

test specimen that is representative of the common board

features. Figures 4-2 and 4-3 are suggested test specimen

styles. Test specimen preparation shall be in accordance

with 3.4.

Note: Relative to Figure 4-3, it is imperative that the met-

allization extends to the edge of the test specimen, in order

to guarantee a repeatable and accurate test. This is achieved

by imaging the test specimen larger in the multi-test speci-

men panel format than as it would otherwise have been

done as an individual test specimen. The singulation pro-

cess (removing the individual test specimens from the

multi-image panel) will have the scoring or routing path

pass through the oversize copper image, thus insuring that

the copper is fully present to the edge of the test specimen.

Due to the relative softness of the copper, the rough edge

may need to be ‘dressed’ using 600 grit sandpaper. An

alternate method to ensure that the copper is fully to the

edge of the test coupon is to preroute the test specimen and

edge plate. This latter alternative is generally more costly

and may not be available from all printed circuit board

fabricators.

4.2.1.3 Procedure Dross and burned/residual ﬂux shall

be completely removed from the surface of the molten sol-

der immediately prior to dipping. After ﬂuxing and drain-

ing per 4.1, the test specimen shall be immersed into the

molten solder edgewise to a depth of 25 ± 2 mm [0.984 ±

Flux

Initial Step

Process Flow

Insert

Specimen

Insert

Specimen

Withdraw

Specimen

Withdraw

Specimen

Station

Solder

Station

Final Step

IPC-003b-4-1

Figure 4-1 Edge Dip Solderability Test

March 2007 IPC J-STD-003B

Provided by IHS under license with IPC

Not for Resale

No reproduction or networking permitted without license from IHS

--`,,```,,,,````-`-`,,`,,`,`,,`---

//^:^^#^~^^"^~"^"^:$^~#:"#:$@:~^"$^:#*~^$^~:^#*^^:^^*\\

27.5 mm

[1.081 in]

2.0 mm

[0.0787 in]

22.5 mm

[0.8858 in]

7.5 mm [0.295 in]

2.5 mm [0.0984 in]

Land Size 1.5 mm [0.0591 in]

40 Plated Through-Holes

0.8 ± 0.0125 mm [0.031 ± 0.0004921 in]

3.0 mm

[0.118 in]

2.5 mm

[0.0984 in]

9 Spaces @

Layer 1 Only

Appropriate

Specimen

Number

IPC-003b-4-2

Figure 4-2 Suggested Test Specimen for Plated-Through Holes

COMPONENT SIDE VIEW

Test Coupon size = 25 mm x 15 mm [0.984 in x 0.591 in]

SMD Pad Size = 3.18 mm x 4.52 mm [0.1250 in x 0.1780 in]

Pads are extended 0.51 mm [0.020 in] beyond the edge

Pad to pad pitch = 4.0 mm [0.157 in]

Mask clearance = 3.58 mm x 4.94 mm [0.1410 in x 0.1945 in]

Both sides

2.54 mm [0.1000 in]

0.94 mm [0.0370 in]

Pad Size (dia.) = 1.9 mm [0.0748 in]

Pad to pad pitch = 4.0 mm [0.157 in]

PTH size = 1.15 mm [0.0453 in] finished

Mask clearance = 2.31 mm [0.0909 in]

Both sides

IPC-003b-4-3

Figure 4-3 Suggested Test Specimen for Surface Mount Features

IPC J-STD-003B March 2007

Provided by IHS under license with IPC

Not for Resale

No reproduction or networking permitted without license from IHS

--`,,```,,,,````-`-`,,`,,`,`,,`---

//^:^^#^~^^"^~"^"^:$^~#:"#:$@:~^"$^:#*~^$^~:^#*^^:^^*\\

0.08 in]. The dwell time in the molten solder shall be 3.0

± 0.5 seconds. Immersion and emersion rates shall be 25 ±

2 mm [0.984 ± 0.08 in] per second. After withdrawal, the

solder shall be allowed to solidify by air cooling while the

board is maintained in a vertical position. Prior to exami-

nation, all test specimens shall have the ﬂux removed using

a cleaning agent in accordance with 3.2.3.

4.2.1.4 Evaluation

4.2.1.4.1 Magnification

Test specimens shall be exam-

ined at 10X using the equipment speciﬁed in 3.3.3.

4.2.1.4.2 Surface Evaluation – Accept/Reject Criteria

A minimum of 95% of each of the surfaces (i.e., each pad)

being tested shall exhibit good wetting. The balance of the

surface may contain only small pin holes, dewetted areas,

and rough spots provided such defects are not concentrated

in one area. For less critical applications, a smaller percent

coverage may be determined between vendor and user.

There shall be no nonwetting or exposed base metal within

the evaluated area. An area of 3.2 mm [0.126 in] width

from the bottom edge of each test specimen shall not

be evaluated. Areas contacted by ﬁxtures shall not be

evaluated.

4.2.2 Test B – Rotary Dip Test Tin/Lead Solder This

test is for rotary dip testing of plated-through holes, surface

conductors and attachment lands.

4.2.2.1 Apparatus A device shall be used to move the

test specimen in a circular path so that the ﬂat surface of

the test specimen will contact the solder at a constant speed

without stopping. The distance between the center of rota-

tion and the center of the test specimen shall be 100 mm

[3.937 in] minimum. An example of a test specimen holder

is shown in Figure 4-4. Those parts of the holder including

the retaining spring (if ﬁtted) which come into contact with

the test specimen and/or the solder should have low ther-

mal capacity and conductivity. The time of contact between

any point of the test face of the test specimen and the mol-

ten solder shall be determined by a timer. The timer shall

start when the face of the test piece is parallel to the solder

surface. A strip of 50 mm [1.97 in] wide polytetraﬂuoroet-

hylene (PTFE) or equivalent shall precede the test speci-

men in the test cycle in order to remove oxide or ﬂux resi-

due from the solder surface immediately before the test

specimen is introduced.

4.2.2.2 Test Specimen The test specimen shall be in

accordance with 1.7. The test specimen shall either be a

full board, a section of a board, or a suggested test speci-

men (see Figures 4-2 and 4-3). The test specimen shall be

of such a width as to allow 13 mm [0.512 in] clearance

from the solder pot sides. The minimum number of termi-

nations (plated-through holes or attachment lands) per test

specimen shall be six. If plated-through holes are to be

tested, then the minimum number of holes to be tested is

30 per test lot. This would require a minimum of ﬁve test

specimens (six holes per test specimen, 30 holes total). The

test specimen shall be representative of the product. The

exposed length of test specimen test face in the direction of

travel shall be25±5mm[0.984 ± 0.20 in]. Test specimen

preparation shall be in accordance with 3.4.

4.2.2.3 Procedure Dross and burned/residual ﬂux shall

be completely removed from the surface of the molten sol-

der immediately prior to dipping. After ﬂuxing and drain-

ing, per 4.1, mount the test specimen to be tested in the test

equipment test specimen holder. Adjust the test equipment

to immerse the test specimen into the solder bath to a

maximum of 50% of the test specimen thickness unless

otherwise speciﬁed. Activate the test equipment to expose

the test specimen to solder. After the test specimen has

cleared the solder bath, allow all the solder to solidify in

the position in which the machine stops before removing

from the test specimen holder. Care must be taken so

that solder does not ﬂow over the upper face of the test

specimen. This may be impacted by the width of the test

specimen. Dwell time at the maximum depth shall be 3.0

± 0.5 seconds. Prior to examination, all test specimens

shall have the ﬂux removed using a cleaning agent in

accordance with 3.2.3.

4.2.2.4 Evaluation

4.2.2.4.1 Magnification

Test specimens shall be exam-

ined at 10X using the equipment speciﬁed in 3.3.3.

1) Dwell timer set at 3.0 ± 0.5 seconds

2) Adjustable speed control on 100.0 mm

[3.9370 in] radius on solder station

3) Dwell at end of 100.0 mm [3.9370 in]

radius swing to allow solder to solidify

Solder

Coupon

Dross

Wiper

IPC-003b-4-4

Figure 4-4 Rotary Dip Test

March 2007 IPC J-STD-003B

Provided by IHS under license with IPC

Not for Resale

No reproduction or networking permitted without license from IHS

--`,,```,,,,````-`-`,,`,,`,`,,`---

//^:^^#^~^^"^~"^"^:$^~#:"#:$@:~^"$^:#*~^$^~:^#*^^:^^*\\