IPC J-STD-003B.pdf - 第22页

process controls, incline, board preheat temperature and solder temperature. The application of solder shall meet the requirements of the applicable wave solder equipment, spe- ciﬁcally for depth of contact, angle of con…

enough to support the weight of the solder needed to ﬁll the

hole. This may prevent solder from ﬁlling the plated-

through hole and wetting over the knee of the hole and out

onto the land area around the top of the hole.

4.2.3 Test C – Solder Float Test Tin/Lead Solder This

test is for solder ﬂoat testing of plated-through holes, sur-

face conductors and attachment lands.

4.2.3.1 Apparatus

4.2.3.1.1 Solder Pot

The solder pot shall meet the

requirements of 3.3.2. In addition, the surface area of the

pot shall be great enough to ﬂoat the test specimen without

it touching the sides of the pot.

4.2.3.1.2 Test Specimen Handling Tool Stainless steel

forceps, or other specially designed tools of stainless steel,

shall be used to handle the test specimen only by the

edges.

4.2.3.2 Test Specimen The test specimen shall be in

accordance with 1.7. The test specimen shall be a portion

of the printed board not greater than 50 x 50 mm [1.97 x

1.97 in], the suggested test specimen, or the complete

board if it is smaller than this size. The minimum number

of holes to be tested is 30 per test lot. If there are not at

least 30 holes in the test specimen, additional specimens

shall be tested until at least 30 holes have been tested (see

Figure 4-2 Through-Hole Test specimen). Test specimen

preparation shall be in accordance with 3.4.

4.2.3.3 Procedure Dross and burned/residual ﬂux shall

be completely removed from the surface of the molten sol-

der immediately prior to ﬂoating. After ﬂuxing and drain-

ing per 4.1, slide the test specimen gently on the molten

solder. Allow test specimen to ﬂoat on solder for ﬁve sec-

onds maximum. The test specimen may be depressed into

the solder bath to a maximum of 50% of the test specimen

thickness after it has been initially ﬂoated on the solder

bath (extreme care must be taken with boards that are less

than 0.8 mm [0.031 in] thick). After the elapsed time, slide

the test specimen off molten solder. Hold test specimen still

and horizontal until solder solidiﬁes. Prior to examination,

all test specimens shall have the ﬂux removed using a

cleaning agent in accordance with 3.2.3.

4.2.3.4 Evaluation

4.2.3.4.1 Magnification

Test specimens shall be exam-

ined at 10X using the equipment speciﬁed in 3.3.3.

4.2.3.4.2 Surface Evaluation – Accept/Reject Criteria

An area of 3.0 mm [0.118 in] width from the trailing edge

of each test specimen shall not be evaluated. Areas con-

tacted by ﬁxtures shall not be evaluated. A minimum of

95% of each of the surfaces (i.e., each pad) being tested

shall exhibit good wetting. The balance of the surface may

contain only small pin holes, dewetted areas, and rough

spots provided such defects are not concentrated in one

area. For less critical applications, a smaller percent cover-

age may be determined between vendor and user. There

shall be no nonwetting or exposed base metal within the

evaluated area.

4.2.3.4.3 Plated-Through Hole Evaluation Only plated-

through holes that are at least 3.0 mm [0.118 in] from any

surface or ﬁxturing structure supporting the test specimen

during the test will be evaluated.

Accept/Reject Criteria:

• Class 1 and 2 Product – Solder shall fully wet the wall

area of the plated-through holes, and plug holes less than

1.5 mm [0.0591 in] diameter (complete ﬁlling is not nec-

essary).

• Class 3 Product – The test specimen has soldered suc-

cessfully if solder has risen in all plated-through holes.

The solder shall have fully wetted the walls of the hole.

There shall be no nonwetting or exposed base metal on

any plated-through hole.

Accept/reject criterion for board thicknesses of <3.0 mm

[<0.118 in] shall be in accordance with 5.2 and Figures 4-5

and 4-6. The solder must have wet over the knee of the

hole and out onto the land around the top of the hole,

except for boards whose thickness exceeds 3.0 mm [0.118

in].

On thick boards, i.e., greater than 3.0 mm [0.118 in] the

capillary forces due to surface tension may not be large

enough to support the weight of the solder needed to ﬁll the

hole. This may prevent solder from ﬁlling the plated-

through hole and wetting over the knee of the hole and out

onto the land area around the top of the hole.

4.2.4 Test D – Wave Solder Test Tin/Lead Solder This

test is for wave solder testing of plated-through holes, sur-

face conductors, and attachment lands.

4.2.4.1 Apparatus A wave soldering system adjusted to

provide the parameters of 4.2.4.3 shall be used.

4.2.4.2 Test Specimen The suggested test specimen

shall be in accordance with Figures 4-2 and 4-3 and 1.7.

Test specimen preparation shall be in accordance with 3.4.

4.2.4.3 Procedure Test specimens shall be ﬁxtured so as

to be representative of the production setup without com-

ponents inserted. The ﬂuxing unit should be ﬁlled with the

speciﬁc (3.2.2) or agreed upon ﬂux. If the unit contains

other than the speciﬁed or agreed upon ﬂux then the ﬂux-

ing unit shall be turned off and the board test specimens

ﬂuxed separately prior to placement on the conveyor per

4.1. The following parameters must be established and

noted: board ﬁxturing (if required), conveyor speed, pre-

heater, solder unit with or without oil intermix, machine

March 2007 IPC J-STD-003B

Provided by IHS under license with IPC

Not for Resale

No reproduction or networking permitted without license from IHS

--`,,```,,,,````-`-`,,`,,`,`,,`---

//^:^^#^~^^"^~"^"^:$^~#:"#:$@:~^"$^:#*~^$^~:^#*^^:^^*\\

process controls, incline, board preheat temperature and

solder temperature. The application of solder shall meet the

requirements of the applicable wave solder equipment, spe-

ciﬁcally for depth of contact, angle of contact, and duration

of contact. Solder temperature shall be235±5°C[455 ±

9 °F] unless another temperature is agreed upon by vendor

and user. Prior to examination, all test specimens shall

have the ﬂux removed using a cleaning agent in accordance

with 3.2.3.

4.2.4.4 Evaluation

4.2.4.4.1 Magnification

Test specimens shall be exam-

ined at 10X using the equipment speciﬁed in 3.3.3.

4.2.4.4.2 Surface Evaluation – Accept/Reject Criteria

An area of 3.0 mm [0.118 in] width from the trailing edge

of each test specimen shall not be evaluated. Areas con-

tacted by ﬁxtures shall not be evaluated. A minimum of

95% of each of the surfaces (i.e., each pad) being tested

shall exhibit good wetting. The balance of the surface may

contain only small pin holes, dewetted areas, and rough

spots provided such defects are not concentrated in one

area. For less critical applications, a smaller percent cover-

age may be determined between vendor and user. There

shall be no nonwetting or exposed base metal within the

evaluated area.

4.2.4.4.3 Plated-Through Hole Evaluation Only plated-

through holes that are at least 5.0 mm [0.197 in] from any

surface or ﬁxturing structure supporting the test specimen

during the test will be evaluated.

Accept/Reject Criteria:

• Class 1 and 2 Product – Solder shall fully wet the wall

area of the plated-through holes, and plug holes less than

1.5 mm [0.0591 in] diameter (complete ﬁlling is not nec-

essary).

• Class 3 Product – The test specimen has soldered suc-

cessfully if solder has risen in all plated-through holes.

The solder shall have fully wetted the walls of the hole.

There shall be no nonwetting or exposed base metal on

any plated-through hole.

Accept/reject criteria for board thicknesses of <3.0 mm

[<0.118 in] shall be in accordance with 5.2 and Figures 4-5

and 4-6. The solder must have wetted over the knee of the

hole and out onto the land around the top of the hole,

except for boards whose thickness exceeds 3.0 mm [0.118

in].

On thick boards, i.e., greater than 3.0 mm [0.118 in], the

capillary action forces may not be large enough to over-

come forces exerted on the solder by the weight of the sol-

der. This may prevent solder from ﬁlling the plated-through

hole and wetting over the knee of the hole and out onto the

land area around the top of the hole.

4.2.5 Test E – Surface Mount Process Simulation Test

Tin/Lead Solder

This test simulates actual surface mount

printed board performance in a reﬂow process.

4.2.5.1 Apparatus

4.2.5.1.1 Stencil/Screen

A stencil or screen with pad

geometry openings that are appropriate for the test speci-

men shall be used. Unless otherwise agreed upon between

vendor and user the nominal stencil thickness shall be per

Table 4-1.

4.2.5.1.2 Paste Application Tool A rubber or metal

squeegee device shall be used to distribute paste across the

stencil/screen.

4.2.5.2 Test Specimen The test specimen shall be in

accordance with 1.7. The test specimen shall be tested in

the condition that it would normally experience at the time

of assembly soldering. The test specimen surfaces to be

tested shall be handled in such a manner as not to cause

contamination, nor shall the surfaces being tested be

wiped, cleaned, scraped or abraded.

4.2.5.3 Reflow Equipment An IR/convection reﬂow

oven, vapor phase reﬂow system, or storage oven capable

of reaching the reﬂow temperature of the paste shall

beused. The temperatures listed in Table 4-2 correspond to

the temperature/time duration for the solder paste. Addi-

tional time may be required to allow the test specimen

itself to reach the temperatures listed in Table 4-2. Unless

Table 4-2 Reﬂow Parameter Requirements

Reﬂow Type Temperature Time

Vapor Phase Reﬂow 215-219 °C [419-426 °F] 30-60 seconds dwell at reﬂow

IR/Convection Reﬂow

Preheat 150-170 °C [302-338 °F] 50-70 seconds

Reﬂow 215-230 °C [419-446 °F] 50-70 seconds

Oven 215-230 °C [419-446 °F] 2-5 minutes (until reﬂow is assured)

Table 4-1 Stencil Thickness Requirements

Nominal

Stencil Thickness Pitch

0.10 mm [0.00394 in] <0.50 mm [<0.0197 in]

0.15 mm [0.00591 in] 0.50-0.65 mm [0.0197-0.0256 in]

0.20 mm [0.00787 in] >0.65 mm [>0.0256 in]

IPC J-STD-003B March 2007

Provided by IHS under license with IPC

Not for Resale

No reproduction or networking permitted without license from IHS

--`,,```,,,,````-`-`,,`,,`,`,,`---

//^:^^#^~^^"^~"^"^:$^~#:"#:$@:~^"$^:#*~^$^~:^#*^^:^^*\\

otherwise agreed upon between vendor and user the reﬂow

parameters shall be per Table 4-2.

4.2.5.4 Procedure Place the stencil/screen on a surface

termination area of interest, apply solder paste (see 3.2.1)

onto the stencil/screen and print the stencil pattern onto the

test substrate by wiping paste over the stencil/screen in one

smooth motion using a rubber or metal squeegee. Remove

the stencil/screen carefully so as to avoid smearing the

paste print. Place test substrate on applicable reﬂow equip-

ment and conduct reﬂow process. After reﬂow, carefully

remove test specimen and allow to cool to room tempera-

ture. Prior to examination, all test specimens shall have the

ﬂux removed using a cleaning agent in accordance with

3.2.3.

4.2.5.5 Evaluation

4.2.5.5.1 Magnification

Test specimens shall be exam-

ined at 10X using the equipment speciﬁed in 3.3.3.

4.2.5.5.2 Surface Evaluation – Accept/Reject Criteria

A minimum of 95% of each of the surfaces (i.e., each pad)

being tested shall exhibit good wetting. The balance of the

surface may contain only small pin holes, dewetted areas,

and rough spots provided such defects are not concentrated

in one area. For less critical applications, a smaller percent

coverage may be determined between vendor and user.

There shall be no nonwetting or exposed base metal within

the evaluated area.

March 2007 IPC J-STD-003B

Provided by IHS under license with IPC

Not for Resale

No reproduction or networking permitted without license from IHS

--`,,```,,,,````-`-`,,`,,`,`,,`---

//^:^^#^~^^"^~"^"^:$^~#:"#:$@:~^"$^:#*~^$^~:^#*^^:^^*\\