IPC J-STD-003B.pdf - 第24页

4.2.6 Test A1 – Edge Dip Test Lead-Free Solder This test is for edge dip testing of surface conductors and attach- ment lands. 4.2.6.1 Apparatus 4.2.6.1.1 Solder Pot/Bath A solder vessel that meets the requirements of 3.…

otherwise agreed upon between vendor and user the reﬂow

parameters shall be per Table 4-2.

4.2.5.4 Procedure Place the stencil/screen on a surface

termination area of interest, apply solder paste (see 3.2.1)

onto the stencil/screen and print the stencil pattern onto the

test substrate by wiping paste over the stencil/screen in one

smooth motion using a rubber or metal squeegee. Remove

the stencil/screen carefully so as to avoid smearing the

paste print. Place test substrate on applicable reﬂow equip-

ment and conduct reﬂow process. After reﬂow, carefully

remove test specimen and allow to cool to room tempera-

ture. Prior to examination, all test specimens shall have the

ﬂux removed using a cleaning agent in accordance with

3.2.3.

4.2.5.5 Evaluation

4.2.5.5.1 Magnification

Test specimens shall be exam-

ined at 10X using the equipment speciﬁed in 3.3.3.

4.2.5.5.2 Surface Evaluation – Accept/Reject Criteria

A minimum of 95% of each of the surfaces (i.e., each pad)

being tested shall exhibit good wetting. The balance of the

surface may contain only small pin holes, dewetted areas,

and rough spots provided such defects are not concentrated

in one area. For less critical applications, a smaller percent

coverage may be determined between vendor and user.

There shall be no nonwetting or exposed base metal within

the evaluated area.

March 2007 IPC J-STD-003B

Provided by IHS under license with IPC

Not for Resale

No reproduction or networking permitted without license from IHS

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4.2.6 Test A1 – Edge Dip Test Lead-Free Solder This

test is for edge dip testing of surface conductors and attach-

ment lands.

4.2.6.1 Apparatus

4.2.6.1.1 Solder Pot/Bath

A solder vessel that meets the

requirements of 3.3.2 shall be used. The solder shall meet

the requirements of 3.2.1. Solder bath temperatures and

solder contamination control shall be in accordance with

3.5.1 and 3.5.2.

4.2.6.1.2 Dipping Device A dipping device as shown in

Figure 4-1 shall be used. A similar device may be used

providing: the rate of immersion, dwell time, and rate of

withdrawal are within the test limits; perpendicularity of

board and solder surface are maintained; wobble, vibration,

and other extraneous movements are eliminated.

4.2.6.2 Test Specimen The test specimen shall be a rep-

resentative portion of the board, or a full board, whichever

is smaller, not to exceed 50 x 50 mm [1.97 x 1.97 in], or a

test specimen that is representative of the common board

features. Figures 4-2 and 4-3 are suggested test specimen

styles. Test specimen preparation shall be in accordance

with 3.4.

4.2.6.3 Procedure Dross and burned/residual ﬂux shall

be completely removed from the surface of the molten

solder immediately prior to dipping. After ﬂuxing and

draining per 4.1, the test specimen shall be immersed into

the molten solder edgewise to a depth of 25±2mm[0.984

± 0.08 in]. The dwell time in the molten solder shall be 3.0

± 0.5 seconds. Immersion and emersion rates shall be 25 ±

2 mm [0.984 ± 0.08 in] per second. After withdrawal, the

solder shall be allowed to solidify by air cooling while the

board is maintained in a vertical position. Prior to exami-

nation, all test specimens shall have the ﬂux removed using

a cleaning agent in accordance with 3.2.3.

4.2.6.4 Evaluation

4.2.6.4.1 Magnification

Test specimens shall be exam-

ined at 10X using the equipment speciﬁed in 3.3.3.

4.2.6.4.2 Surface Evaluation – Accept/Reject Criteria

A minimum of 95% of each of the surfaces (i.e., each pad)

being tested shall exhibit good wetting. The balance of the

surface may contain only small pin holes, dewetted areas,

and rough spots provided such defects are not concentrated

in one area. For less critical applications, a smaller percent

coverage may be determined between vendor and user.

There shall be no nonwetting or exposed base metal with-

in the evaluated area. An area of 3.2 mm [0.126 in] width

from the bottom edge of each test specimen shall not

be evaluated. Areas contacted by ﬁxtures shall not be

evaluated.

4.2.7 Test B1 – Rotary Dip Test Lead-Free Solder This

test is for rotary dip testing of plated-through holes, surface

conductors and attachment lands.

4.2.7.1 Apparatus A device shall be used to move the

test specimen in a circular path so that the ﬂat surface of

the test specimen will contact the solder at a constant speed

without stopping. The distance between the center of rota-

tion and the center of the test specimen shall be 100 mm

[3.937 in] minimum. An example of a test specimen holder

is shown in Figure 4-4. Those parts of the holder including

the retaining spring (if ﬁtted) which come into contact with

the test specimen and/or the solder should have low ther-

mal capacity and conductivity. The time of contact between

any point of the test face of the test specimen and the mol-

ten solder shall be determined by a timer. The timer shall

start when the face of the test piece is parallel to the solder

surface. A strip of 50 mm [1.97 in] wide polytetraﬂuoroet-

hylene (PTFE) or equivalent shall precede the test speci-

men in the test cycle in order to remove oxide or ﬂux resi-

due from the solder surface immediately before the test

specimen is introduced.

4.2.7.2 Test Specimen The test specimen shall be in

accordance with 1.7. The test specimen shall either be a

full board, a section of a board, or a suggested test speci-

men (see Figures 4-2 and 4-3). The test specimen shall be

of such a width as to allow 13 mm [0.512 in] clearance

from the solder pot sides. The minimum number of termi-

nations (plated-through holes or attachment lands) per test

specimen shall be six. If plated-through holes are to be

tested, then the minimum number of holes to be tested is

30 per test lot. This would require a minimum of ﬁve test

specimens (six holes per test specimen, 30 holes total). The

test specimen shall be representative of the product. The

exposed length of test specimen test face in the direction of

travel shall be25±5mm[0.984 ± 0.20 in]. Test specimen

preparation shall be in accordance with 3.4.

4.2.7.3 Procedure Dross and burned/residual ﬂux shall

be completely removed from the surface of the molten sol-

der immediately prior to dipping. After ﬂuxing and drain-

ing, per 4.1, mount the test specimen to be tested in the test

equipment test specimen holder. Adjust the test equipment

to immerse the test specimen into the solder bath to a

maximum of 50% of the test specimen thickness unless

otherwise speciﬁed. Activate the test equipment to expose

the test specimen to solder. After the test specimen has

cleared the solder bath, allow all the solder to solidify in

the position in which the machine stops before removing

from the test specimen holder. Care must be taken so that

solder does not ﬂow over the upper face of the test speci-

men. This may be impacted by the width of the test speci-

men. Dwell time at the maximum depth shall be 3.0 ± 0.5

IPC J-STD-003B March 2007

Provided by IHS under license with IPC

Not for Resale

No reproduction or networking permitted without license from IHS

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seconds. Prior to examination, all test specimens shall have

the ﬂux removed using a cleaning agent in accordance with

3.2.3.

4.2.7.4 Evaluation

4.2.7.4.1 Magnification

Test specimens shall be exam-

ined at 10X using the equipment speciﬁed in 3.3.3.

4.2.7.4.2 Surface Evaluation – Accept/Reject Criteria

An area of 3.0 mm [0.118 in] width from the trailing edge

of each test specimen shall not be evaluated. Areas con-

tacted by ﬁxtures shall not be evaluated. A minimum of

95% of each of the surfaces (i.e., each pad) being tested

shall exhibit good wetting. The balance of the surface may

contain only small pin holes, dewetted areas, and rough

spots provided such defects are not concentrated in one

area. For less critical applications, a smaller percent cover-

age may be determined between vendor and user. There

shall be no nonwetting or exposed base metal within the

evaluated area.

4.2.7.4.3 Plated-Through Hole Evaluation Only plated-

through holes that are at least 5.0 mm [0.197 in] from any

surface or ﬁxturing structure supporting the test specimen

during the test will be evaluated. An area of 3.0 mm [0.118

in] width from the trailing edge of each test specimen shall

not be evaluated. Areas contacted by ﬁxtures shall not be

evaluated.

Accept/Reject Criteria:

• Class 1 and 2 Product – Solder shall fully wet the wall

area of the plated-through holes, and plug holes less than

1.5 mm [0.0591 in] diameter (complete ﬁlling is not nec-

essary).

• Class 3 Product – The test specimen has soldered suc-

cessfully if solder has risen in all plated-through holes.

The solder shall have fully wetted the walls of the hole.

There shall be no nonwetting or exposed base metal on

any plated-through hole.

Accept/reject criteria for boards thickness <3.0 mm

[<0.118 in] shall be in accordance with 5.2 and Figures 4-5

and 4-6. The solder must have wet over the knee of the

hole and out onto the land around the top of the hole,

except for boards whose thickness exceeds 3.0 mm [0.118

in].

On thick boards, i.e., greater than 3.0 mm [0.118 in] the

capillary forces due to surface tension may not be large

enough to support the weight of the solder needed to ﬁll the

hole. This may prevent solder from ﬁlling the plated-

through hole and wetting over the knee of the hole and out

onto the land area around the top of the hole.

4.2.8 Test C1 – Solder Float Test Lead-Free Solder

This test is for solder ﬂoat testing of plated-through holes,

surface conductors and attachment lands.

4.2.8.1 Apparatus

4.2.8.1.1 Solder Pot

The solder pot shall meet the

requirements of 3.3.2. In addition, the surface area of the

pot shall be great enough to ﬂoat the test specimen without

it touching the sides of the pot.

4.2.8.1.2 Test Specimen Handling Tool Stainless steel

forceps, or other specially designed tools of stainless steel,

shall be used to handle the test specimen only by the

edges.

4.2.8.2 Test Specimen The test specimen shall be in

accordance with 1.7. The test specimen shall be a portion

of the printed board not greater than 50 x 50 mm [1.97 x

1.97 in], the suggested test specimen, or the complete

board if it is smaller than this size. The minimum number

of holes to be tested is 30 per test lot. If there are not at

least 30 holes in the test specimen, additional specimens

shall be tested until at least 30 holes have been tested (see

Figure 4-2 Through-Hole Test specimen). Test specimen

preparation shall be in accordance with 3.4.

4.2.8.3 Procedure Dross and burned/residual ﬂux shall

be completely removed from the surface of the molten sol-

der immediately prior to ﬂoating. After ﬂuxing and drain-

ing per 4.1, slide the test specimen gently on the molten

solder. Allow test specimen to ﬂoat on solder for ﬁve sec-

onds maximum. The test specimen may be depressed into

the solder bath to a maximum of 50% of the test specimen

thickness after it has been initially ﬂoated on the solder

bath (extreme care must be taken with boards that are less

than 0.8 mm [0.031 in] thick). After the elapsed time, slide

the test specimen off molten solder. Hold test specimen still

and horizontal until solder solidiﬁes. Prior to examination,

all test specimens shall have the ﬂux removed using a

cleaning agent in accordance with 3.2.3.

4.2.8.4 Evaluation

4.2.8.4.1 Magnification

Test specimens shall be exam-

ined at 10X using the equipment speciﬁed in 3.3.3.

4.2.8.4.2 Surface Evaluation – Accept/Reject Criteria

An area of 3.0 mm [0.118 in] width from the trailing edge

of each test specimen shall not be evaluated. Areas con-

tacted by ﬁxtures shall not be evaluated. A minimum of

95% of each of the surfaces (i.e., each pad) being tested

shall exhibit good wetting. The balance of the surface may

contain only small pin holes, dewetted areas, and rough

spots provided such defects are not concentrated in one

area. For less critical applications, a smaller percent cover-

age may be determined between vendor and user. There

shall be no nonwetting or exposed base metal within the

evaluated area.

March 2007 IPC J-STD-003B

Provided by IHS under license with IPC

Not for Resale

No reproduction or networking permitted without license from IHS

--`,,```,,,,````-`-`,,`,,`,`,,`---

//^:^^#^~^^"^~"^"^:$^~#:"#:$@:~^"$^:#*~^$^~:^#*^^:^^*\\