IPC J-STD-003B.pdf - 第7页

Table of Contents 1 GENERAL ................................................................. 1 1.1 Scope .............................................................. 1 1.2 Purpose .....................................…

100%1 / 48
Russell S. Shepherd, Microtek
Laboratories
Edwin Bradley, Motorola Inc.
John W. Porter, Multicore Solders
Ltd.
Christopher Hunt, Ph.D., National
Physical Laboratory
Keith Sweatman, Nihon Superior Co.,
Ltd.
Kil-Won Moon, Ph.D., NIST
Maureen Williams, NIST
Gordon Davy, Northrop Grumman
Corporation
Mary Dinh, Northrop Grumman
Space Systems
Gerard A. O’Brien, Photocircuits
Corporation
Timothy M. Pitsch, Plexus Corp.
Scott M. Ubl, Plexus Corp.
Dennis J. Cantwell, Printed Circuits
Inc.
Carol A. Handwerker, Sc.D., Purdue
University
Steven A. Herrberg, Raytheon
Company
William R. Russell, Raytheon
Company
Jeff Seekatz, Raytheon Company
Rudy Sedlak, RD Chemical Co.
Connie M. Korth, Reptron
Manufacturing Services/Hibbing
Beverley Christian, Ph.D., Research
In Motion Limited
Susan S. Hott, Robisan Laboratory
Inc.
Chris Mahanna, Robisan Laboratory
Inc.
David C. Adams, Rockwell Collins
Douglas O. Pauls, Rockwell Collins
Keith J. Whitlaw, Rohm and Haas
Company
Dawn Skala, Sandia National
Laboratories, Calif.
Zhang Yuan, Shenzhen Huawei
Technologies
Harry M. Siegel, STMicroelectronics
Inc.
Karl A. Sauter, Sun Microsystems
Inc.
Frank Y. S. Bai, Taiwan Printed
Circuit Association
William Sepp, Technic Inc.
Richard M. Edgar, Tec-Line Inc.
William Lee Vroom, Thomson
Consumer Electronics
Renee J. Michalkiewicz, Trace
Laboratories - East
George Milad, UIC/Uyemura
International Corp.
Vincent B. Kinol, Umicore America
Inc.
Chris Ball, C.I.D., Valeo Inc.
Donald M. Hague, W. M. Hague
Company
IPC J-STD-003B March 2007
iv
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--`,,```,,,,````-`-`,,`,,`,`,,`---
//^:^^#^~^^"^~"^"^:$^~#:"#:$@:~^"$^:#*~^$^~:^#*^^:^^*\\
Table of Contents
1 GENERAL ................................................................. 1
1.1 Scope .............................................................. 1
1.2 Purpose ........................................................... 1
1.3 Objective ........................................................ 1
1.3.1 Shall or Should .............................................. 1
1.3.2 Document Hierarchy ...................................... 1
1.4 Performance Classes ...................................... 1
1.5 Method Classification .................................... 1
1.5.1 Visual Acceptance Criteria Tests ................... 1
1.5.2 Force Measurement Criteria Tests ................ 2
1.5.3 Test(s) Methodologies Under Committee
Review ........................................................... 2
1.6 Test Method Selection ................................... 2
1.7 Test Specimen Requirements ........................ 2
1.8
Coating Durability ......................................... 3
1.9
Limitation ....................................................... 3
2 APPLICABLE DOCUMENTS .................................... 3
2.1
Industry .......................................................... 3
2.1.1
IPC ................................................................. 3
3 REQUIREMENTS ...................................................... 3
3.1
Terms and Definitions ................................... 3
3.2
Materials ......................................................... 3
3.2.1
Solder ............................................................. 3
3.2.2
Flux ................................................................ 4
3.2.2.1
Flux Maintenance .......................................... 4
3.2.3
Flux Removal ................................................. 4
3.3
Equipment ...................................................... 4
3.3.1
Conditioning Equipment ................................ 4
3.3.2
Solder Pot/Bath .............................................. 4
3.3.3
Optical Inspection Equipment ....................... 4
3.3.4
Dipping Equipment ........................................ 4
3.3.5
Timing Equipment ......................................... 4
3.4
Preparation for Testing .................................. 4
3.4.1 Test Specimen Preparation and
Conditioning for Test ..................................... 4
3.4.2
Durability Conditioning ................................. 4
3.4.3
Baking ............................................................ 4
3.5
Solder Bath Requirements ............................. 5
3.5.1
Solder Temperatures ...................................... 5
3.5.2
Solder Contamination Control ....................... 5
4 TEST PROCEDURES ............................................... 6
4.1
Test Procedure Limitations ............................ 6
4.1.1
Application of Flux ....................................... 6
4.2 Tests with Established Accept/
Reject Criteria ................................................ 7
4.2.1
Test A – Edge Dip Test Tin/Lead Solder ...... 7
4.2.1.1
Apparatus ....................................................... 7
4.2.1.1.1
Solder Pot/Bath .............................................. 7
4.2.1.1.2
Dipping Device .............................................. 7
4.2.1.2
Test Specimen ................................................ 7
4.2.1.3
Procedure ....................................................... 7
4.2.1.4
Evaluation ...................................................... 9
4.2.1.4.1
Magnification ................................................. 9
4.2.1.4.2 Surface Evaluation – Accept/
Reject Criteria ................................................ 9
4.2.2
Test B – Rotary Dip Test Tin/Lead Solder ... 9
4.2.2.1
Apparatus ....................................................... 9
4.2.2.2
Test Specimen ................................................ 9
4.2.2.3
Procedure ....................................................... 9
4.2.2.4
Evaluation ...................................................... 9
4.2.2.4.1
Magnification ................................................. 9
4.2.2.4.2 Surface Evaluation – Accept/
Reject Criteria .............................................. 10
4.2.2.4.3
Plated-Through Hole Evaluation ................. 10
4.2.3 Test C – Solder Float Test Tin/
Lead Solder .................................................. 11
4.2.3.1
Apparatus ..................................................... 11
4.2.3.1.1
Solder Pot ..................................................... 11
4.2.3.1.2
Test Specimen Handling Tool ..................... 11
4.2.3.2
Test Specimen .............................................. 11
4.2.3.3
Procedure ...................................................... 11
4.2.3.4
Evaluation .................................................... 11
4.2.3.4.1
Magnification ............................................... 11
4.2.3.4.2 Surface Evaluation – Accept/
Reject Criteria .............................................. 11
4.2.3.4.3
Plated-Through Hole Evaluation ................. 11
4.2.4 Test D – Wave Solder Test Tin/
Lead Solder .................................................. 11
4.2.4.1
Apparatus ..................................................... 11
4.2.4.2
Test Specimen .............................................. 11
4.2.4.3
Procedure ...................................................... 11
4.2.4.4
Evaluation .................................................... 12
4.2.4.4.1
Magnification ............................................... 12
4.2.4.4.2 Surface Evaluation – Accept/
Reject Criteria .............................................. 12
4.2.4.4.3
Plated-Through Hole Evaluation ................. 12
March 2007 IPC J-STD-003B
v
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--`,,```,,,,````-`-`,,`,,`,`,,`---
//^:^^#^~^^"^~"^"^:$^~#:"#:$@:~^"$^:#*~^$^~:^#*^^:^^*\\
4.2.5 Test E – Surface Mount Process
Simulation Test Tin/Lead Solder ................. 12
4.2.5.1 Apparatus ..................................................... 12
4.2.5.1.1 Stencil/Screen ............................................... 12
4.2.5.1.2 Paste Application Tool ................................. 12
4.2.5.2 Test Specimen .............................................. 12
4.2.5.3 Reflow Equipment ....................................... 12
4.2.5.4 Procedure ..................................................... 13
4.2.5.5 Evaluation .................................................... 13
4.2.5.5.1 Magnification ............................................... 13
4.2.5.5.2 Surface Evaluation – Accept/
Reject Criteria .............................................. 13
4.2.6 Test A1 – Edge Dip Test Lead-
Free Solder ................................................... 14
4.2.6.1 Apparatus ..................................................... 14
4.2.6.1.1 Solder Pot/Bath ............................................ 14
4.2.6.1.2 Dipping Device ............................................ 14
4.2.6.2 Test Specimen .............................................. 14
4.2.6.3 Procedure ..................................................... 14
4.2.6.4 Evaluation .................................................... 14
4.2.6.4.1 Magnification ............................................... 14
4.2.6.4.2 Surface Evaluation – Accept/
Reject Criteria .............................................. 14
4.2.7 Test B1 – Rotary Dip Test Lead-
Free Solder ................................................... 14
4.2.7.1 Apparatus ..................................................... 14
4.2.7.2 Test Specimen .............................................. 14
4.2.7.3
Procedure ..................................................... 14
4.2.7.4
Evaluation .................................................... 15
4.2.7.4.1
Magnification ............................................... 15
4.2.7.4.2 Surface Evaluation – Accept/
Reject Criteria .............................................. 15
4.2.7.4.3
Plated-Through Hole Evaluation ................. 15
4.2.8 Test C1 – Solder Float Test Lead-
Free Solder ................................................... 15
4.2.8.1
Apparatus ..................................................... 15
4.2.8.1.1
Solder Pot ..................................................... 15
4.2.8.1.2
Test Specimen Handling Tool ..................... 15
4.2.8.2
Test Specimen .............................................. 15
4.2.8.3
Procedure ..................................................... 15
4.2.8.4
Evaluation .................................................... 15
4.2.8.4.1
Magnification ............................................... 15
4.2.8.4.2 Surface Evaluation – Accept/
Reject Criteria .............................................. 15
4.2.8.4.3
Plated-Through Hole Evaluation ................. 16
4.2.9 Test D1 – Wave Solder Test Lead-
Free Solder ................................................... 16
4.2.9.1
Apparatus ..................................................... 16
4.2.9.2 Test Specimen .............................................. 16
4.2.9.3 Procedure ..................................................... 16
4.2.9.4 Evaluation .................................................... 16
4.2.9.4.1 Magnification ............................................... 16
4.2.9.4.2 Surface Evaluation – Accept/
Reject Criteria .............................................. 16
4.2.9.4.3 Plated-Through Hole Evaluation ................. 16
4.2.10 Test E1 – Surface Mount Process
Simulation Test Lead-Free Solder ............... 16
4.2.10.1 Apparatus ..................................................... 17
4.2.10.1.1 Stencil/Screen ............................................... 17
4.2.10.1.2 Paste Application Tool ................................. 17
4.2.10.2 Test Specimen .............................................. 17
4.2.10.3 Reflow Equipment ....................................... 17
4.2.10.4 Procedure ..................................................... 17
4.2.10.5 Evaluation .................................................... 17
4.2.10.5.1 Magnification ............................................... 17
4.2.10.5.2 Surface Evaluation – Accept/
Reject Criteria .............................................. 17
4.3 Tests with Force Measurement Criteria ...... 18
4.3.1 Test F – Wetting Balance Test:
Tin/Lead Solder ........................................... 18
4.3.1.1 Apparatus ..................................................... 18
4.3.1.1.1 Dipping Device ............................................ 18
4.3.1.2 Test Specimen .............................................. 18
4.3.1.3
Procedure ..................................................... 18
4.3.1.4
Evaluation .................................................... 19
4.3.1.4.1
Magnification ............................................... 19
4.3.1.4.2
Suggested Criteria ........................................ 19
4.3.1.5 Gauge Repeatability and
Reproducibility (GR&R) Protocol .............. 19
4.3.2 Test F1 – Wetting Balance Test:
Lead-Free Solder ......................................... 21
4.3.2.1
Apparatus ..................................................... 21
4.3.2.1.1
Dipping Device ............................................ 21
4.3.2.2
Test Specimen .............................................. 21
4.3.2.3
Procedure ..................................................... 21
4.3.2.4
Evaluation .................................................... 21
4.3.2.4.1
Magnification ............................................... 21
4.3.2.4.2
Suggested Criteria ........................................ 21
4.3.2.5 Gauge Repeatability and
Reproducibility (GR&R) Protocol .............. 21
5 EVALUATION AIDS ................................................ 22
5.1
Evaluation Aids – Surface ........................... 22
5.2 Evaluation Aids – For Class 3
Plated-Through Holes .................................. 22
6 NOTES ..................................................................... 23
IPC J-STD-003B March 2007
vi
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--`,,```,,,,````-`-`,,`,,`,`,,`---
//^:^^#^~^^"^~"^"^:$^~#:"#:$@:~^"$^:#*~^$^~:^#*^^:^^*\\