IPC J-STD-003B.pdf - 第6页
Russell S. Shepherd, Microtek Laboratories Edwin Bradley , Motorola Inc. John W . Porter , Multicore Solders Ltd. Christopher Hunt, Ph.D., National Physical Laboratory Keith Sweatman, Nihon Superior Co., Ltd. Kil-W on Mo…
Acknowledgment
Any document involving a complex technology draws material from a vast number of sources. While the principal members
of the Printed Wiring Board Solderability Specification Task Group (5-23a) of the Assembly & Joining Processes Commit-
tee (5-20) are shown below, it is not possible to include all of those who assisted in the evolution of this Standard. To each
of them, the members of IPC extend their gratitude.
Assembly & Joining
Processes Committee
Printed Wiring Board
Solderability Specification
Task Group
Technical Liaisons of the
IPC Board of Directors
Chair
Leo P. Lambert
EPTAC Corporation
Vice Chair
Renee J. Michalkiewicz
Trace Laboratories - East
Chair
David D. Hillman
Rockwell Collins
Vice Chair
Dennis Fritz
MacDermid, Inc.
Peter Bigelow
IMI Inc.
Sammy Yi
Flextronics International
Printed Wiring Board Solderability Specification Task Group
Blaine Partee, ACI/EMPF
Trevor Bowers, Adtran Inc.
Brenda Ross, Air Products &
Chemicals
Lorianne Hamoline, Alcatel-Lucent
Bradley Smith, Allegro MicroSystems
Inc.
Charles Dal Currier, Ambitech Inc.
Andrew Giamis, Andrew Corporation
George M. Wenger, Andrew
Corporation
Greg Alexander, Ascentech, LLC
Kuldip Johal, Atotech USA Inc.
Robert Wettermann, B E S T Inc.
Mark Buechner, BAE Systems
Thomas A. Carroll, Boeing Space
Systems
Gail Auyeung, Celestica International
Inc.
Jason Bragg, Celestica International
Inc.
Kevin Weston, Celestica International
Inc.
Mario Kasilag, Consultant
David J. Corbett, Defense Supply
Center Columbus
Patrick Kyne, Defense Supply Center
Columbus
David E. Moore, Defense Supply
Center Columbus
Lowell Sherman, Defense Supply
Center Columbus
Jim R. Reed, Dell Inc.
John H. Rohlfing, Delphi Electronics
and Safety
Philip W. Wittmer, Delphi Electronics
and Safety
Brian C. McCrory, Delsen Testing
Laboratories
Glenn Dody, Dody Consulting
Theodore Edwards, Dynaco Corp.
Peter Bratin, ECI Technology, Inc.
Michael Pavlov, ECI Technology, Inc.
Werner Engelmaier, Engelmaier
Associates, L.C.
Karl F. Wengenroth, Enthone Inc. -
Cookson Electronics
Yung-Herng Yau, Enthone Inc. -
Cookson Electronics
Benny Nilsson, Ericsson AB
Michael W. Yuen, Foxconn EMS,
Inc.
Graham Naisbitt, Gen3 Systems
Limited
Brian J. Toleno, Ph.D., Henkel
Corporation
Jere Wittig, HFK Precision Metal
Stamping Corporation
Suzanne F. Nachbor, Honeywell
DSES Minneapolis
Chris W. Alter, Honeywell Inc.
Joseph T. Slanina, Honeywell Inc.
Vicka White, Honeywell Inc.
Dewey Whittaker, Honeywell Inc.
Whitney Aguilar, Hydro-Aire
Division/Crane Co.
James D. Bielick, IBM Corporation
Theron L. Lewis, IBM Corporation
Gary B. Long, Intel Corporation
James F. Maguire, Intel Corporation
Jack McCullen, Intel Corporation
Mark A. Kwoka, Intersil Corporation
J. Lee Parker, Ph.D., JLP
Howard S. Feldmesser, Johns
Hopkins University
Akikazu Shibata, Ph.D., JPCA-Japan
Electronics Packaging and Circuits
Association
Mary Carter Berrios, Kemet
Electronics Corp.
Richard E. Kraszewski, Kimball
Electronics Group
Phillip Chen, L-3 Communications
Electronic Systems
Steven M. Nolan, C.I.D.+, Lockheed
Martin Maritime Systems
Vijay Kumar, Lockheed Martin
Missile & Fire Control
Linda Woody, Lockheed Martin
Missile & Fire Control
Hue T. Green, Lockheed Martin
Space Systems Company
Donald P. Cullen, MacDermid, Inc.
Bihari Patel, MacDermid, Inc.
Srinivas Chada, Ph.D., Medtronic
Microelectronics Center
Randy R. Reed, Merix Corporation
Francis Anglade, Metronelec
March 2007 IPC J-STD-003B
iii
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
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Russell S. Shepherd, Microtek
Laboratories
Edwin Bradley, Motorola Inc.
John W. Porter, Multicore Solders
Ltd.
Christopher Hunt, Ph.D., National
Physical Laboratory
Keith Sweatman, Nihon Superior Co.,
Ltd.
Kil-Won Moon, Ph.D., NIST
Maureen Williams, NIST
Gordon Davy, Northrop Grumman
Corporation
Mary Dinh, Northrop Grumman
Space Systems
Gerard A. O’Brien, Photocircuits
Corporation
Timothy M. Pitsch, Plexus Corp.
Scott M. Ubl, Plexus Corp.
Dennis J. Cantwell, Printed Circuits
Inc.
Carol A. Handwerker, Sc.D., Purdue
University
Steven A. Herrberg, Raytheon
Company
William R. Russell, Raytheon
Company
Jeff Seekatz, Raytheon Company
Rudy Sedlak, RD Chemical Co.
Connie M. Korth, Reptron
Manufacturing Services/Hibbing
Beverley Christian, Ph.D., Research
In Motion Limited
Susan S. Hott, Robisan Laboratory
Inc.
Chris Mahanna, Robisan Laboratory
Inc.
David C. Adams, Rockwell Collins
Douglas O. Pauls, Rockwell Collins
Keith J. Whitlaw, Rohm and Haas
Company
Dawn Skala, Sandia National
Laboratories, Calif.
Zhang Yuan, Shenzhen Huawei
Technologies
Harry M. Siegel, STMicroelectronics
Inc.
Karl A. Sauter, Sun Microsystems
Inc.
Frank Y. S. Bai, Taiwan Printed
Circuit Association
William Sepp, Technic Inc.
Richard M. Edgar, Tec-Line Inc.
William Lee Vroom, Thomson
Consumer Electronics
Renee J. Michalkiewicz, Trace
Laboratories - East
George Milad, UIC/Uyemura
International Corp.
Vincent B. Kinol, Umicore America
Inc.
Chris Ball, C.I.D., Valeo Inc.
Donald M. Hague, W. M. Hague
Company
IPC J-STD-003B March 2007
iv
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
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Table of Contents
1 GENERAL ................................................................. 1
1.1 Scope .............................................................. 1
1.2 Purpose ........................................................... 1
1.3 Objective ........................................................ 1
1.3.1 Shall or Should .............................................. 1
1.3.2 Document Hierarchy ...................................... 1
1.4 Performance Classes ...................................... 1
1.5 Method Classification .................................... 1
1.5.1 Visual Acceptance Criteria Tests ................... 1
1.5.2 Force Measurement Criteria Tests ................ 2
1.5.3 Test(s) Methodologies Under Committee
Review ........................................................... 2
1.6 Test Method Selection ................................... 2
1.7 Test Specimen Requirements ........................ 2
1.8
Coating Durability ......................................... 3
1.9
Limitation ....................................................... 3
2 APPLICABLE DOCUMENTS .................................... 3
2.1
Industry .......................................................... 3
2.1.1
IPC ................................................................. 3
3 REQUIREMENTS ...................................................... 3
3.1
Terms and Definitions ................................... 3
3.2
Materials ......................................................... 3
3.2.1
Solder ............................................................. 3
3.2.2
Flux ................................................................ 4
3.2.2.1
Flux Maintenance .......................................... 4
3.2.3
Flux Removal ................................................. 4
3.3
Equipment ...................................................... 4
3.3.1
Conditioning Equipment ................................ 4
3.3.2
Solder Pot/Bath .............................................. 4
3.3.3
Optical Inspection Equipment ....................... 4
3.3.4
Dipping Equipment ........................................ 4
3.3.5
Timing Equipment ......................................... 4
3.4
Preparation for Testing .................................. 4
3.4.1 Test Specimen Preparation and
Conditioning for Test ..................................... 4
3.4.2
Durability Conditioning ................................. 4
3.4.3
Baking ............................................................ 4
3.5
Solder Bath Requirements ............................. 5
3.5.1
Solder Temperatures ...................................... 5
3.5.2
Solder Contamination Control ....................... 5
4 TEST PROCEDURES ............................................... 6
4.1
Test Procedure Limitations ............................ 6
4.1.1
Application of Flux ....................................... 6
4.2 Tests with Established Accept/
Reject Criteria ................................................ 7
4.2.1
Test A – Edge Dip Test Tin/Lead Solder ...... 7
4.2.1.1
Apparatus ....................................................... 7
4.2.1.1.1
Solder Pot/Bath .............................................. 7
4.2.1.1.2
Dipping Device .............................................. 7
4.2.1.2
Test Specimen ................................................ 7
4.2.1.3
Procedure ....................................................... 7
4.2.1.4
Evaluation ...................................................... 9
4.2.1.4.1
Magnification ................................................. 9
4.2.1.4.2 Surface Evaluation – Accept/
Reject Criteria ................................................ 9
4.2.2
Test B – Rotary Dip Test Tin/Lead Solder ... 9
4.2.2.1
Apparatus ....................................................... 9
4.2.2.2
Test Specimen ................................................ 9
4.2.2.3
Procedure ....................................................... 9
4.2.2.4
Evaluation ...................................................... 9
4.2.2.4.1
Magnification ................................................. 9
4.2.2.4.2 Surface Evaluation – Accept/
Reject Criteria .............................................. 10
4.2.2.4.3
Plated-Through Hole Evaluation ................. 10
4.2.3 Test C – Solder Float Test Tin/
Lead Solder .................................................. 11
4.2.3.1
Apparatus ..................................................... 11
4.2.3.1.1
Solder Pot ..................................................... 11
4.2.3.1.2
Test Specimen Handling Tool ..................... 11
4.2.3.2
Test Specimen .............................................. 11
4.2.3.3
Procedure ...................................................... 11
4.2.3.4
Evaluation .................................................... 11
4.2.3.4.1
Magnification ............................................... 11
4.2.3.4.2 Surface Evaluation – Accept/
Reject Criteria .............................................. 11
4.2.3.4.3
Plated-Through Hole Evaluation ................. 11
4.2.4 Test D – Wave Solder Test Tin/
Lead Solder .................................................. 11
4.2.4.1
Apparatus ..................................................... 11
4.2.4.2
Test Specimen .............................................. 11
4.2.4.3
Procedure ...................................................... 11
4.2.4.4
Evaluation .................................................... 12
4.2.4.4.1
Magnification ............................................... 12
4.2.4.4.2 Surface Evaluation – Accept/
Reject Criteria .............................................. 12
4.2.4.4.3
Plated-Through Hole Evaluation ................. 12
March 2007 IPC J-STD-003B
v
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--`,,```,,,,````-`-`,,`,,`,`,,`---
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