IPC J-STD-003B.pdf - 第9页

6.1 Correction for Buoyancy ............................. 23 6.2 Preheat .......................................................... 23 6.3 Baking .......................................................... 23 6.4 Prebakin…

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4.2.5 Test E – Surface Mount Process
Simulation Test Tin/Lead Solder ................. 12
4.2.5.1 Apparatus ..................................................... 12
4.2.5.1.1 Stencil/Screen ............................................... 12
4.2.5.1.2 Paste Application Tool ................................. 12
4.2.5.2 Test Specimen .............................................. 12
4.2.5.3 Reflow Equipment ....................................... 12
4.2.5.4 Procedure ..................................................... 13
4.2.5.5 Evaluation .................................................... 13
4.2.5.5.1 Magnification ............................................... 13
4.2.5.5.2 Surface Evaluation – Accept/
Reject Criteria .............................................. 13
4.2.6 Test A1 – Edge Dip Test Lead-
Free Solder ................................................... 14
4.2.6.1 Apparatus ..................................................... 14
4.2.6.1.1 Solder Pot/Bath ............................................ 14
4.2.6.1.2 Dipping Device ............................................ 14
4.2.6.2 Test Specimen .............................................. 14
4.2.6.3 Procedure ..................................................... 14
4.2.6.4 Evaluation .................................................... 14
4.2.6.4.1 Magnification ............................................... 14
4.2.6.4.2 Surface Evaluation – Accept/
Reject Criteria .............................................. 14
4.2.7 Test B1 – Rotary Dip Test Lead-
Free Solder ................................................... 14
4.2.7.1 Apparatus ..................................................... 14
4.2.7.2 Test Specimen .............................................. 14
4.2.7.3
Procedure ..................................................... 14
4.2.7.4
Evaluation .................................................... 15
4.2.7.4.1
Magnification ............................................... 15
4.2.7.4.2 Surface Evaluation – Accept/
Reject Criteria .............................................. 15
4.2.7.4.3
Plated-Through Hole Evaluation ................. 15
4.2.8 Test C1 – Solder Float Test Lead-
Free Solder ................................................... 15
4.2.8.1
Apparatus ..................................................... 15
4.2.8.1.1
Solder Pot ..................................................... 15
4.2.8.1.2
Test Specimen Handling Tool ..................... 15
4.2.8.2
Test Specimen .............................................. 15
4.2.8.3
Procedure ..................................................... 15
4.2.8.4
Evaluation .................................................... 15
4.2.8.4.1
Magnification ............................................... 15
4.2.8.4.2 Surface Evaluation – Accept/
Reject Criteria .............................................. 15
4.2.8.4.3
Plated-Through Hole Evaluation ................. 16
4.2.9 Test D1 – Wave Solder Test Lead-
Free Solder ................................................... 16
4.2.9.1
Apparatus ..................................................... 16
4.2.9.2 Test Specimen .............................................. 16
4.2.9.3 Procedure ..................................................... 16
4.2.9.4 Evaluation .................................................... 16
4.2.9.4.1 Magnification ............................................... 16
4.2.9.4.2 Surface Evaluation – Accept/
Reject Criteria .............................................. 16
4.2.9.4.3 Plated-Through Hole Evaluation ................. 16
4.2.10 Test E1 – Surface Mount Process
Simulation Test Lead-Free Solder ............... 16
4.2.10.1 Apparatus ..................................................... 17
4.2.10.1.1 Stencil/Screen ............................................... 17
4.2.10.1.2 Paste Application Tool ................................. 17
4.2.10.2 Test Specimen .............................................. 17
4.2.10.3 Reflow Equipment ....................................... 17
4.2.10.4 Procedure ..................................................... 17
4.2.10.5 Evaluation .................................................... 17
4.2.10.5.1 Magnification ............................................... 17
4.2.10.5.2 Surface Evaluation – Accept/
Reject Criteria .............................................. 17
4.3 Tests with Force Measurement Criteria ...... 18
4.3.1 Test F – Wetting Balance Test:
Tin/Lead Solder ........................................... 18
4.3.1.1 Apparatus ..................................................... 18
4.3.1.1.1 Dipping Device ............................................ 18
4.3.1.2 Test Specimen .............................................. 18
4.3.1.3
Procedure ..................................................... 18
4.3.1.4
Evaluation .................................................... 19
4.3.1.4.1
Magnification ............................................... 19
4.3.1.4.2
Suggested Criteria ........................................ 19
4.3.1.5 Gauge Repeatability and
Reproducibility (GR&R) Protocol .............. 19
4.3.2 Test F1 – Wetting Balance Test:
Lead-Free Solder ......................................... 21
4.3.2.1
Apparatus ..................................................... 21
4.3.2.1.1
Dipping Device ............................................ 21
4.3.2.2
Test Specimen .............................................. 21
4.3.2.3
Procedure ..................................................... 21
4.3.2.4
Evaluation .................................................... 21
4.3.2.4.1
Magnification ............................................... 21
4.3.2.4.2
Suggested Criteria ........................................ 21
4.3.2.5 Gauge Repeatability and
Reproducibility (GR&R) Protocol .............. 21
5 EVALUATION AIDS ................................................ 22
5.1
Evaluation Aids – Surface ........................... 22
5.2 Evaluation Aids – For Class 3
Plated-Through Holes .................................. 22
6 NOTES ..................................................................... 23
IPC J-STD-003B March 2007
vi
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
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6.1 Correction for Buoyancy ............................. 23
6.2 Preheat .......................................................... 23
6.3 Baking .......................................................... 23
6.4 Prebaking ..................................................... 23
6.5 Safety Note .................................................. 23
6.6 Use of Nonactivated Flux ........................... 23
6.7 Solder Contact ............................................. 23
APPENDIX A Calculation of Maximum
Theoretical Force for a
Rectangular Cross-Section
............ 24
APPENDIX B Calculation of Area Under
the Wetting Curve
........................... 25
APPENDIX C Informative Annex ........................... 26
APPENDIX D Test Protocol for Wetting
Balance Gauge Repeatability
and Reproducibility (GR&R)
Using Copper Foil Coupons
............. 27
APPENDIX E J-STD-002/J-STD-003 Activated
Solderability Test Flux Rationale
Committee Letter
............................. 28
Figures
Figure 3-1 Contact Angle ................................................... 3
Figure 3-2 Example Reticle ................................................ 5
Figure 4-1 Edge Dip Solderability Test .............................. 7
Figure 4-2 Suggested Test Specimen for Plated-
Through Holes .................................................. 8
Figure 4-3 Suggested Test Specimen for Surface
Mount Features ................................................ 8
Figure 4-4 Rotary Dip Test ................................................. 9
Figure 4-5 Effectiveness of Solder Wetting of
Plated-Through Holes - Class 3 ..................... 10
Figure 4-6 Examples of Solder Wetting of Plated-
Through Holes - Class 3 ................................ 10
Figure 4-7 Wetting Balance Apparatus ............................ 18
Figure 4-8 Suggested Wetting Balance Test
Specimens and Soldering Immersion ............ 18
Figure 4-9 Wetting Balance Test Soldering Immersion ... 19
Figure 4-10 Set A Wetting Curve ....................................... 20
Figure 4-11 Set B Wetting Curve ....................................... 20
Figure 5-1 Aid to Evaluation ............................................ 22
Tables
Table 1-1 Test Method Selection ......................................... 2
Table 1-2 Conditioning and Test Requirements .................. 3
Table 3-1 Flux Composition ................................................ 4
Table 3-2 Maximum Limits of Solder Bath Contaminant .... 5
Table 4-1 Stencil Thickness Requirements ....................... 12
Table 4-2 Reflow Parameter Requirements ...................... 12
Table 4-3 Stencil Thickness Requirements ....................... 17
Table 4-4 Lead-Free Reflow Parameter Requirements .... 17
Table 4-5 Wetting Balance Parameter and
Suggested Criteria ............................................ 19
Table 4-6 Wetting Balance Parameter and
Suggested Criteria ............................................ 21
March 2007 IPC J-STD-003B
vii
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
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IPC J-STD-003B March 2007
viii
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale
No reproduction or networking permitted without license from IHS
--`,,```,,,,````-`-`,,`,,`,`,,`---
//^:^^#^~^^"^~"^"^:$^~#:"#:$@:~^"$^:#*~^$^~:^#*^^:^^*\\