Specification SIPLACE X-Series S 规格说明书.pdf - 第15页

15 Placement heads SIPLACE SpeedStar (C&P20 P2) SIPLACE SpeedS tar(C&P20 P2) With component camera type 48 Component range a a) Please note that the placeable component range is also affect ed by the pad geometry…

Placement heads

General

Head modularity

The SIPLACE placement

machines are distinguished

by maximum flexibility in the

production process. This

flexibility is in part due to the

head modularity of the place-

ment machines, which allows

different placement head

variants to be configured to

suit the production require-

ments.

The SIPLACE SpeedStar

and the SIPLACE MultiStar

operate according to the

Collect&Place principle i.e.

one cycle includes pickup or

"collection" of 20 or 12 com-

ponents, their optical center-

ing on the board and their

rotation into the required

placement angle and posi-

tion. They are then placed

gently and accurately onto

the PCB. This principle is

particularly suitable for high-

speed placement of standard

components.

The SIPLACE MultiStar also

functions according to the

Pick&Place principle. Two

components are picked up

by the SIPLACE MultiStar,

optically centered on the way

to the placement position

and rotated into the required

placement angle. This princi-

ple is particularly suitable for

fast and precise placement

of large components.

The SIPLACE MultiStar uses

both the Collect&Place and

the Pick&Place principle.

Mixed Mode allows com-

bined use of these two

modes, which were previ-

ously separated from one

another, in one placement

cycle.

Pick&Place mode (Twin

Head)

The high-precision SIPLACE

TwinStar functions according

to the Pick&Place principle.

Two components are picked

up by the SIPLACE TwinStar

placement head, optically

centered on the way to the

placement position and then

rotated into the required

placement angle. This princi-

ple is particularly suitable for

fast and precise placement

of special components, such

as those required for grip-

pers etc.

Control and self-learning

functions

The reliability of the

SIPLACE placement heads

can be enhanced even fur-

ther with various checking

and self-learning functions.

• Component sensor

Checks the presence of

the components on the

nozzle before the pickup

and placement process

• Digital camera

Checks the position of

each component on the

nozzle. This check is per-

formed in a single step,

with no extra time involved

but with optimum scan-

ning of each individual

component.

• Force sensor

Monitors the prescribed

component set-down

force. The sensor stop

procedure enables com-

pensation of height differ-

ences during pickup and

PCB warpage during

placement.

• Vacuum sensor

Checks whether the com-

ponent was correctly

picked up or placed.

Collect&Place mode

Pick&Place mode

(SIPLACE MultiStar)

Mixed mode

Placement heads

SIPLACE SpeedStar (C&P20 P2)

SIPLACE SpeedStar(C&P20 P2)

With component camera type 48

Component range

a) Please note that the placeable component range is also affected by the pad geometry, the customer-

specific standards, the component packaging tolerances and the component tolerances.

0.12 mm x 0.12 (0201 metric) to 2220, Melf, SOT, SOD, Bare-

Die, Flip-Chip

Component spec.

Max. height

Min. lead pitch

Min. lead width

Min. ball pitch

Min. ball diameter

Min. dimensions

Max. dimensions

Max. weight

4 mm

70 µm

30 µm

100 µm

50 µm

0.12 mm x 0.12 mm

8.2 mm x 8.2 mm

1 g

Set-down force 1.3 N ± 0.5N (default value)

0.5 N - 4.5 N

Touchless Placement

Nozzle types 60xx

X/Y accuracy

b) The accuracy values fulfill the conditions in the SIPLACE scope of supply and services.

± 34 µm/3σ

Angular accuracy ± 0.5° / 3σ

Illumination levels 5

Placement heads

SIPLACE MultiStar (CPP)

With component camera

type 30

With component camera

type 33

(stationary camera)

Component range

a) Please note that the placeable component range is also affected by the pad geometry, the customer-

specific standards, the component packaging tolerances and the component tolerances.

01005 to 27 mm x 27 mm

0402 to 50 mm x 40 mm

b) A diagonal of 69 mm is possible during multiple measurements (e.g. 60 mm x 10 mm).

Component spec.

Max height

Max. height

Min. lead pitch

Min. lead width

Min. ball pitch

Min. ball diameter

Min. dimensions

Max. dimensions

Max. weight

c) CPP head: in low installation position (stationary component camera not possible).

d) CPP head: In high installation position

6.0 mm

8.5 mm

250 µm

100 µm

/ 200 µm

250 µm

/ 350 µm

140 µm

/ 200 µm

0.4 mm x 0.2 mm

27 mm x 27 mm

4 g

e) For components < 18 mm x 18 mm.

f) For components ≥ 18 mm x18 mm.

g) 20 g in "Pick&Place" mode

11.5 mm / 15.5 mm

300 µm

150 µm

350 µm

200 µm

1.0mm x 0.5mm

50 mm x 40 mm

8 g

h) 15.5 mm only in top assembly position, with OSC package and restrictions. See also the OSC package

on page 43.

Set-down force 1.0 - 15 N

i) 10 N standard, with OSC package 15 N.

Nozzle types 20xx, 28xx

X/Y accuracy

j) The accuracy values fulfill the conditions in the SIPLACE scope of supply and services.

± 38 µm/3σ ± 30 µm/3σ

Angular accuracy ± 0.20° / 3σ

, ± 0.38° / 3σ

k) Component dimensions between 6 mm x 6 mm and 27 mm x 27 mm.

l) Component dimensions smaller than 6 mm x 6 mm.

± 0.12° / 3σ

Illumination levels 5 6