Specification E by SIPLACE 规格说明书.pdf - 第18页

18 Virtual Inkspot Handler (VIH) The virtual inks pot handle r (VIH) allows you to scan in inkspots from an external system. This option can be use d for external systems to define which panels are to be produced and whi…

PCB Warpage

PCB warpage during placement

To avoid impairing the placement quality and

speed, we recommend using a PCB support e.g.

Smart Pin Support so that the PCB warpage

downwards does not exceed 0.5 mm.

PCB warpage up, max. 2 mm

PCB support

PCB warpage down, max. 2 mm

Changes in the surface position are automatically applied by the functions for learning the height.

Virtual Inkspot Handler (VIH)

The virtual inkspot handler

(VIH) allows you to scan in

inkspots from an external

system.

This option can be used for

external systems to define

which panels are to be

produced and which to be

omitted. A panel is a specific

part of a printed circuit

board. This concept is much

more flexible than the

physical inkspot concept.

It can be integrated into the

ongoing production process,

if external systems

individually decide whether

each panel it is in a good or

bad state and whether

additional processing steps

are to be omitted or not.

The boards are typically

measured by the external

system and the information

about which panels are good

or bad is then available.

The use of this information

via VIH offers the benefit that

no physical inkspots need to

be read by the PCB camera.

This improves performance,

particularly for boards with a

large number of panels.

This option can also be used

if the panels do not have

room for a physical inkspot.

Workflow VIH with XML file

Workflow VIH with MES and BoardGateKeeper (BGK)

Process Data Interfaces (PDI)

The process data interface (PDI), which can be addressed via

the OIB interface, enables you to access not only the trace-

ability data of the components placed but also various process

parameters for the component placement. The PDI makes

over 40 process attributes per placement position available,

such as:

• Pickup (actual pick position, pickup location ID)

• Dipping (result, timestamp)

• Vision measuring (result plus camera ID)

• Placement (actual place position, ref. desig., vacuum val-

ues)

The data packages contain the data for each board and stop-

per position.

Each individual data package contains a maximum of 200

placement positions.

Component Feeding

Component Trolley

Component trolley

E by SIPLACE

The E by SIPLACE compo-

nent trolleys are independent

and easily maneuverable

modules. The E by SIPLACE

machines can accommodate

up to two component trolleys,

each with 60 tracks. The tape

reels are taken up into the

tape container of the compo-

nent trolley. A cutting device

on the machine automatically

cuts the used tape material.

The component trolleys can

be set up directly on the

machine or at an external

setup area with feeder mod-

ules. The benefits of offline

setup are that the configura-

tions can be prepared with-

out stopping the line. This

allows the setup to be

changed very quickly using

the changeover table princi-

ple. The E by SIPLACE com-

ponent trolleys also support

fast setting up and tearing

down of feeder modules

even during the placement

process.

The component feeders are

at rest during the placement

process - allowing tapes to

be spliced without stopping

the machine.

For safety reasons, unoccu-

pied locations are fitted with

so-called dummy feeder

modules.

Component trolley E by SIPLACE

Tape container

Waste container for remaining empty tape

Changeover table