Specification E by SIPLACE 规格说明书.pdf - 第28页

28 SIPLACE Vision OnBoard Inspection and Pattern Matching OnBoard Inspection The OnBoard PCB Inspec- tion (SW option) uses the PCB camera to inspect criti- cal areas of the board, spec- ified by the user, e.g. under BGA …

Component Feeding

Alternative SIPLACE Modules

SIPLACE LDU E

The SIPLACE LDU E is used for coating flip

chips and CSP components with flux. The flux

container slides with a linear movement over

the dip plate and coats the cavity in the dip plate

with a layer of flux (predefined layer thickness).

The parameters for coating a component with

flux are prescribed in SIPLACE Pro.

The component is coated and then the flux layer

is renewed.

This sequence guarantees consistent process-

ing conditions for the components. The

SIPLACE LDU E is taken into account as an

independent feeder module type in the setup.

An implemented warming function allows the

viscosity of the flux to be altered. It occupies 9

locations of an 8 mm E feeder module.

SIPLACE LDU E

Bowl Feeder (OEM Product)

Via a single or multiple Feeder Adapter E, the

Bowl Feeders can be setup and used on E by

SIPLACE. For further technical details please

contact your dedicated E by SIPLACE distribu-

tor.

Bowl Feeder

SIPLACE Vision

OnBoard Inspection and Pattern Matching

OnBoard Inspection

The OnBoard PCB Inspec-

tion (SW option) uses the

PCB camera to inspect criti-

cal areas of the board, spec-

ified by the user, e.g. under

BGA or shields just before or

after placement, to make

sure that all components

were placed or to make sure

that there are no objects in

the way of the placement

process.

It is also possible to inspect

the solder paste to make

sure that it is present. How-

ever, this must always be

performed at the first place-

ment machine, before any

placement begins.

A requirement for all inspec-

tion tasks is that a "good pat-

tern" has been saved before

starting.

Pattern Matching

Pattern matching can be

used for components with

very fine contact pads, which

can not be detected with the

existing component camera

resolution. Searching and

detection is performed over a

larger area, which contains

unique structures (patterns).

Once the specified area has

been detected, the compo-

nent is aligned and placed

according to the position of

this area and in relation to the

substrate.

SIPLACE Vision

PCB position recognition

Fiducial criteria

Locate 2 fiducials

Locate 3 fiducials

X-/Y-position, rotation angle, mean PCB distortion

Additional: shearing, distortion separately in X and Y direc-

tion

Fiducial shapes Synthetic fiducials: circle, cross, square, rectangle, dia-

mond, circular, square and rectangular contours, double

cross, pattern: any

Dimensions of patterns

Min. size

Max. size

0.5 mm

3 mm

Fiducial environment Clearance around reference fiducial not necessary if there

is no similar fiducial structure in the search area

Dimensions of synthetic fiducials

Min. X/Y size for circle and rectangle 0.25 mm

Min. X/Y size for annulus and rectangle 0.3 mm

Min. X/Y size for cross 0.3 mm

Min. X/Y size for double cross 0.5 mm

Min. X/Y size for diamond 0.35 mm

Min. frame width for annulus and rectangle 0.1 mm

Min. bar width / bar distance for cross, double-cross 0.1 mm

Max. X/Y size for all fiducial shapes 3 mm

Max. bar width for cross/double-cross 1.5 mm

Minimum tolerances generally 2% of nominal dimension

Max. tolerances generally 20% of nominal dimension