Specification E by SIPLACE 规格说明书.pdf - 第27页

27 Component Feeding Alternative SIPLACE Modules SIPLACE LDU E The SIPLACE LDU E is used for coating flip chips and CSP components with flux. The flux container slides with a linear movement over the dip plate and coats …

Component Feeding

Alternative SIPLACE Modules

SIPLACE StickFeeder E

The SIPLACE StickFeeder E for E by SIPLACE

can be used on any E by SIPLACE feeder table

and can setup any number of stick / tube.

The SIPLACE StickFeeder E also allows the

use of sticks/rails from old SIPLACE linear feed-

ers

The StickFeeder for E by SIPLACE will occupy

10 tracks on the feeder table.

1) Only works for sticks/rails that have been

checked by ASM SOKO.

Feeder Adaptor RO E

Label Feeder

Label Feeder (OEM Product)

Via a dedicated Feeder Adaptor RO E, the

Label Feeders ALF12 and ALF14 can be setup

and used on E by SIPLACE. For further techni-

cal details please visit http://label-feeder.com

and contact your dedicated E by SIPLACE dis-

tributor.

Feeder Adaptor RO E

The Feeder Adaptor RO E provides the neces-

sary interface to third party feeder, such as the

Label Feeder and Bowl Feeder. For further tech-

nical details please contact your dedicated E by

SIPLACE distributor.

SIPLACE Component

Reject Conveyor E

SIPLACE Component Reject Conveyor E

The SIPLACE Component Reject Conveyor E

is designed so that defective components (veri-

fied by placement machine vision system) are

placed onto conveyor belt and transferred out of

machine for operator retrieval. It is handled like

any other feeder for E by SIPLACE and can be

mounted onto its feeder tables.

Component Feeding

Alternative SIPLACE Modules

SIPLACE LDU E

The SIPLACE LDU E is used for coating flip

chips and CSP components with flux. The flux

container slides with a linear movement over

the dip plate and coats the cavity in the dip plate

with a layer of flux (predefined layer thickness).

The parameters for coating a component with

flux are prescribed in SIPLACE Pro.

The component is coated and then the flux layer

is renewed.

This sequence guarantees consistent process-

ing conditions for the components. The

SIPLACE LDU E is taken into account as an

independent feeder module type in the setup.

An implemented warming function allows the

viscosity of the flux to be altered. It occupies 9

locations of an 8 mm E feeder module.

SIPLACE LDU E

Bowl Feeder (OEM Product)

Via a single or multiple Feeder Adapter E, the

Bowl Feeders can be setup and used on E by

SIPLACE. For further technical details please

contact your dedicated E by SIPLACE distribu-

tor.

Bowl Feeder

SIPLACE Vision

OnBoard Inspection and Pattern Matching

OnBoard Inspection

The OnBoard PCB Inspec-

tion (SW option) uses the

PCB camera to inspect criti-

cal areas of the board, spec-

ified by the user, e.g. under

BGA or shields just before or

after placement, to make

sure that all components

were placed or to make sure

that there are no objects in

the way of the placement

process.

It is also possible to inspect

the solder paste to make

sure that it is present. How-

ever, this must always be

performed at the first place-

ment machine, before any

placement begins.

A requirement for all inspec-

tion tasks is that a "good pat-

tern" has been saved before

starting.

Pattern Matching

Pattern matching can be

used for components with

very fine contact pads, which

can not be detected with the

existing component camera

resolution. Searching and

detection is performed over a

larger area, which contains

unique structures (patterns).

Once the specified area has

been detected, the compo-

nent is aligned and placed

according to the position of

this area and in relation to the

substrate.