AQ-2 spec book LR.pdf - 第11页

General Specifica tions 9 of 44 2.5 C omponent v ision F igure 5 T he Component vision (CV) system is used f or the alignment of components on leads , edges or bumps. C omponent Alignment is achieved by moving the placem…

2.4 Placement

head

Both placement heads are equipped with Z-height, phi-rotation and real time force

control. It can pick, rotate and place any component within the work area of the AQ-2.

Component pick-up and detection is done using a vacuum nozzle or a gripper.

Component presence as well as the relative position will be checked by the component

vision system. When placing through-hole components the AQ-2 can detect bent leads

using “variable through hole check”. If leads are bent the placement head will measure a

resistance force when a lead touches the PCB. If the force exceeds the programmable

limit (between 4 and 14 N) the AQ-2 will reject the component. Nozzles and grippers can

be automatically exchanged with the toolbit exchange unit configured on the machine

base between feeder interface and workarea.

Placement head

General Specifications

8 of 44

Figure 4

Maximum stroke 77mm

Phi resolution 0.0072 degree

Placement force Inner nozzles: 1.5N ± 0.3N (Fixed)

Outer nozzles: 4-40N (programmable in 0.1N increments)

Flip chip nozzles: 0.9-3.5N (programmable in 0.1N increments)

Variable through hole Programmable between 4 and 14 N

check

Placement head

Table 3

General Specifications

9 of 44

2.5 Component

vision

Figure 5

The Component vision (CV) system is used for the alignment of components on leads,

edges or bumps. Component Alignment is achieved by moving the placement head

above the lens of an upward-facing CV camera. A combination of multiple light sources

ensure sufficient contrast between the component (leads) and the background. Utilizing

these light sources (back light, dark field, mid field and bright field illumination) the

AQ-2 is capable of aligning almost any component. The illumination intensity is

automatically chosen based upon the reflectivity of the respective components. The CV

camera can determine the position of the component with respect to a reference plate.

The deviations, together with the fiducial alignment values, will be used to determine

the correct placement position.

There are two different component vision systems available for the AQ-2.

• The Component vision Large Field of View (LFOV) is used to align and inspect a wide

range of components up to 45 x45 mm or 66 x 23 mm with bump or lead width down

to 150 micron. It is also possible to inspect larger components but this can be done with

the component slightly above the focal plane of the camera allowing to inspect

components up to 165 x 45mm.

• The Component vision Small Field of View (CV SFOV) is used for ultra fine pitch

components like CSPs and flip chips. By use of a smaller field of view (22x22mm) a

higher accuracy can be achieved which is required for this type of components.

Components with bumps down to 80 micron with a 160 micron pitch can be measured.

Component vision modules

X-axis Y-axis Width Pitch Width Pitch

CV LFOV (mm) 45 45 0.150 0.300 0.150 0.300

CV SFOV (mm) 22 22 0.080 0.160 0.080 0.160

Component

vision Maximum component size Lead Bump

Table 4

Note: Component and lead dimensions above or below the noted specification require

an application review.

Note: Components larger than the noted field of view can be processed. For instance, the

CV LFOV can measure a 165mm long connector, however some restrictions may apply.

Also components of 66x23mm (or 23x66mm) can be measured in one view.

General Specifications

10 of 44

2.6 Board

alignment

Table 5

Figure 6

The digital Board Alignment (BA) camera (mounted on the H-Drive manipulator) is used

to improve the placement accuracy of the component with respect to the board by

measuring the global and/or local board fiducials or specific artwork features.

For PCBs that have no fiducials at all, the AQ-2 can make use of artwork recognition. The

board alignment camera can measure a specific part of the artwork of the PCB and

calculate the centre of that specific part of the PCB. For example, solder pads of a IC or

BGA can be used in this case.

Potential deviations (translation, rotation) are calculated with the data of the servo-

systems of the manipulator. The Board alignment system can also be used for bad mark

sensing. Board alignment is achieved by projecting light on the PCB and measuring the

intensity of the reflection with the use of a downward-facing camera.The dark surface of

the PCB only reflects a small amount of light. Traces of white copper or solder (lead)

reflect the light strongly. This contrast makes it possible to determine the position of the

substrate (fiducial or artwork marks). At least two points are required on the board to

determine its position. To achieve the highest accuracy, board stretch must be measured

and this requires at least three fiducials. Any fiducials or artwork, with sufficient

contrast, can be used.

Board alignment

Fiducial size (min.) 0.1mm

(max.) 4.0mm

Tolerance 20% of nominal

Clearance 2 x diameter of fiducial

Minimum contrast level 30%

Samples of fiducial markers

Sample of artwork

Figure 7