AQ-2 spec book LR.pdf - 第37页
Placement accuracy & reliability Placement process capacibility Cpk >1.33 Accuracy X,Y 25 µm @ 4 Sigma Placement reliability < 3 ppm Co mponent pick per formance > 99.9% Machine stops < 500 ppm T echnical…
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•Full graphical edition of board data which allows the user to enter missing
product data and manufacturing related features such as fiducials, board and
panel outlines, image offsets and mechanical parts. Support for multiple master
badmarks and circuit arrangements.
• Ability to manage the factory configuration Management using the familiar
Explorer view to manage factory, machines, line configurations and tooling
inventory.
•Can be used to calculate “what-if” analysis with user configured line models.
•Export to SVS-Pro provides offline feeder set-up ready for the next production
batch.
PPS System requirements
The PPS-Pro software is NOT delivered with a computer. Assembléon advises the
following configuration:
Hardware
• Minimum Pentium IV or better, > 2,4 GHz
• 512 Mb internal memory
• 3.5” disk + CD-ROM drive
• Free hard disk space 1 Gb
• Monitor and video card that support at least 800x600x256
Software
• Windows XP
Figure 29
PPS Pro Graphical User Interface
Options
Placement accuracy & reliability
Placement process capacibility Cpk >1.33
Accuracy X,Y 25 µm @ 4 Sigma
Placement reliability < 3 ppm
Component pick performance > 99.9%
Machine stops < 500 ppm
Technical uptime > 99.5%
Average lifetime nozzle 2 million components
Average lifetime placement head 25 million components
4.0 Technical
specifications
4.1 Placement
accuracy &
reliability
Table 25
4.2 Flexibility
Table 26
Technical specifications
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Flexibility
Feeder set-up change over < 3 min.
Exchange nozzle Manual < 30 sec.
Automatic via toolbit exchange < 1.5 sec.
Average time for generation placement programs
(can be done off-line) < 30 min.
Reconfiguring the system Toolbit exchange unit < 5 min.
Components vision unit < 5 min.
Amount of feeder positions max. 48 tape feeder
positions or max. 188
JEDEC trays
Note: Accuracy testing with glass plate, using the component vision (CV SFOV) and a CSP
of 6mm square (n=30) with process specification limit of 25 µm; all values are X, Y and
combined.
Placement output
Component placement 0.68 sec./comp or 5300 UPH
uBGA, CSP, Flip Chip 1.02 sec./comp or 3530 UPH
IC placement 1.07 sec./comp or 3350 UPH
QFP placement 1.07 sec./comp or 3350 UPH
Odds & connectors 1.07 sec./comp or 3350 UPH
Note: AQ-2 output is calculated at best conditions. This excludes board transfer, board
alignment and badmark sense times.
Circuit boards
Board size (max) (L x W) 508 x 460 mm
Board size (min) (L x W) 50 x 50 mm
Board thickness 0.4 - 7 mm for PCB transport
0.4 - 11 mm for Auer boat transport
Pre mounted components Top side: < 25 mm
Bottom side: < 45 mm
Typical board exchange time < 1.9 sec transport;
< 1.5 sec alignment (3 fiducials)
Tolerances L/W ±0.5mm
Maximum L/W-ratio 1/3
Flatness Topside: bow max 0.6% of diagonal to max 1 mm,
bottom side: sag max 5 mm
Mass < 3 kg
Clearance 3mm free of SMD’s at two sides parallel at
direction of transportation for PCB transport
5 mm free of SMD’s at two sides parallel at
direction of transportation for Auer boat transport
4.3 Placement
output
Table 27
4.4 Circuit
boards
Table 28
Technical specifications
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