AQ-2 spec book LR.pdf - 第19页

General Specifica tions 17 of 44 User benefits • Based on ITF2 8mm design. Occupies only one feeder slot . User benefits • Suppor t of 2”x2” and 4”x4” waffle packs • Easy load and unload of waffle pack s • Operation ef f…

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General Specifications
16 of 44
Tray stacker
Supported tray type JEDEC-95-1, IEC 60286-5
Number of thin trays 30
Number of thick trays 20
Number of different components 1
Loading mechanism Stacked trays (no pallets)
Loading time ~ 10 seconds for 20 or 30 trays
Unloading time < 5 seconds for up to 30 trays
Tray exchange time ~ 4 seconds in standard mode
Mode settings (Speed) Standard and slow
Feeder slots 11
User benefits
• Fast and accurate presentation of pre-printed labels
• More economical than manual applied labels
• The exchangeable label module allows the feeder to present a variety of label types
Label feeder
Label types Pre-Printed labels
Label presenter Detachable, specific to label
liner width and label length
Advance rate 53mm/sec (2.1 inch/sec)
Pick point repeatability ± 0.25mm (± 0.010 inch)
Feeder slots 5
Table 9
3.1.5 Label feeders
Figure 13
Table 10
General Specifications
17 of 44
User benefits
• Based on ITF2 8mm design. Occupies only one feeder slot.
User benefits
• Support of 2”x2” and 4”x4” waffle packs
• Easy load and unload of waffle packs
• Operation efficient due to low operator interaction
• Automatic waffle pack loading and eject
• Waffles loaded as a stack rather than on pallets
3.1.6 Advanced
packaging
feeders
3.1.6.1 Surftape
feeding
3.1.6.2 Waffle pack
feeding
Surftape feeder
Surftape width 8mm (Standard or Surftape XF®
Maximum die size 2.5mm (Longest edge length)
Minimum die size 0.3mm (Shortest edge length)
Die presentation Chip on board (Bumps up)
Figure 14
Figure 15
Table 11
Direct die feeder
Die size 0.5mm to 10mm
Minimum die thickness 0.05mm minimum thickness
Die delivery rate Flip chip : 3000 die per hour
Wire-bond : 3600 die per hour
Burst mode : 6 die per second
Machine vision Pattern matching, corner
detection, inkt dot and BGA
bump recognition.
General Specifications
18 of 44
Waffle pack feeding 2” x 2” 4” x 4”
Maximum number of waffle packs 50 (45 20
recommended)
Minimum die size (shortest edge length) 1mm 1.27mm
Maximum die size (longest edge length) Limited by Limited by
system system
capabilities capabilities
Slot occupation 6 10
Waffle index time < 3 sec < 4 sec
Approximate manual loading / unloading time ~ 10 sec ~ 10 sec
(per maximum number of waffle packs)
3.1.6.3 Direct die
feeding
User benefits
• Bare die product directly picked from wafer
• Eliminates all taping costs
• Uses threshold and pattern matching to select only qualified die for picking
• Supports flip-chip or wire bond
• Two versions: Shuttle (small and thin bare die products) and Conveyor (thicker and
larger bare die products)
Table 12
Table 13